JP4607194B2 - 電気回路の回路素子を、該回路素子がその上に搭載される基板とカバーシートとの間に、密封するための装置 - Google Patents

電気回路の回路素子を、該回路素子がその上に搭載される基板とカバーシートとの間に、密封するための装置 Download PDF

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Publication number
JP4607194B2
JP4607194B2 JP2007554152A JP2007554152A JP4607194B2 JP 4607194 B2 JP4607194 B2 JP 4607194B2 JP 2007554152 A JP2007554152 A JP 2007554152A JP 2007554152 A JP2007554152 A JP 2007554152A JP 4607194 B2 JP4607194 B2 JP 4607194B2
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Japan
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substrate
cover sheet
support
press
conduit
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Expired - Fee Related
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JP2007554152A
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Japanese (ja)
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JP2008538855A (ja
JP2008538855A5 (enExample
Inventor
ダブリュ シンジン スミス，シー
エム ニュートン，チャールズ
ビー ジェインズ，ポール
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Harris Corp
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Harris Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Liquid Crystal (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2007554152A 2005-02-03 2006-01-31 電気回路の回路素子を、該回路素子がその上に搭載される基板とカバーシートとの間に、密封するための装置 Expired - Fee Related JP4607194B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/050,303 US7128801B2 (en) 2005-02-03 2005-02-03 Method and apparatus for sealing flex circuits having heat sensitive circuit elements
PCT/US2006/003245 WO2006083773A2 (en) 2005-02-03 2006-01-31 Method and apparatus for sealing flex circuits having heat sensitive circuit elements

Publications (3)

Publication Number Publication Date
JP2008538855A JP2008538855A (ja) 2008-11-06
JP2008538855A5 JP2008538855A5 (enExample) 2008-12-18
JP4607194B2 true JP4607194B2 (ja) 2011-01-05

Family

ID=36755257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007554152A Expired - Fee Related JP4607194B2 (ja) 2005-02-03 2006-01-31 電気回路の回路素子を、該回路素子がその上に搭載される基板とカバーシートとの間に、密封するための装置

Country Status (7)

Country Link
US (2) US7128801B2 (enExample)
EP (1) EP1848578B1 (enExample)
JP (1) JP4607194B2 (enExample)
KR (1) KR100902436B1 (enExample)
CN (1) CN101146665B (enExample)
CA (1) CA2596440C (enExample)
WO (1) WO2006083773A2 (enExample)

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EP1972289B1 (en) 2007-03-23 2018-10-17 coLigne AG Elongated stabilization member and bone anchor useful in bone and especially spinal repair processes
US20090011192A1 (en) * 2007-07-03 2009-01-08 John Tomczyk Method, system, and apparatus for producing dimensional image articles utilizing a cushioning assembly
US8014167B2 (en) * 2007-09-07 2011-09-06 Seagate Technology Llc Liquid crystal material sealed housing
US20090105532A1 (en) * 2007-10-22 2009-04-23 Zvika Gilad In vivo imaging device and method of manufacturing thereof
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
US8231692B2 (en) * 2008-11-06 2012-07-31 International Business Machines Corporation Method for manufacturing an electronic device
US8279552B2 (en) * 2010-06-22 2012-10-02 Hitachi Global Storage Technologies, Netherlands B.V. Hermetically sealing a hard disk drive
EP2540500B1 (de) 2011-06-28 2016-10-26 Actilor Intellectual Asset AG Laminationsvorrichtung und -verfahren für Folien mit temperaturempfindlichen Elementen sowie damit hergestellte Dokumente
AU2014228643A1 (en) 2013-03-12 2015-10-15 Cardiac Pacemakers, Inc. Implantable medical device and assembly thereof
WO2015027348A1 (en) * 2013-08-29 2015-03-05 Jaquet Technology Group Ag Sensor device for determining rotational speed of a rotatable object and turbocharger with such a sensor device
US9282650B2 (en) * 2013-12-18 2016-03-08 Intel Corporation Thermal compression bonding process cooling manifold
US10192847B2 (en) * 2014-06-12 2019-01-29 Asm Technology Singapore Pte Ltd Rapid cooling system for a bond head heater
US12490387B2 (en) * 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
JPS51109036A (ja) * 1975-03-20 1976-09-27 Yasuo Saito Ototsumennopuresusetsuchakusochi
DE3611839A1 (de) * 1986-04-09 1987-10-15 Siempelkamp Gmbh & Co Verfahren zum herstellen einer durch ein fluides medium beheizbaren pressenplatte
JP2787581B2 (ja) * 1988-10-31 1998-08-20 株式会社小松製作所 プラスチック圧縮成形機の温度調節装置
JP3230833B2 (ja) * 1992-03-27 2001-11-19 日立テクノエンジニアリング株式会社 ホットプレス
JP2001501547A (ja) 1992-06-12 2001-02-06 アルミナム カンパニー オブ アメリカ 非平面を有する多層構造の製造方法
JPH07195391A (ja) * 1993-12-28 1995-08-01 Hitachi Techno Eng Co Ltd ホットプレス
JPH07242085A (ja) * 1994-03-01 1995-09-19 Mitsubishi Electric Corp Ｉｃカードの製造方法及びｉｃカード
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US20020079053A1 (en) * 1994-09-21 2002-06-27 Yamauchi Corporation Cushioning material for forming press
US6320257B1 (en) * 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
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Also Published As

Publication number Publication date
CN101146665A (zh) 2008-03-19
KR100902436B1 (ko) 2009-06-11
KR20070092324A (ko) 2007-09-12
WO2006083773A2 (en) 2006-08-10
CA2596440A1 (en) 2009-08-10
EP1848578B1 (en) 2011-09-07
JP2008538855A (ja) 2008-11-06
US20060286189A1 (en) 2006-12-21
WO2006083773A3 (en) 2006-12-21
US20060169405A1 (en) 2006-08-03
EP1848578A2 (en) 2007-10-31
EP1848578A4 (en) 2010-09-22
US7128801B2 (en) 2006-10-31
US7591924B2 (en) 2009-09-22
CA2596440C (en) 2010-12-14
CN101146665B (zh) 2010-11-10

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