JP2008521252A5 - - Google Patents

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Publication number
JP2008521252A5
JP2008521252A5 JP2007543144A JP2007543144A JP2008521252A5 JP 2008521252 A5 JP2008521252 A5 JP 2008521252A5 JP 2007543144 A JP2007543144 A JP 2007543144A JP 2007543144 A JP2007543144 A JP 2007543144A JP 2008521252 A5 JP2008521252 A5 JP 2008521252A5
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JP
Japan
Prior art keywords
silicon
emitting diode
bonded hydrogen
containing resin
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007543144A
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English (en)
Japanese (ja)
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JP2008521252A (ja
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Publication date
Priority claimed from US10/993,460 external-priority patent/US7192795B2/en
Priority claimed from US11/252,336 external-priority patent/US7314770B2/en
Application filed filed Critical
Publication of JP2008521252A publication Critical patent/JP2008521252A/ja
Publication of JP2008521252A5 publication Critical patent/JP2008521252A5/ja
Pending legal-status Critical Current

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JP2007543144A 2004-11-18 2005-11-14 ケイ素含有封入材を有する発光デバイスの製造方法 Pending JP2008521252A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/993,460 US7192795B2 (en) 2004-11-18 2004-11-18 Method of making light emitting device with silicon-containing encapsulant
US11/252,336 US7314770B2 (en) 2004-11-18 2005-10-17 Method of making light emitting device with silicon-containing encapsulant
PCT/US2005/041067 WO2006055456A1 (en) 2004-11-18 2005-11-14 Method of making light emitting device with silicon-containing encapsulant

Publications (2)

Publication Number Publication Date
JP2008521252A JP2008521252A (ja) 2008-06-19
JP2008521252A5 true JP2008521252A5 (enExample) 2009-01-08

Family

ID=36127533

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JP2007543144A Pending JP2008521252A (ja) 2004-11-18 2005-11-14 ケイ素含有封入材を有する発光デバイスの製造方法

Country Status (8)

Country Link
US (1) US7314770B2 (enExample)
EP (2) EP2256833B1 (enExample)
JP (1) JP2008521252A (enExample)
KR (1) KR20070089163A (enExample)
AT (1) ATE494636T1 (enExample)
DE (1) DE602005025795D1 (enExample)
TW (1) TWI401817B (enExample)
WO (1) WO2006055456A1 (enExample)

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US20060186428A1 (en) * 2005-02-23 2006-08-24 Tan Kheng L Light emitting device with enhanced encapsulant adhesion using siloxane material and method for fabricating the device

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