JP2008506749A5 - - Google Patents
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- Publication number
- JP2008506749A5 JP2008506749A5 JP2007521939A JP2007521939A JP2008506749A5 JP 2008506749 A5 JP2008506749 A5 JP 2008506749A5 JP 2007521939 A JP2007521939 A JP 2007521939A JP 2007521939 A JP2007521939 A JP 2007521939A JP 2008506749 A5 JP2008506749 A5 JP 2008506749A5
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- phenyl
- cycloalkyl
- ring
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 camphorylsulfonyl Chemical group 0.000 claims description 48
- 125000000217 alkyl group Chemical group 0.000 claims description 38
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 27
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 25
- 229910052736 halogen Inorganic materials 0.000 claims description 20
- 150000002367 halogens Chemical class 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 17
- 125000001188 haloalkyl group Chemical group 0.000 claims description 17
- 125000001624 naphthyl group Chemical group 0.000 claims description 17
- 125000004390 alkyl sulfonyl group Chemical group 0.000 claims description 11
- 229910052760 oxygen Inorganic materials 0.000 claims description 11
- 125000003170 phenylsulfonyl group Chemical group C1(=CC=CC=C1)S(=O)(=O)* 0.000 claims description 11
- 229910052717 sulfur Inorganic materials 0.000 claims description 10
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 9
- 125000001589 carboacyl group Chemical group 0.000 claims description 9
- 125000005146 naphthylsulfonyl group Chemical group C1(=CC=CC2=CC=CC=C12)S(=O)(=O)* 0.000 claims description 7
- 125000006710 (C2-C12) alkenyl group Chemical group 0.000 claims description 5
- XTFIVUDBNACUBN-UHFFFAOYSA-N 1,3,5-trinitro-1,3,5-triazinane Chemical compound [O-][N+](=O)N1CN([N+]([O-])=O)CN([N+]([O-])=O)C1 XTFIVUDBNACUBN-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000004423 acyloxy group Chemical group 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 5
- 125000005278 alkyl sulfonyloxy group Chemical group 0.000 claims description 5
- 125000004414 alkyl thio group Chemical group 0.000 claims description 5
- 125000001231 benzoyloxy group Chemical group C(C1=CC=CC=C1)(=O)O* 0.000 claims description 5
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 5
- 125000006331 halo benzoyl group Chemical group 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- SNOOUWRIMMFWNE-UHFFFAOYSA-M sodium;6-[(3,4,5-trimethoxybenzoyl)amino]hexanoate Chemical compound [Na+].COC1=CC(C(=O)NCCCCCC([O-])=O)=CC(OC)=C1OC SNOOUWRIMMFWNE-UHFFFAOYSA-M 0.000 claims description 5
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 claims description 5
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims 18
- 150000001875 compounds Chemical class 0.000 claims 18
- 125000004432 carbon atom Chemical group C* 0.000 claims 15
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims 10
- 125000001424 substituent group Chemical group 0.000 claims 10
- 239000000463 material Substances 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 9
- 229920002120 photoresistant polymer Polymers 0.000 claims 9
- 238000000034 method Methods 0.000 claims 4
- 125000005561 phenanthryl group Chemical group 0.000 claims 4
- 238000007639 printing Methods 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 3
- 125000001072 heteroaryl group Chemical group 0.000 claims 3
- 125000005549 heteroarylene group Chemical group 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 2
- 238000004061 bleaching Methods 0.000 claims 2
- 238000004132 cross linking Methods 0.000 claims 2
- 125000005144 cycloalkylsulfonyl group Chemical group 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- IFVTZJHWGZSXFD-UHFFFAOYSA-N biphenylene Chemical group C1=CC=C2C3=CC=CC=C3C2=C1 IFVTZJHWGZSXFD-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 claims 1
- 238000013500 data storage Methods 0.000 claims 1
- 239000000975 dye Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- 150000004820 halides Chemical class 0.000 claims 1
- 125000005842 heteroatom Chemical group 0.000 claims 1
- 238000001093 holography Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 claims 1
- 239000000976 ink Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000012939 laminating adhesive Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000003094 microcapsule Substances 0.000 claims 1
- 238000004377 microelectronic Methods 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 125000004957 naphthylene group Chemical group 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 238000003860 storage Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04103453 | 2004-07-20 | ||
| PCT/EP2005/053296 WO2006008250A2 (en) | 2004-07-20 | 2005-07-11 | Oxime derivatives and the use therof as latent acids |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008506749A JP2008506749A (ja) | 2008-03-06 |
| JP2008506749A5 true JP2008506749A5 (enExample) | 2008-08-28 |
Family
ID=34929352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007521939A Pending JP2008506749A (ja) | 2004-07-20 | 2005-07-11 | オキシム誘導体および潜在酸としてのそれらの使用 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7687220B2 (enExample) |
| EP (1) | EP1769286B1 (enExample) |
| JP (1) | JP2008506749A (enExample) |
| KR (1) | KR101193824B1 (enExample) |
| CN (1) | CN1989455B (enExample) |
| CA (1) | CA2574054A1 (enExample) |
| TW (1) | TWI393999B (enExample) |
| WO (1) | WO2006008250A2 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI0407605A (pt) * | 2003-02-19 | 2006-02-14 | Ciba Sc Holding Ag | derivados de oxima halogenados e o uso dos mesmos como ácidos latentes |
| US7485573B2 (en) * | 2006-02-17 | 2009-02-03 | International Business Machines Corporation | Process of making a semiconductor device using multiple antireflective materials |
| JP2009541254A (ja) * | 2006-06-20 | 2009-11-26 | チバ ホールディング インコーポレーテッド | オキシムスルホネート及び潜酸としてのその使用 |
| WO2008022952A1 (en) * | 2006-08-24 | 2008-02-28 | Ciba Holding Inc. | Uv-dosis indicators |
| EP2402315A1 (en) | 2007-05-11 | 2012-01-04 | Basf Se | Oxime ester photoinitiators |
| EP2223910B1 (en) * | 2007-12-25 | 2012-11-07 | Adeka Corporation | Oxime esters and photopolymerization initiators containing the same |
| JP5339028B2 (ja) * | 2008-01-29 | 2013-11-13 | 日産化学工業株式会社 | ベンジルシアニド系化合物、光酸発生剤及びその製造方法 |
| JP5137662B2 (ja) * | 2008-03-31 | 2013-02-06 | 富士フイルム株式会社 | 硬化性組成物、カラーフィルタ及びその製造方法、並びに固体撮像素子 |
| TW201016651A (en) | 2008-07-28 | 2010-05-01 | Sumitomo Chemical Co | Oxime compound and resist composition containing the same |
| US9029062B2 (en) | 2010-06-30 | 2015-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and patterning process |
| JP5776580B2 (ja) * | 2011-02-25 | 2015-09-09 | 信越化学工業株式会社 | ポジ型レジスト材料及びこれを用いたパターン形成方法 |
| US9005877B2 (en) | 2012-05-15 | 2015-04-14 | Tokyo Electron Limited | Method of forming patterns using block copolymers and articles thereof |
| JP6100500B2 (ja) | 2012-10-26 | 2017-03-22 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
| US20140273534A1 (en) | 2013-03-14 | 2014-09-18 | Tokyo Electron Limited | Integration of absorption based heating bake methods into a photolithography track system |
| US8975009B2 (en) | 2013-03-14 | 2015-03-10 | Tokyo Electron Limited | Track processing to remove organic films in directed self-assembly chemo-epitaxy applications |
| US8980538B2 (en) | 2013-03-14 | 2015-03-17 | Tokyo Electron Limited | Chemi-epitaxy in directed self-assembly applications using photo-decomposable agents |
| US9147574B2 (en) | 2013-03-14 | 2015-09-29 | Tokyo Electron Limited | Topography minimization of neutral layer overcoats in directed self-assembly applications |
| US9136110B2 (en) | 2013-03-15 | 2015-09-15 | Tokyo Electron Limited | Multi-step bake apparatus and method for directed self-assembly lithography control |
| CN103389621B (zh) * | 2013-07-26 | 2016-03-16 | 常州强力先端电子材料有限公司 | 一种磺酸肟酯类光产酸剂 |
| KR102394994B1 (ko) | 2013-09-04 | 2022-05-04 | 도쿄엘렉트론가부시키가이샤 | 유도 자기 조립용 화학 템플릿을 생성하기 위한 경화 포토레지스트의 자외선을 이용한 박리 |
| US9793137B2 (en) | 2013-10-20 | 2017-10-17 | Tokyo Electron Limited | Use of grapho-epitaxial directed self-assembly applications to precisely cut logic lines |
| US9349604B2 (en) | 2013-10-20 | 2016-05-24 | Tokyo Electron Limited | Use of topography to direct assembly of block copolymers in grapho-epitaxial applications |
| CN105723261A (zh) * | 2013-10-21 | 2016-06-29 | 学校法人东海大学 | 光波导的制造方法 |
| JP6233271B2 (ja) | 2013-12-27 | 2017-11-22 | Jsr株式会社 | 感光性樹脂組成物およびレジストパターンの製造方法 |
| CN103694134A (zh) * | 2014-01-14 | 2014-04-02 | 黑龙江省科学院石油化学研究院 | 宽温液晶单体化合物中间体烷基双环己基苯乙酮肟及其合成方法 |
| EP3165965B1 (en) * | 2014-07-15 | 2018-10-10 | Tokyo Ohka Kogyo Co., Ltd. | Photosensitive composition and compound |
| US10272426B2 (en) | 2015-04-21 | 2019-04-30 | Jsr Corporation | Method of producing microfluidic device, microfluidic device, and photosensitive resin composition |
| US10095110B2 (en) | 2015-11-26 | 2018-10-09 | Jsr Corporation | Photosensitive resin composition, method for forming resist pattern, and method for producing metallic pattern |
| US9947597B2 (en) | 2016-03-31 | 2018-04-17 | Tokyo Electron Limited | Defectivity metrology during DSA patterning |
| US10527935B2 (en) | 2016-12-31 | 2020-01-07 | Rohm And Haas Electronic Materials Llc | Radiation-sensitive compositions and patterning and metallization processes |
| JP6397948B2 (ja) * | 2017-03-01 | 2018-09-26 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
| CN109651534B (zh) * | 2017-10-12 | 2021-04-27 | 常州强力电子新材料股份有限公司 | 一种多酮肟酯类光引发剂及其制备方法和应用 |
| CN113302179A (zh) * | 2019-01-31 | 2021-08-24 | 株式会社艾迪科 | 化合物、酸产生剂、组合物、固化物、固化物的制造方法及图案涂膜的制造方法 |
| CN112010788B (zh) * | 2019-05-31 | 2022-10-21 | 常州强力先端电子材料有限公司 | 一种非离子型肟酯类光产酸剂 |
| JP7631208B2 (ja) * | 2019-09-10 | 2025-02-18 | 株式会社Adeka | 化合物、酸発生剤、組成物、硬化物及びパターン、並びに硬化物及びパターンの製造方法 |
| JP7594534B2 (ja) * | 2019-09-10 | 2024-12-04 | 株式会社Adeka | 化合物、酸発生剤、組成物、硬化物及びパターン、並びに硬化物及びパターンの製造方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4566901A (en) * | 1982-05-06 | 1986-01-28 | Ciba-Geigy Corporation | Novel oxime ethers, the preparation thereof, compositions containing them and the use thereof |
| US4540598A (en) * | 1983-08-17 | 1985-09-10 | Ciba-Geigy Corporation | Process for curing acid-curable finishes |
| DE3660255D1 (en) * | 1985-04-12 | 1988-07-07 | Ciba Geigy Ag | Oxime sulphonates containing reactive groups |
| GB8608528D0 (en) | 1986-04-08 | 1986-05-14 | Ciba Geigy Ag | Production of positive images |
| DE59309494D1 (de) * | 1992-05-22 | 1999-05-12 | Ciba Geigy Ag | Hochauflösender I-Linien Photoresist mit höherer Empfindlichkeit |
| JP3830183B2 (ja) * | 1995-09-29 | 2006-10-04 | 東京応化工業株式会社 | オキシムスルホネート化合物及びレジスト用酸発生剤 |
| MY117352A (en) * | 1995-10-31 | 2004-06-30 | Ciba Sc Holding Ag | Oximesulfonic acid esters and the use thereof as latent sulfonic acids. |
| US6042988A (en) * | 1996-12-26 | 2000-03-28 | Tokyo Ohka Kogyo Co., Ltd. | Chemical-amplification-type negative resist composition |
| SG77689A1 (en) * | 1998-06-26 | 2001-01-16 | Ciba Sc Holding Ag | New o-acyloxime photoinitiators |
| WO2000052530A1 (en) * | 1999-03-03 | 2000-09-08 | Ciba Specialty Chemicals Holding Inc. | Oxime derivatives and the use thereof as photoinitiators |
| SG78412A1 (en) * | 1999-03-31 | 2001-02-20 | Ciba Sc Holding Ag | Oxime derivatives and the use thereof as latent acids |
| NL1014545C2 (nl) * | 1999-03-31 | 2002-02-26 | Ciba Sc Holding Ag | Oxim-derivaten en de toepassing daarvan als latente zuren. |
| US6482567B1 (en) * | 2000-08-25 | 2002-11-19 | Shipley Company, L.L.C. | Oxime sulfonate and N-oxyimidosulfonate photoacid generators and photoresists comprising same |
| TWI272451B (en) | 2000-09-25 | 2007-02-01 | Ciba Sc Holding Ag | Chemically amplified photoresist composition, process for preparation of a photoresist, and use of said chemically amplified photoresist composition |
| JP2002278054A (ja) * | 2001-03-16 | 2002-09-27 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP4210439B2 (ja) * | 2001-04-05 | 2009-01-21 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
| EP1395615B1 (en) * | 2001-06-11 | 2009-10-21 | Basf Se | Oxime ester photoinitiators having a combined structure |
| GB0114266D0 (en) * | 2001-06-12 | 2001-08-01 | Ciba Sc Holding Ag | Laser marking method |
| GB0114265D0 (en) * | 2001-06-12 | 2001-08-01 | Ciba Sc Holding Ag | Polymeric material containing a latent acid |
| JP2003182218A (ja) * | 2001-12-13 | 2003-07-03 | Fuji Photo Film Co Ltd | 感熱記録材料 |
| WO2003067332A2 (en) * | 2002-02-06 | 2003-08-14 | Ciba Specialty Chemicals Holding Inc. | Sulfonate derivatives and the use therof as latent acids |
| JP4000469B2 (ja) * | 2002-03-22 | 2007-10-31 | 信越化学工業株式会社 | 化学増幅レジスト材料用の光酸発生剤、並びにそれを用いたレジスト材料及びパターン形成方法 |
| BRPI0407605A (pt) * | 2003-02-19 | 2006-02-14 | Ciba Sc Holding Ag | derivados de oxima halogenados e o uso dos mesmos como ácidos latentes |
-
2005
- 2005-07-11 KR KR1020077003721A patent/KR101193824B1/ko not_active Expired - Fee Related
- 2005-07-11 CN CN2005800245296A patent/CN1989455B/zh not_active Expired - Fee Related
- 2005-07-11 EP EP05774169.6A patent/EP1769286B1/en not_active Expired - Lifetime
- 2005-07-11 JP JP2007521939A patent/JP2008506749A/ja active Pending
- 2005-07-11 CA CA002574054A patent/CA2574054A1/en not_active Abandoned
- 2005-07-11 WO PCT/EP2005/053296 patent/WO2006008250A2/en not_active Ceased
- 2005-07-11 US US11/632,687 patent/US7687220B2/en not_active Expired - Fee Related
- 2005-07-19 TW TW094124335A patent/TWI393999B/zh not_active IP Right Cessation
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