CA2596440C - Method and apparatus for sealing flex circuits having heat sensitive circuit elements - Google Patents

Method and apparatus for sealing flex circuits having heat sensitive circuit elements Download PDF

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Publication number
CA2596440C
CA2596440C CA2596440A CA2596440A CA2596440C CA 2596440 C CA2596440 C CA 2596440C CA 2596440 A CA2596440 A CA 2596440A CA 2596440 A CA2596440 A CA 2596440A CA 2596440 C CA2596440 C CA 2596440C
Authority
CA
Canada
Prior art keywords
circuit elements
substrate
press
conduits
cooling fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2596440A
Other languages
English (en)
French (fr)
Other versions
CA2596440A1 (en
Inventor
C. W. Sinjin Smith
Charles M. Newton
Paul B. Jaynes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of CA2596440A1 publication Critical patent/CA2596440A1/en
Application granted granted Critical
Publication of CA2596440C publication Critical patent/CA2596440C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Liquid Crystal (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CA2596440A 2005-02-03 2006-01-31 Method and apparatus for sealing flex circuits having heat sensitive circuit elements Expired - Fee Related CA2596440C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/050,303 US7128801B2 (en) 2005-02-03 2005-02-03 Method and apparatus for sealing flex circuits having heat sensitive circuit elements
US11/050,303 2005-02-03
PCT/US2006/003245 WO2006083773A2 (en) 2005-02-03 2006-01-31 Method and apparatus for sealing flex circuits having heat sensitive circuit elements

Publications (2)

Publication Number Publication Date
CA2596440A1 CA2596440A1 (en) 2009-08-10
CA2596440C true CA2596440C (en) 2010-12-14

Family

ID=36755257

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2596440A Expired - Fee Related CA2596440C (en) 2005-02-03 2006-01-31 Method and apparatus for sealing flex circuits having heat sensitive circuit elements

Country Status (7)

Country Link
US (2) US7128801B2 (enExample)
EP (1) EP1848578B1 (enExample)
JP (1) JP4607194B2 (enExample)
KR (1) KR100902436B1 (enExample)
CN (1) CN101146665B (enExample)
CA (1) CA2596440C (enExample)
WO (1) WO2006083773A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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EP1972289B1 (en) 2007-03-23 2018-10-17 coLigne AG Elongated stabilization member and bone anchor useful in bone and especially spinal repair processes
US20090011192A1 (en) * 2007-07-03 2009-01-08 John Tomczyk Method, system, and apparatus for producing dimensional image articles utilizing a cushioning assembly
US8014167B2 (en) * 2007-09-07 2011-09-06 Seagate Technology Llc Liquid crystal material sealed housing
US20090105532A1 (en) * 2007-10-22 2009-04-23 Zvika Gilad In vivo imaging device and method of manufacturing thereof
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
US8231692B2 (en) * 2008-11-06 2012-07-31 International Business Machines Corporation Method for manufacturing an electronic device
US8279552B2 (en) * 2010-06-22 2012-10-02 Hitachi Global Storage Technologies, Netherlands B.V. Hermetically sealing a hard disk drive
PL2540500T3 (pl) 2011-06-28 2017-05-31 Actilor Intellectual Asset Ag Urządzenie laminujące oraz sposób laminowania dla folii zawierających elementy wrażliwe na temperaturę, jak również dokumenty wytworzone za pomocą powyższych
EP3446748B1 (en) 2013-03-12 2019-10-23 Cardiac Pacemakers, Inc. Implantable medical device and assembly thereof
US10379134B2 (en) * 2013-08-29 2019-08-13 Jaquet Technology Group Ag Sensor device for determining rotational speed of a rotatable object and turbocharger with such a sensor device
US9282650B2 (en) * 2013-12-18 2016-03-08 Intel Corporation Thermal compression bonding process cooling manifold
US10192847B2 (en) * 2014-06-12 2019-01-29 Asm Technology Singapore Pte Ltd Rapid cooling system for a bond head heater
US12490387B2 (en) * 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
JPS51109036A (ja) * 1975-03-20 1976-09-27 Yasuo Saito Ototsumennopuresusetsuchakusochi
DE3611839A1 (de) * 1986-04-09 1987-10-15 Siempelkamp Gmbh & Co Verfahren zum herstellen einer durch ein fluides medium beheizbaren pressenplatte
JP2787581B2 (ja) * 1988-10-31 1998-08-20 株式会社小松製作所 プラスチック圧縮成形機の温度調節装置
JP3230833B2 (ja) * 1992-03-27 2001-11-19 日立テクノエンジニアリング株式会社 ホットプレス
AU4531793A (en) 1992-06-12 1994-01-04 Aluminum Company Of America Method of fabricating multilayer structures with nonplanar surfaces
JPH07195391A (ja) * 1993-12-28 1995-08-01 Hitachi Techno Eng Co Ltd ホットプレス
JPH07242085A (ja) * 1994-03-01 1995-09-19 Mitsubishi Electric Corp Ｉｃカードの製造方法及びｉｃカード
US5827999A (en) 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US20020079053A1 (en) * 1994-09-21 2002-06-27 Yamauchi Corporation Cushioning material for forming press
US6320257B1 (en) 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
US5993593A (en) * 1996-12-03 1999-11-30 Heat Sealing Technology, Inc. High-temperature, heat-sealed products and methods and means for their manufacture
US6110321A (en) * 1997-02-28 2000-08-29 General Electric Company Method for sealing an ultracapacitor, and related articles
JP3098003B2 (ja) * 1998-09-24 2000-10-10 日清紡績株式会社 太陽電池におけるラミネート装置
JP2000117493A (ja) * 1998-10-15 2000-04-25 Kitagawa Elaborate Mach Co Ltd 熱圧プレス装置における定盤冷却システム
JP4138995B2 (ja) * 1999-03-31 2008-08-27 株式会社クラレ 回路基板およびその製造方法
DE19920577C1 (de) * 1999-05-04 2001-01-04 Wemhoener Heinrich Gmbh Co Membranpresse
JP2004516662A (ja) 2000-12-14 2004-06-03 ワールド・プロパティーズ・インコーポレイテッド 液晶ポリマー接着層および該接着層から形成された回路
JP2002217523A (ja) * 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
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Also Published As

Publication number Publication date
EP1848578A4 (en) 2010-09-22
WO2006083773A2 (en) 2006-08-10
US7591924B2 (en) 2009-09-22
JP2008538855A (ja) 2008-11-06
US7128801B2 (en) 2006-10-31
CA2596440A1 (en) 2009-08-10
US20060286189A1 (en) 2006-12-21
EP1848578B1 (en) 2011-09-07
KR100902436B1 (ko) 2009-06-11
WO2006083773A3 (en) 2006-12-21
CN101146665A (zh) 2008-03-19
CN101146665B (zh) 2010-11-10
JP4607194B2 (ja) 2011-01-05
KR20070092324A (ko) 2007-09-12
US20060169405A1 (en) 2006-08-03
EP1848578A2 (en) 2007-10-31

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Effective date: 20170131