JP2008521252A - ケイ素含有封入材を有する発光デバイスの製造方法 - Google Patents

ケイ素含有封入材を有する発光デバイスの製造方法 Download PDF

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Publication number
JP2008521252A
JP2008521252A JP2007543144A JP2007543144A JP2008521252A JP 2008521252 A JP2008521252 A JP 2008521252A JP 2007543144 A JP2007543144 A JP 2007543144A JP 2007543144 A JP2007543144 A JP 2007543144A JP 2008521252 A JP2008521252 A JP 2008521252A
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Prior art keywords
silicon
aliphatic unsaturation
encapsulant
light emitting
actinic radiation
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Pending
Application number
JP2007543144A
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English (en)
Japanese (ja)
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JP2008521252A5 (https=
Inventor
ディー． ボードマン，ラリー
トンプソン，ディー．スコット
エー． レザーデイル，キャサリン
ジェイ． オーダーカーク，アンドリュー
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Priority claimed from US10/993,460 external-priority patent/US7192795B2/en
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2008521252A publication Critical patent/JP2008521252A/ja
Publication of JP2008521252A5 publication Critical patent/JP2008521252A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Sealing Material Composition (AREA)
JP2007543144A 2004-11-18 2005-11-14 ケイ素含有封入材を有する発光デバイスの製造方法 Pending JP2008521252A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/993,460 US7192795B2 (en) 2004-11-18 2004-11-18 Method of making light emitting device with silicon-containing encapsulant
US11/252,336 US7314770B2 (en) 2004-11-18 2005-10-17 Method of making light emitting device with silicon-containing encapsulant
PCT/US2005/041067 WO2006055456A1 (en) 2004-11-18 2005-11-14 Method of making light emitting device with silicon-containing encapsulant

Publications (2)

Publication Number Publication Date
JP2008521252A true JP2008521252A (ja) 2008-06-19
JP2008521252A5 JP2008521252A5 (https=) 2009-01-08

Family

ID=36127533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007543144A Pending JP2008521252A (ja) 2004-11-18 2005-11-14 ケイ素含有封入材を有する発光デバイスの製造方法

Country Status (8)

Country Link
US (1) US7314770B2 (https=)
EP (2) EP1812973B1 (https=)
JP (1) JP2008521252A (https=)
KR (1) KR20070089163A (https=)
AT (1) ATE494636T1 (https=)
DE (1) DE602005025795D1 (https=)
TW (1) TWI401817B (https=)
WO (1) WO2006055456A1 (https=)

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JP2006313902A (ja) * 2005-05-02 2006-11-16 Samsung Electro Mech Co Ltd 白色発光素子
JP2010248411A (ja) * 2009-04-17 2010-11-04 Shin-Etsu Chemical Co Ltd 表面処理蛍光体含有硬化性シリコーン樹脂組成物及び発光装置
JP2011525298A (ja) * 2008-05-07 2011-09-15 スリーエム イノベイティブ プロパティズ カンパニー ケイ素含有光重合可能組成物による光学結合
JP2012507582A (ja) * 2008-10-31 2012-03-29 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
EP2584003A1 (en) 2011-10-18 2013-04-24 Shin-Etsu Chemical Co., Ltd. Method for Curing Addition Curable Organopolysiloxane Composition
JP2013147546A (ja) * 2012-01-18 2013-08-01 Shin-Etsu Chemical Co Ltd Ｕｖ硬化型接着性シリコーン組成物、ｕｖ硬化型接着性シリコーン組成物シート、光半導体装置及びその製造方法
JP2014203869A (ja) * 2013-04-02 2014-10-27 信越化学工業株式会社 光半導体素子の封止方法
US8901588B2 (en) 2007-02-13 2014-12-02 3M Innovative Properties Company LED devices having lenses and methods of making same
KR20150143599A (ko) * 2013-04-08 2015-12-23 코닌클리케 필립스 엔.브이. 형광체 변환 층에 높은 열 전도도 입자를 갖는 led 및 그 제조 방법
JP2017076482A (ja) * 2015-10-13 2017-04-20 大日本印刷株式会社 光波長変換シート、バックライト装置、および画像表示装置
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
JP2019108471A (ja) * 2017-12-19 2019-07-04 信越化学工業株式会社 紫外線硬化型樹脂組成物、接着剤および硬化物

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JP4520437B2 (ja) * 2006-07-26 2010-08-04 信越化学工業株式会社 Ｌｅｄ用蛍光物質入り硬化性シリコーン組成物およびその組成物を使用するｌｅｄ発光装置。
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