CN101146665B - 用于密封具有热敏电路元件的柔性电路的方法和设备 - Google Patents

用于密封具有热敏电路元件的柔性电路的方法和设备 Download PDF

Info

Publication number
CN101146665B
CN101146665B CN2006800073646A CN200680007364A CN101146665B CN 101146665 B CN101146665 B CN 101146665B CN 2006800073646 A CN2006800073646 A CN 2006800073646A CN 200680007364 A CN200680007364 A CN 200680007364A CN 101146665 B CN101146665 B CN 101146665B
Authority
CN
China
Prior art keywords
substrate
top plate
press
cover layer
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800073646A
Other languages
English (en)
Chinese (zh)
Other versions
CN101146665A (zh
Inventor
C·W·辛金·史密斯
C·M·牛顿
P·B·杰恩斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harrier Inc
Original Assignee
Harrier Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harrier Inc filed Critical Harrier Inc
Publication of CN101146665A publication Critical patent/CN101146665A/zh
Application granted granted Critical
Publication of CN101146665B publication Critical patent/CN101146665B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Liquid Crystal (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2006800073646A 2005-02-03 2006-01-31 用于密封具有热敏电路元件的柔性电路的方法和设备 Expired - Fee Related CN101146665B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/050,303 US7128801B2 (en) 2005-02-03 2005-02-03 Method and apparatus for sealing flex circuits having heat sensitive circuit elements
US11/050,303 2005-02-03
PCT/US2006/003245 WO2006083773A2 (en) 2005-02-03 2006-01-31 Method and apparatus for sealing flex circuits having heat sensitive circuit elements

Publications (2)

Publication Number Publication Date
CN101146665A CN101146665A (zh) 2008-03-19
CN101146665B true CN101146665B (zh) 2010-11-10

Family

ID=36755257

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800073646A Expired - Fee Related CN101146665B (zh) 2005-02-03 2006-01-31 用于密封具有热敏电路元件的柔性电路的方法和设备

Country Status (7)

Country Link
US (2) US7128801B2 (enExample)
EP (1) EP1848578B1 (enExample)
JP (1) JP4607194B2 (enExample)
KR (1) KR100902436B1 (enExample)
CN (1) CN101146665B (enExample)
CA (1) CA2596440C (enExample)
WO (1) WO2006083773A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1972289B1 (en) 2007-03-23 2018-10-17 coLigne AG Elongated stabilization member and bone anchor useful in bone and especially spinal repair processes
US20090011192A1 (en) * 2007-07-03 2009-01-08 John Tomczyk Method, system, and apparatus for producing dimensional image articles utilizing a cushioning assembly
US8014167B2 (en) * 2007-09-07 2011-09-06 Seagate Technology Llc Liquid crystal material sealed housing
US20090105532A1 (en) * 2007-10-22 2009-04-23 Zvika Gilad In vivo imaging device and method of manufacturing thereof
US20090188105A1 (en) * 2008-01-28 2009-07-30 Ming-Chin Chien Slim battery packaging method
US8231692B2 (en) * 2008-11-06 2012-07-31 International Business Machines Corporation Method for manufacturing an electronic device
US8279552B2 (en) * 2010-06-22 2012-10-02 Hitachi Global Storage Technologies, Netherlands B.V. Hermetically sealing a hard disk drive
PL2540500T3 (pl) 2011-06-28 2017-05-31 Actilor Intellectual Asset Ag Urządzenie laminujące oraz sposób laminowania dla folii zawierających elementy wrażliwe na temperaturę, jak również dokumenty wytworzone za pomocą powyższych
EP3446748B1 (en) 2013-03-12 2019-10-23 Cardiac Pacemakers, Inc. Implantable medical device and assembly thereof
US10379134B2 (en) * 2013-08-29 2019-08-13 Jaquet Technology Group Ag Sensor device for determining rotational speed of a rotatable object and turbocharger with such a sensor device
US9282650B2 (en) * 2013-12-18 2016-03-08 Intel Corporation Thermal compression bonding process cooling manifold
US10192847B2 (en) * 2014-06-12 2019-01-29 Asm Technology Singapore Pte Ltd Rapid cooling system for a bond head heater
US12490387B2 (en) * 2019-02-18 2025-12-02 Jabil Inc. Adhesive circuit patterning process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573622A (en) 1992-06-12 1996-11-12 Aluminum Company Of America Apparatus for fabricating multilayer structures
US5993593A (en) * 1996-12-03 1999-11-30 Heat Sealing Technology, Inc. High-temperature, heat-sealed products and methods and means for their manufacture

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109036A (ja) * 1975-03-20 1976-09-27 Yasuo Saito Ototsumennopuresusetsuchakusochi
DE3611839A1 (de) * 1986-04-09 1987-10-15 Siempelkamp Gmbh & Co Verfahren zum herstellen einer durch ein fluides medium beheizbaren pressenplatte
JP2787581B2 (ja) * 1988-10-31 1998-08-20 株式会社小松製作所 プラスチック圧縮成形機の温度調節装置
JP3230833B2 (ja) * 1992-03-27 2001-11-19 日立テクノエンジニアリング株式会社 ホットプレス
JPH07195391A (ja) * 1993-12-28 1995-08-01 Hitachi Techno Eng Co Ltd ホットプレス
JPH07242085A (ja) * 1994-03-01 1995-09-19 Mitsubishi Electric Corp Ｉｃカードの製造方法及びｉｃカード
US5827999A (en) 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US20020079053A1 (en) * 1994-09-21 2002-06-27 Yamauchi Corporation Cushioning material for forming press
US6320257B1 (en) 1994-09-27 2001-11-20 Foster-Miller, Inc. Chip packaging technique
US6110321A (en) * 1997-02-28 2000-08-29 General Electric Company Method for sealing an ultracapacitor, and related articles
JP3098003B2 (ja) * 1998-09-24 2000-10-10 日清紡績株式会社 太陽電池におけるラミネート装置
JP2000117493A (ja) * 1998-10-15 2000-04-25 Kitagawa Elaborate Mach Co Ltd 熱圧プレス装置における定盤冷却システム
JP4138995B2 (ja) * 1999-03-31 2008-08-27 株式会社クラレ 回路基板およびその製造方法
DE19920577C1 (de) * 1999-05-04 2001-01-04 Wemhoener Heinrich Gmbh Co Membranpresse
JP2004516662A (ja) 2000-12-14 2004-06-03 ワールド・プロパティーズ・インコーポレイテッド 液晶ポリマー接着層および該接着層から形成された回路
JP2002217523A (ja) * 2001-01-23 2002-08-02 Tdk Corp 電子装置の製造方法
JP4513235B2 (ja) * 2001-05-31 2010-07-28 ソニー株式会社 フリップチップ実装装置
US6675852B2 (en) * 2001-06-15 2004-01-13 International Business Machines Corporation Platen for use in laminating press
US6977187B2 (en) 2002-06-19 2005-12-20 Foster-Miller, Inc. Chip package sealing method
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573622A (en) 1992-06-12 1996-11-12 Aluminum Company Of America Apparatus for fabricating multilayer structures
US5993593A (en) * 1996-12-03 1999-11-30 Heat Sealing Technology, Inc. High-temperature, heat-sealed products and methods and means for their manufacture

Also Published As

Publication number Publication date
EP1848578A4 (en) 2010-09-22
WO2006083773A2 (en) 2006-08-10
US7591924B2 (en) 2009-09-22
JP2008538855A (ja) 2008-11-06
US7128801B2 (en) 2006-10-31
CA2596440A1 (en) 2009-08-10
US20060286189A1 (en) 2006-12-21
EP1848578B1 (en) 2011-09-07
CA2596440C (en) 2010-12-14
KR100902436B1 (ko) 2009-06-11
WO2006083773A3 (en) 2006-12-21
CN101146665A (zh) 2008-03-19
JP4607194B2 (ja) 2011-01-05
KR20070092324A (ko) 2007-09-12
US20060169405A1 (en) 2006-08-03
EP1848578A2 (en) 2007-10-31

Similar Documents

Publication Publication Date Title
CN101146665B (zh) 用于密封具有热敏电路元件的柔性电路的方法和设备
JP3790724B2 (ja) 積層装置および積層方法
US6499644B2 (en) Rework and underfill nozzle for electronic components
US7278549B2 (en) Remedies to prevent cracking in a liquid system
KR101718521B1 (ko) 적층 안전 유리의 제조장치 및 그 제조방법
TW200813695A (en) Integrated liquid to air conduction module
TW201135802A (en) Pressure applying module, pressure applying apparatus, and substrate bonding apparatus
JPH10315257A (ja) 真空積層装置および真空積層方法
WO2004054007A2 (en) Thermoelectric heat pumps
JP2008538855A5 (enExample)
JP5299837B2 (ja) 支持装置、加熱加圧装置及び加熱加圧方法
KR960011853B1 (ko) 중합체막 오버레이층을 이용한 집적회로칩 패키징 방법 및 장치
JP4607183B2 (ja) 回路素子をカバーシートと可撓基板との間に封止する装置
JP6362869B2 (ja) 熱分散装置、修理および接合の方法
US10912227B2 (en) Methods, systems, and assemblies for cooling an electronic component
JP2003039199A (ja) 基板プレス装置
JP3805907B2 (ja) 温度制御装置
JP2009039959A (ja) 平板ラミネート装置
JPH10175229A (ja) 真空積層装置
US20070235144A1 (en) Thermopressing device for fabricating a fuel cell

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101110

Termination date: 20130131