JP2007515781A5 - - Google Patents

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Publication number
JP2007515781A5
JP2007515781A5 JP2006532812A JP2006532812A JP2007515781A5 JP 2007515781 A5 JP2007515781 A5 JP 2007515781A5 JP 2006532812 A JP2006532812 A JP 2006532812A JP 2006532812 A JP2006532812 A JP 2006532812A JP 2007515781 A5 JP2007515781 A5 JP 2007515781A5
Authority
JP
Japan
Prior art keywords
chuck
workpiece
heat transfer
cooling device
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006532812A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007515781A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/014093 external-priority patent/WO2004102640A1/en
Publication of JP2007515781A publication Critical patent/JP2007515781A/ja
Publication of JP2007515781A5 publication Critical patent/JP2007515781A5/ja
Pending legal-status Critical Current

Links

JP2006532812A 2003-05-07 2004-05-06 広範囲温度チャック装置 Pending JP2007515781A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46905003P 2003-05-07 2003-05-07
PCT/US2004/014093 WO2004102640A1 (en) 2003-05-07 2004-05-06 Wide temperature range chuck system

Publications (2)

Publication Number Publication Date
JP2007515781A JP2007515781A (ja) 2007-06-14
JP2007515781A5 true JP2007515781A5 (enExample) 2007-07-26

Family

ID=33452253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006532812A Pending JP2007515781A (ja) 2003-05-07 2004-05-06 広範囲温度チャック装置

Country Status (8)

Country Link
US (1) US20050008983A1 (enExample)
EP (1) EP1623452B1 (enExample)
JP (1) JP2007515781A (enExample)
KR (1) KR20060038925A (enExample)
CN (1) CN100444308C (enExample)
DE (1) DE602004003365T2 (enExample)
TW (1) TW200428468A (enExample)
WO (1) WO2004102640A1 (enExample)

Families Citing this family (23)

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Publication number Priority date Publication date Assignee Title
KR100459788B1 (ko) * 2002-01-14 2004-12-04 주성엔지니어링(주) 2단 웨이퍼 리프트 핀
US8193096B2 (en) 2004-12-13 2012-06-05 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
JP5040913B2 (ja) * 2006-03-31 2012-10-03 富士通セミコンダクター株式会社 半導体装置の製造方法
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US7528391B2 (en) 2006-12-22 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for reducing contamination during ion implantation
JP4949091B2 (ja) * 2007-03-16 2012-06-06 東京エレクトロン株式会社 基板処理装置、基板処理方法および記録媒体
JP2008235315A (ja) * 2007-03-16 2008-10-02 Tokyo Electron Ltd 基板処理装置、基板処理方法および記録媒体
JP5262412B2 (ja) * 2008-08-07 2013-08-14 シンフォニアテクノロジー株式会社 真空処理装置
NL2004242A (en) 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
NL2004322A (en) * 2009-04-13 2010-10-14 Asml Netherlands Bv Cooling device, cooling arrangement and lithographic apparatus comprising a cooling arrangement.
US20110143548A1 (en) * 2009-12-11 2011-06-16 David Cheung Ultra low silicon loss high dose implant strip
JP5570938B2 (ja) * 2009-12-11 2014-08-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
FR2960816B1 (fr) * 2010-06-02 2012-07-13 Sidel Participations Four pour le conditionnement thermique de preformes et procede de commande d'un dispositif de refroidissement par air equipant un tel four
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
CN103426793B (zh) * 2012-05-24 2016-02-03 沈阳芯源微电子设备有限公司 基板冷热处理装置
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films
US12255123B2 (en) 2015-09-30 2025-03-18 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
JP6614933B2 (ja) * 2015-11-11 2019-12-04 東京エレクトロン株式会社 基板載置機構および基板処理装置
WO2017132461A1 (en) * 2016-01-28 2017-08-03 Corning Incorporated Processes for thermal strengthening of glass using liquid conduction
CN109417010B (zh) * 2016-06-02 2021-04-13 艾克塞利斯科技公司 加热或冷却晶片的设备及方法
US12420314B2 (en) * 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method
CN110911320B (zh) * 2019-12-09 2023-08-18 北京北方华创微电子装备有限公司 冷却装置及其控制方法、半导体加工设备
US11204206B2 (en) 2020-05-18 2021-12-21 Envertic Thermal Systems, Llc Thermal switch

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US3602687A (en) * 1969-06-23 1971-08-31 Battelle Development Corp Arc length control
US4609037A (en) * 1985-10-09 1986-09-02 Tencor Instruments Apparatus for heating and cooling articles
JP2987085B2 (ja) * 1995-06-28 1999-12-06 日本碍子株式会社 半導体ウエハー保持装置、その製造方法およびその使用方法
JPH0997830A (ja) * 1995-07-21 1997-04-08 Fuji Electric Co Ltd 静電チャックホールダ、ウエハ保持機構ならびにその使用方法
WO1997031389A1 (en) * 1996-02-23 1997-08-28 Tokyo Electron Limited Heat treatment device
JPH10294275A (ja) * 1997-04-17 1998-11-04 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法
DE69842191D1 (de) * 1997-11-05 2011-05-05 Tokyo Electron Ltd Halbleiterscheibenhaltevorrichtung
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6203657B1 (en) * 1998-03-31 2001-03-20 Lam Research Corporation Inductively coupled plasma downstream strip module
WO2000074117A1 (en) * 1999-05-27 2000-12-07 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
JP2001139379A (ja) * 1999-11-09 2001-05-22 Toshiba Ceramics Co Ltd 高熱伝導性窒化アルミニウム焼結体の製造方法
US6409932B2 (en) * 2000-04-03 2002-06-25 Matrix Integrated Systems, Inc. Method and apparatus for increased workpiece throughput
US6495802B1 (en) * 2001-05-31 2002-12-17 Motorola, Inc. Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control

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