JP2008512571A - スパッタリングターゲットのハンダ接合方法 - Google Patents
スパッタリングターゲットのハンダ接合方法 Download PDFInfo
- Publication number
- JP2008512571A JP2008512571A JP2007531091A JP2007531091A JP2008512571A JP 2008512571 A JP2008512571 A JP 2008512571A JP 2007531091 A JP2007531091 A JP 2007531091A JP 2007531091 A JP2007531091 A JP 2007531091A JP 2008512571 A JP2008512571 A JP 2008512571A
- Authority
- JP
- Japan
- Prior art keywords
- sputtering target
- fiber
- backing plate
- fabric
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
9:受け板
10:ハンダ
11:布地
12:スパッタリングターゲット
13:溶解状態のハンダ
14:リボン状の布地
Claims (7)
- スパッタリングターゲットと受け板の接合すべき面が溶解状態のハンダに浸漬されている状態で、溶解状態のハンダによって劣化しにくい繊維からなる布地をスパッタリングターゲットと受け板との間を通らせて行うことを特徴とする接合方法。
- 前記布地は、綿繊維、麻繊維、レーヨン繊維、ナイロン繊維、ポリエステル繊維、ガラス繊維、アルミナ繊維、ステンレススチル繊維、銅繊維、銅合金の繊維、チタン繊維、チタン合金の繊維、ニッケル繊維、ニッケル合金の繊維、または炭素繊維からなるか、またはこれら繊維の組み合わせからなることを特徴とする請求項1に記載の接合方法。
- 前記布地は網糸を使うことを特徴とする請求項1に記載の接合方法。
- 横縦の大きさがスパッタリングターゲットの大きさより大きい布地が受け板の上に敷かれ、その上にスパッタリングターゲットが載置されている状態で、布地を引っ張ることでスパッタリングターゲットと受け板との間を通らせて行うことを特徴とする接合方法。
- リボン状の布地を長手方向に引っ張りつつ幅方向に動かしながらスパッタリングターゲットと受け板との間を通らせて行うことを特徴とする請求項1に記載の接合方法。
- スパッタリングターゲットと受け板との接合すべき面が溶解状態のハンダに浸漬されている状態で、溶解状態のハンダによって劣化しにくい繊維からなる紐をスパッタリングターゲットと受け板との間を通らせて行うことを特徴とする接合方法。
- スパッタリングターゲットと受け板との接合すべき面が溶解状態のハンダに浸漬されている状態で、溶解状態のハンダによって劣化しにくい繊維からなるスクリーンをスパッタリングターゲットと受け板との間を通らせて行うことを特徴とする接合方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050046156A KR100620213B1 (ko) | 2005-05-31 | 2005-05-31 | 스퍼터링 타겟의 솔더 본딩 방법 |
PCT/KR2006/002047 WO2006129941A1 (en) | 2005-05-31 | 2006-05-29 | Solder bonding method for sputtering target |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008512571A true JP2008512571A (ja) | 2008-04-24 |
JP4555863B2 JP4555863B2 (ja) | 2010-10-06 |
Family
ID=37481832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007531091A Active JP4555863B2 (ja) | 2005-05-31 | 2006-05-29 | スパッタリングターゲットのハンダ接合方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4555863B2 (ja) |
KR (1) | KR100620213B1 (ja) |
WO (1) | WO2006129941A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012177156A (ja) * | 2011-02-25 | 2012-09-13 | Tosoh Corp | 円筒形ターゲットの製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080145688A1 (en) | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
US8197894B2 (en) | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
SG166689A1 (en) * | 2009-05-14 | 2010-12-29 | Solar Applied Mat Tech Corp | Ceramic sputtering target assembly and a method for producing the same |
US8734896B2 (en) | 2011-09-29 | 2014-05-27 | H.C. Starck Inc. | Methods of manufacturing high-strength large-area sputtering targets |
CN104928633B (zh) * | 2014-03-18 | 2018-01-09 | 汉能联创移动能源投资有限公司 | 一种靶材绑定方法 |
CN106032568A (zh) * | 2015-03-19 | 2016-10-19 | 汉能新材料科技有限公司 | 一种溅射靶及其绑定方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6228066A (ja) * | 1985-07-26 | 1987-02-06 | Tanaka Kikinzoku Kogyo Kk | スパツタリング用タ−ゲツトの製造方法 |
JPH06114549A (ja) * | 1992-09-02 | 1994-04-26 | Dai Ichi High Frequency Co Ltd | 板状体のろう接方法 |
JPH06297138A (ja) * | 1992-12-28 | 1994-10-25 | Plato Products Inc | 新規なハンダ除去芯及びその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677805B2 (ja) * | 1986-07-10 | 1994-10-05 | 株式会社神戸製鋼所 | スパツタリング用タ−ゲツトのボンデイング方法 |
JPH0483870A (ja) * | 1990-07-27 | 1992-03-17 | Namiki Precision Jewel Co Ltd | スパッターターゲットとバッキングプレート接合構造及びその接合方法 |
US5230459A (en) * | 1992-03-18 | 1993-07-27 | Tosoh Smd, Inc. | Method of bonding a sputter target-backing plate assembly assemblies produced thereby |
US6199259B1 (en) * | 1993-11-24 | 2001-03-13 | Applied Komatsu Technology, Inc. | Autoclave bonding of sputtering target assembly |
US6164519A (en) * | 1999-07-08 | 2000-12-26 | Praxair S.T. Technology, Inc. | Method of bonding a sputtering target to a backing plate |
-
2005
- 2005-05-31 KR KR1020050046156A patent/KR100620213B1/ko not_active IP Right Cessation
-
2006
- 2006-05-29 WO PCT/KR2006/002047 patent/WO2006129941A1/en active Application Filing
- 2006-05-29 JP JP2007531091A patent/JP4555863B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6228066A (ja) * | 1985-07-26 | 1987-02-06 | Tanaka Kikinzoku Kogyo Kk | スパツタリング用タ−ゲツトの製造方法 |
JPH06114549A (ja) * | 1992-09-02 | 1994-04-26 | Dai Ichi High Frequency Co Ltd | 板状体のろう接方法 |
JPH06297138A (ja) * | 1992-12-28 | 1994-10-25 | Plato Products Inc | 新規なハンダ除去芯及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012177156A (ja) * | 2011-02-25 | 2012-09-13 | Tosoh Corp | 円筒形ターゲットの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006129941A1 (en) | 2006-12-07 |
JP4555863B2 (ja) | 2010-10-06 |
KR100620213B1 (ko) | 2006-09-06 |
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