TW200428468A - Wide temperature range chuck system - Google Patents

Wide temperature range chuck system Download PDF

Info

Publication number
TW200428468A
TW200428468A TW093112860A TW93112860A TW200428468A TW 200428468 A TW200428468 A TW 200428468A TW 093112860 A TW093112860 A TW 093112860A TW 93112860 A TW93112860 A TW 93112860A TW 200428468 A TW200428468 A TW 200428468A
Authority
TW
Taiwan
Prior art keywords
chuck
workpiece
patent application
scope
item
Prior art date
Application number
TW093112860A
Other languages
English (en)
Chinese (zh)
Inventor
Albert Wang
Original Assignee
Axcelis Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Tech Inc filed Critical Axcelis Tech Inc
Publication of TW200428468A publication Critical patent/TW200428468A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
TW093112860A 2003-05-07 2004-05-07 Wide temperature range chuck system TW200428468A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46905003P 2003-05-07 2003-05-07

Publications (1)

Publication Number Publication Date
TW200428468A true TW200428468A (en) 2004-12-16

Family

ID=33452253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112860A TW200428468A (en) 2003-05-07 2004-05-07 Wide temperature range chuck system

Country Status (8)

Country Link
US (1) US20050008983A1 (enExample)
EP (1) EP1623452B1 (enExample)
JP (1) JP2007515781A (enExample)
KR (1) KR20060038925A (enExample)
CN (1) CN100444308C (enExample)
DE (1) DE602004003365T2 (enExample)
TW (1) TW200428468A (enExample)
WO (1) WO2004102640A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745376B (zh) * 2016-06-02 2021-11-11 美商艾克塞利斯科技公司 離子植入系統及用於維持離子植入系統中之溫度一致性之方法

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KR100459788B1 (ko) * 2002-01-14 2004-12-04 주성엔지니어링(주) 2단 웨이퍼 리프트 핀
US8193096B2 (en) 2004-12-13 2012-06-05 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
WO2007116492A1 (ja) * 2006-03-31 2007-10-18 Fujitsu Microelectronics Limited 半導体装置の製造方法
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US7528391B2 (en) 2006-12-22 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for reducing contamination during ion implantation
JP4949091B2 (ja) * 2007-03-16 2012-06-06 東京エレクトロン株式会社 基板処理装置、基板処理方法および記録媒体
JP2008235315A (ja) * 2007-03-16 2008-10-02 Tokyo Electron Ltd 基板処理装置、基板処理方法および記録媒体
JP5262412B2 (ja) * 2008-08-07 2013-08-14 シンフォニアテクノロジー株式会社 真空処理装置
NL2004242A (en) 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
NL2004322A (en) * 2009-04-13 2010-10-14 Asml Netherlands Bv Cooling device, cooling arrangement and lithographic apparatus comprising a cooling arrangement.
JP5570938B2 (ja) * 2009-12-11 2014-08-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US20110143548A1 (en) * 2009-12-11 2011-06-16 David Cheung Ultra low silicon loss high dose implant strip
FR2960816B1 (fr) * 2010-06-02 2012-07-13 Sidel Participations Four pour le conditionnement thermique de preformes et procede de commande d'un dispositif de refroidissement par air equipant un tel four
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
CN103426793B (zh) * 2012-05-24 2016-02-03 沈阳芯源微电子设备有限公司 基板冷热处理装置
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films
US12255123B2 (en) 2015-09-30 2025-03-18 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
JP6614933B2 (ja) * 2015-11-11 2019-12-04 東京エレクトロン株式会社 基板載置機構および基板処理装置
JP2019507088A (ja) * 2016-01-28 2019-03-14 コーニング インコーポレイテッド 液体伝導を使用してガラスを熱的にテンパリングするための装置
US12420314B2 (en) * 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method
CN110911320B (zh) * 2019-12-09 2023-08-18 北京北方华创微电子装备有限公司 冷却装置及其控制方法、半导体加工设备
US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch

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US3602687A (en) * 1969-06-23 1971-08-31 Battelle Development Corp Arc length control
US4609037A (en) * 1985-10-09 1986-09-02 Tencor Instruments Apparatus for heating and cooling articles
JP2987085B2 (ja) * 1995-06-28 1999-12-06 日本碍子株式会社 半導体ウエハー保持装置、その製造方法およびその使用方法
JPH0997830A (ja) * 1995-07-21 1997-04-08 Fuji Electric Co Ltd 静電チャックホールダ、ウエハ保持機構ならびにその使用方法
KR100443415B1 (ko) * 1996-02-23 2004-11-03 동경 엘렉트론 주식회사 열처리장치
JPH10294275A (ja) * 1997-04-17 1998-11-04 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法
EP0915499B1 (en) * 1997-11-05 2011-03-23 Tokyo Electron Limited Semiconductor wafer holding apparatus
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6203657B1 (en) * 1998-03-31 2001-03-20 Lam Research Corporation Inductively coupled plasma downstream strip module
US6461801B1 (en) * 1999-05-27 2002-10-08 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
JP2001139379A (ja) * 1999-11-09 2001-05-22 Toshiba Ceramics Co Ltd 高熱伝導性窒化アルミニウム焼結体の製造方法
US6409932B2 (en) * 2000-04-03 2002-06-25 Matrix Integrated Systems, Inc. Method and apparatus for increased workpiece throughput
US6495802B1 (en) * 2001-05-31 2002-12-17 Motorola, Inc. Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI745376B (zh) * 2016-06-02 2021-11-11 美商艾克塞利斯科技公司 離子植入系統及用於維持離子植入系統中之溫度一致性之方法

Also Published As

Publication number Publication date
EP1623452B1 (en) 2006-11-22
JP2007515781A (ja) 2007-06-14
CN1784765A (zh) 2006-06-07
WO2004102640A1 (en) 2004-11-25
KR20060038925A (ko) 2006-05-04
DE602004003365T2 (de) 2007-09-13
US20050008983A1 (en) 2005-01-13
DE602004003365D1 (de) 2007-01-04
EP1623452A1 (en) 2006-02-08
CN100444308C (zh) 2008-12-17

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