KR100620213B1 - 스퍼터링 타겟의 솔더 본딩 방법 - Google Patents

스퍼터링 타겟의 솔더 본딩 방법 Download PDF

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Publication number
KR100620213B1
KR100620213B1 KR1020050046156A KR20050046156A KR100620213B1 KR 100620213 B1 KR100620213 B1 KR 100620213B1 KR 1020050046156 A KR1020050046156 A KR 1020050046156A KR 20050046156 A KR20050046156 A KR 20050046156A KR 100620213 B1 KR100620213 B1 KR 100620213B1
Authority
KR
South Korea
Prior art keywords
sputtering target
backing plate
fiber
solder
molten solder
Prior art date
Application number
KR1020050046156A
Other languages
English (en)
Korean (ko)
Inventor
송정식
Original Assignee
어플라이드 사이언스(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 사이언스(주) filed Critical 어플라이드 사이언스(주)
Priority to KR1020050046156A priority Critical patent/KR100620213B1/ko
Priority to JP2007531091A priority patent/JP4555863B2/ja
Priority to PCT/KR2006/002047 priority patent/WO2006129941A1/en
Application granted granted Critical
Publication of KR100620213B1 publication Critical patent/KR100620213B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1020050046156A 2005-05-31 2005-05-31 스퍼터링 타겟의 솔더 본딩 방법 KR100620213B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020050046156A KR100620213B1 (ko) 2005-05-31 2005-05-31 스퍼터링 타겟의 솔더 본딩 방법
JP2007531091A JP4555863B2 (ja) 2005-05-31 2006-05-29 スパッタリングターゲットのハンダ接合方法
PCT/KR2006/002047 WO2006129941A1 (en) 2005-05-31 2006-05-29 Solder bonding method for sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050046156A KR100620213B1 (ko) 2005-05-31 2005-05-31 스퍼터링 타겟의 솔더 본딩 방법

Publications (1)

Publication Number Publication Date
KR100620213B1 true KR100620213B1 (ko) 2006-09-06

Family

ID=37481832

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050046156A KR100620213B1 (ko) 2005-05-31 2005-05-31 스퍼터링 타겟의 솔더 본딩 방법

Country Status (3)

Country Link
JP (1) JP4555863B2 (ja)
KR (1) KR100620213B1 (ja)
WO (1) WO2006129941A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
SG166689A1 (en) * 2009-05-14 2010-12-29 Solar Applied Mat Tech Corp Ceramic sputtering target assembly and a method for producing the same
JP5672066B2 (ja) * 2011-02-25 2015-02-18 東ソー株式会社 円筒形ターゲットの製造方法
US8734896B2 (en) 2011-09-29 2014-05-27 H.C. Starck Inc. Methods of manufacturing high-strength large-area sputtering targets
CN104928633B (zh) * 2014-03-18 2018-01-09 汉能联创移动能源投资有限公司 一种靶材绑定方法
CN106032568A (zh) * 2015-03-19 2016-10-19 汉能新材料科技有限公司 一种溅射靶及其绑定方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228066A (ja) * 1985-07-26 1987-02-06 Tanaka Kikinzoku Kogyo Kk スパツタリング用タ−ゲツトの製造方法
JPH0677805B2 (ja) * 1986-07-10 1994-10-05 株式会社神戸製鋼所 スパツタリング用タ−ゲツトのボンデイング方法
JPH0483870A (ja) * 1990-07-27 1992-03-17 Namiki Precision Jewel Co Ltd スパッターターゲットとバッキングプレート接合構造及びその接合方法
US5230459A (en) * 1992-03-18 1993-07-27 Tosoh Smd, Inc. Method of bonding a sputter target-backing plate assembly assemblies produced thereby
JP3110170B2 (ja) * 1992-09-02 2000-11-20 第一高周波工業株式会社 板状体のろう接方法
US5305941A (en) * 1992-12-28 1994-04-26 Plato Products, Inc. Desoldering wick
US6199259B1 (en) * 1993-11-24 2001-03-13 Applied Komatsu Technology, Inc. Autoclave bonding of sputtering target assembly
US6164519A (en) * 1999-07-08 2000-12-26 Praxair S.T. Technology, Inc. Method of bonding a sputtering target to a backing plate

Also Published As

Publication number Publication date
JP2008512571A (ja) 2008-04-24
JP4555863B2 (ja) 2010-10-06
WO2006129941A1 (en) 2006-12-07

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