JP2008286788A - 基板検査用治具 - Google Patents

基板検査用治具 Download PDF

Info

Publication number
JP2008286788A
JP2008286788A JP2008095972A JP2008095972A JP2008286788A JP 2008286788 A JP2008286788 A JP 2008286788A JP 2008095972 A JP2008095972 A JP 2008095972A JP 2008095972 A JP2008095972 A JP 2008095972A JP 2008286788 A JP2008286788 A JP 2008286788A
Authority
JP
Japan
Prior art keywords
contact
connection electrode
guide hole
guide plate
electrode portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008095972A
Other languages
English (en)
Japanese (ja)
Inventor
Minoru Kato
穣 加藤
Tadakazu Miyatake
忠数 宮武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2008095972A priority Critical patent/JP2008286788A/ja
Publication of JP2008286788A publication Critical patent/JP2008286788A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
JP2008095972A 2007-04-17 2008-04-02 基板検査用治具 Pending JP2008286788A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008095972A JP2008286788A (ja) 2007-04-17 2008-04-02 基板検査用治具

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007108738 2007-04-17
JP2008095972A JP2008286788A (ja) 2007-04-17 2008-04-02 基板検査用治具

Publications (1)

Publication Number Publication Date
JP2008286788A true JP2008286788A (ja) 2008-11-27

Family

ID=40146625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008095972A Pending JP2008286788A (ja) 2007-04-17 2008-04-02 基板検査用治具

Country Status (3)

Country Link
JP (1) JP2008286788A (enrdf_load_stackoverflow)
KR (1) KR100975808B1 (enrdf_load_stackoverflow)
TW (1) TW200848759A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108066A1 (ja) * 2011-02-10 2012-08-16 日本電産リード株式会社 検査治具
JP2013003002A (ja) * 2011-06-17 2013-01-07 Hioki Ee Corp プローブユニットおよび回路基板検査装置
WO2014017426A1 (ja) * 2012-07-26 2014-01-30 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP2014112115A (ja) * 2009-12-24 2014-06-19 Gardian Japan Co Ltd 配線検査治具用上板部材
JP2014240788A (ja) * 2013-06-12 2014-12-25 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP2018503805A (ja) * 2014-12-04 2018-02-08 テクノプローベ エス．ピー．エー． 垂直プローブを含むテストヘッド
WO2019187957A1 (ja) * 2018-03-30 2019-10-03 日本電産リード株式会社 検査治具、及びこれを備えた検査装置
WO2024219075A1 (ja) * 2023-04-19 2024-10-24 株式会社日本マイクロニクス 電気的接続装置の製造治具および電気的接続装置の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010276510A (ja) * 2009-05-29 2010-12-09 Nidec-Read Corp 検査用治具
JP5381609B2 (ja) * 2009-10-20 2014-01-08 日本電産リード株式会社 検査用治具及び接触子
JP5428748B2 (ja) * 2009-10-21 2014-02-26 日本電産リード株式会社 検査用治具のメンテナンス方法及び基板検査装置
JP5662925B2 (ja) * 2011-12-14 2015-02-04 富士通株式会社 治具の特定支援装置、治具の特定支援方法及び治具の特定支援プログラム
KR101656047B1 (ko) 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090410A (ja) * 2000-09-13 2002-03-27 Nidec-Read Corp 基板検査用検査治具および該検査治具を備えた基板検査装置
JP2006329998A (ja) * 2006-07-19 2006-12-07 Nidec-Read Corp 基板検査用治具、及びこれに用いる検査用プローブ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5414369A (en) 1992-11-09 1995-05-09 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe modules with offset needles
US6194908B1 (en) 1997-06-26 2001-02-27 Delaware Capital Formation, Inc. Test fixture for testing backplanes or populated circuit boards
JP2004163228A (ja) 2002-11-12 2004-06-10 Toyo Denshi Giken Kk プローブとそれを用いたコンタクト装置
JP3690801B2 (ja) 2004-11-17 2005-08-31 株式会社コーヨーテクノス 接触ピン

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002090410A (ja) * 2000-09-13 2002-03-27 Nidec-Read Corp 基板検査用検査治具および該検査治具を備えた基板検査装置
JP2006329998A (ja) * 2006-07-19 2006-12-07 Nidec-Read Corp 基板検査用治具、及びこれに用いる検査用プローブ

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112115A (ja) * 2009-12-24 2014-06-19 Gardian Japan Co Ltd 配線検査治具用上板部材
JP2012181186A (ja) * 2011-02-10 2012-09-20 Nidec-Read Corp 検査治具
WO2012108066A1 (ja) * 2011-02-10 2012-08-16 日本電産リード株式会社 検査治具
KR101795836B1 (ko) * 2011-02-10 2017-11-08 니혼덴산리드가부시키가이샤 검사 지그
JP2013003002A (ja) * 2011-06-17 2013-01-07 Hioki Ee Corp プローブユニットおよび回路基板検査装置
KR101979060B1 (ko) * 2012-07-26 2019-05-15 히오끼 덴끼 가부시끼가이샤 프로브 유닛, 기판 검사 장치 및 프로브 유닛 제조 방법
WO2014017426A1 (ja) * 2012-07-26 2014-01-30 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP2014025769A (ja) * 2012-07-26 2014-02-06 Hioki Ee Corp プローブユニット、基板検査装置およびプローブユニット製造方法
KR20150037736A (ko) * 2012-07-26 2015-04-08 히오끼 덴끼 가부시끼가이샤 프로브 유닛, 기판 검사 장치 및 프로브 유닛 제조 방법
JP2014240788A (ja) * 2013-06-12 2014-12-25 日置電機株式会社 プローブユニット、基板検査装置およびプローブユニット製造方法
JP2018503805A (ja) * 2014-12-04 2018-02-08 テクノプローベ エス．ピー．エー． 垂直プローブを含むテストヘッド
WO2019187957A1 (ja) * 2018-03-30 2019-10-03 日本電産リード株式会社 検査治具、及びこれを備えた検査装置
JPWO2019187957A1 (ja) * 2018-03-30 2021-04-22 日本電産リード株式会社 検査治具、及びこれを備えた検査装置
US11327094B2 (en) 2018-03-30 2022-05-10 Nidec-Read Corporation Inspection jig, and inspection device including the same
WO2024219075A1 (ja) * 2023-04-19 2024-10-24 株式会社日本マイクロニクス 電気的接続装置の製造治具および電気的接続装置の製造方法

Also Published As

Publication number Publication date
KR100975808B1 (ko) 2010-08-13
TWI354108B (enrdf_load_stackoverflow) 2011-12-11
KR20080093865A (ko) 2008-10-22
TW200848759A (en) 2008-12-16

Similar Documents

Publication Publication Date Title
JP2008286788A (ja) 基板検査用治具
JP4041831B2 (ja) 基板検査用治具及びこの治具における接続電極部の電極構造
KR101795836B1 (ko) 검사 지그
US9733299B2 (en) Inspection jig
US11009523B2 (en) Probe, inspection jig, and inspection apparatus
JP4863466B2 (ja) 基板検査用治具の製造方法
WO2018198859A1 (ja) 検査治具、及び基板検査装置
JP5070956B2 (ja) 基板検査用接触子及び基板検査用治具
TWI427297B (zh) 基板檢查用之檢查治具
JP5245279B2 (ja) 基板検査用治具及びこの治具における接続電極部の電極構造
JP2010078432A (ja) 基板検査治具及び接触子
KR100725838B1 (ko) 웨이퍼 테스트용 프로브 카드
JP2009008516A (ja) 基板検査治具及び基板検査方法
JP5353968B2 (ja) 基板検査用治具
JP2010091314A (ja) 基板検査治具及び検査用プローブ
WO2019187957A1 (ja) 検査治具、及びこれを備えた検査装置
JP2007304032A (ja) 基板検査用治具及びこの治具における接続電極部の電極構造
JP2009156720A (ja) 基板検査用治具及び検査用接触子
JP2011137664A (ja) 検査用治具
JP2010276359A (ja) 基板検査装置用検査治具
JP4838658B2 (ja) 基板検査用治具及び基板検査用治具の電極部構造
JP2009300391A (ja) 電子基板の検査方法及びそれに使用する検査用アタッチメント装置
JP2007327854A (ja) 基板検査用治具及び基板検査装置
JP2010025665A (ja) 基板検査治具及び接触子
JP2010060310A (ja) 基板検査治具及びその電極部

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110331

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120605

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121218

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130131

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130716