JP2007515781A - 広範囲温度チャック装置 - Google Patents

広範囲温度チャック装置 Download PDF

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Publication number
JP2007515781A
JP2007515781A JP2006532812A JP2006532812A JP2007515781A JP 2007515781 A JP2007515781 A JP 2007515781A JP 2006532812 A JP2006532812 A JP 2006532812A JP 2006532812 A JP2006532812 A JP 2006532812A JP 2007515781 A JP2007515781 A JP 2007515781A
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JP
Japan
Prior art keywords
chuck
temperature
workpiece
heat transfer
hot
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Pending
Application number
JP2006532812A
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English (en)
Japanese (ja)
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JP2007515781A5 (enExample
Inventor
アルバート ワング，
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Axcelis Technologies Inc
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Axcelis Technologies Inc
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Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of JP2007515781A publication Critical patent/JP2007515781A/ja
Publication of JP2007515781A5 publication Critical patent/JP2007515781A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP2006532812A 2003-05-07 2004-05-06 広範囲温度チャック装置 Pending JP2007515781A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46905003P 2003-05-07 2003-05-07
PCT/US2004/014093 WO2004102640A1 (en) 2003-05-07 2004-05-06 Wide temperature range chuck system

Publications (2)

Publication Number Publication Date
JP2007515781A true JP2007515781A (ja) 2007-06-14
JP2007515781A5 JP2007515781A5 (enExample) 2007-07-26

Family

ID=33452253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006532812A Pending JP2007515781A (ja) 2003-05-07 2004-05-06 広範囲温度チャック装置

Country Status (8)

Country Link
US (1) US20050008983A1 (enExample)
EP (1) EP1623452B1 (enExample)
JP (1) JP2007515781A (enExample)
KR (1) KR20060038925A (enExample)
CN (1) CN100444308C (enExample)
DE (1) DE602004003365T2 (enExample)
TW (1) TW200428468A (enExample)
WO (1) WO2004102640A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040947A (ja) * 2008-08-07 2010-02-18 Sinfonia Technology Co Ltd 真空処理装置
JP2010251748A (ja) * 2009-04-13 2010-11-04 Asml Netherlands Bv 冷却デバイス、冷却配置、および冷却配置を含むリソグラフィ装置
JP2013513946A (ja) * 2009-12-11 2013-04-22 ノベルス・システムズ・インコーポレーテッド シリコン損失を非常に低く抑えた高ドーズインプラントストリップ
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
US9941108B2 (en) 2004-12-13 2018-04-10 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100459788B1 (ko) * 2002-01-14 2004-12-04 주성엔지니어링(주) 2단 웨이퍼 리프트 핀
WO2007116492A1 (ja) * 2006-03-31 2007-10-18 Fujitsu Microelectronics Limited 半導体装置の製造方法
US20080121821A1 (en) * 2006-11-27 2008-05-29 Varian Semiconductor Equipment Associates Inc. Techniques for low-temperature ion implantation
US7528391B2 (en) 2006-12-22 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for reducing contamination during ion implantation
JP4949091B2 (ja) * 2007-03-16 2012-06-06 東京エレクトロン株式会社 基板処理装置、基板処理方法および記録媒体
JP2008235315A (ja) * 2007-03-16 2008-10-02 Tokyo Electron Ltd 基板処理装置、基板処理方法および記録媒体
NL2004242A (en) 2009-04-13 2010-10-14 Asml Netherlands Bv Detector module, cooling arrangement and lithographic apparatus comprising a detector module.
JP5570938B2 (ja) * 2009-12-11 2014-08-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
FR2960816B1 (fr) * 2010-06-02 2012-07-13 Sidel Participations Four pour le conditionnement thermique de preformes et procede de commande d'un dispositif de refroidissement par air equipant un tel four
CN103426793B (zh) * 2012-05-24 2016-02-03 沈阳芯源微电子设备有限公司 基板冷热处理装置
US12255123B2 (en) 2015-09-30 2025-03-18 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
JP6614933B2 (ja) * 2015-11-11 2019-12-04 東京エレクトロン株式会社 基板載置機構および基板処理装置
JP2019507088A (ja) * 2016-01-28 2019-03-14 コーニング インコーポレイテッド 液体伝導を使用してガラスを熱的にテンパリングするための装置
JP6997108B2 (ja) 2016-06-02 2022-01-17 アクセリス テクノロジーズ， インコーポレイテッド ウェハ冷却方法
US12420314B2 (en) * 2019-10-18 2025-09-23 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor cleaning apparatus and method
CN110911320B (zh) * 2019-12-09 2023-08-18 北京北方华创微电子装备有限公司 冷却装置及其控制方法、半导体加工设备
US10866036B1 (en) 2020-05-18 2020-12-15 Envertic Thermal Systems, Llc Thermal switch

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997830A (ja) * 1995-07-21 1997-04-08 Fuji Electric Co Ltd 静電チャックホールダ、ウエハ保持機構ならびにその使用方法
JPH10294275A (ja) * 1997-04-17 1998-11-04 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法
JP2987085B2 (ja) * 1995-06-28 1999-12-06 日本碍子株式会社 半導体ウエハー保持装置、その製造方法およびその使用方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602687A (en) * 1969-06-23 1971-08-31 Battelle Development Corp Arc length control
US4609037A (en) * 1985-10-09 1986-09-02 Tencor Instruments Apparatus for heating and cooling articles
KR100443415B1 (ko) * 1996-02-23 2004-11-03 동경 엘렉트론 주식회사 열처리장치
EP0915499B1 (en) * 1997-11-05 2011-03-23 Tokyo Electron Limited Semiconductor wafer holding apparatus
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6203657B1 (en) * 1998-03-31 2001-03-20 Lam Research Corporation Inductively coupled plasma downstream strip module
US6461801B1 (en) * 1999-05-27 2002-10-08 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
JP2001139379A (ja) * 1999-11-09 2001-05-22 Toshiba Ceramics Co Ltd 高熱伝導性窒化アルミニウム焼結体の製造方法
US6409932B2 (en) * 2000-04-03 2002-06-25 Matrix Integrated Systems, Inc. Method and apparatus for increased workpiece throughput
US6495802B1 (en) * 2001-05-31 2002-12-17 Motorola, Inc. Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
US6771086B2 (en) * 2002-02-19 2004-08-03 Lucas/Signatone Corporation Semiconductor wafer electrical testing with a mobile chiller plate for rapid and precise test temperature control

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2987085B2 (ja) * 1995-06-28 1999-12-06 日本碍子株式会社 半導体ウエハー保持装置、その製造方法およびその使用方法
JPH0997830A (ja) * 1995-07-21 1997-04-08 Fuji Electric Co Ltd 静電チャックホールダ、ウエハ保持機構ならびにその使用方法
JPH10294275A (ja) * 1997-04-17 1998-11-04 Dainippon Screen Mfg Co Ltd 熱処理装置および熱処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9941108B2 (en) 2004-12-13 2018-04-10 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
JP2010040947A (ja) * 2008-08-07 2010-02-18 Sinfonia Technology Co Ltd 真空処理装置
JP2010251748A (ja) * 2009-04-13 2010-11-04 Asml Netherlands Bv 冷却デバイス、冷却配置、および冷却配置を含むリソグラフィ装置
JP2013513946A (ja) * 2009-12-11 2013-04-22 ノベルス・システムズ・インコーポレーテッド シリコン損失を非常に低く抑えた高ドーズインプラントストリップ
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films

Also Published As

Publication number Publication date
EP1623452B1 (en) 2006-11-22
CN1784765A (zh) 2006-06-07
WO2004102640A1 (en) 2004-11-25
KR20060038925A (ko) 2006-05-04
DE602004003365T2 (de) 2007-09-13
US20050008983A1 (en) 2005-01-13
DE602004003365D1 (de) 2007-01-04
EP1623452A1 (en) 2006-02-08
TW200428468A (en) 2004-12-16
CN100444308C (zh) 2008-12-17

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