JP2008270733A - 高熱伝導効率ledのパッケージング方法とその構造 - Google Patents
高熱伝導効率ledのパッケージング方法とその構造 Download PDFInfo
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Abstract
【解決手段】高熱伝導効率LEDおよびその構造のパッケージング方法は、第1に、複数のくぼみを有する銅サブストレートを提供する。絶縁層は、サブストレートの表面およびくぼみの底に形成される。一方、一組の金属回路がサブストレートの絶縁層上に形成され、また、絶縁ラッカーの層は、電気的な接続およびケースのない、金属回路の表面に塗布する。スズの層は、絶縁ラッカーのないくぼみおよび金属回路の絶縁層上に塗布されている。さらにまた、一組の発光チップは、くぼみのスズの層上でダイボンドされる。次に、発光チップおよび金属回路は、一組の金線で電気的に接続されている。さらに、発光チップセット、金線および金属回路がその中に封入されるように、環状体がサブストレートの表面に配置される。
【選択図】図8
Description
Claims (18)
- 高冷却効率のLEDのパッケージング方法であって、
a)銅サブストレート(1)を準備し、そこに、複数のくぼみ(11)を形成する;
b)前記銅サブストレート(1)の表面および前記くぼみ(11)の底に絶縁層(14)を塗布する;
c)前記絶縁層(14)に金属回路セット(15)を塗布する;
d)電気的な接続とケースのない前記金属回路セット(15)の前記表面に絶縁ラッカー(16)を塗布する;
e)前記絶縁ラッカー(16)のが塗布されていない前記くぼみ(11)の前記絶縁層(14)の表面および前記金属回路セット(15)の前記表面にすずの層(17)を塗布する;
f)前記くぼみ(11)の前記スズの層(17)上に一組の発光チップ(2)をダイボンドする;
g)電気的に前記発光チップ(2)セットを、複数の金線(3)によって、前記金属回路セット(15)に電気的に接続し、前記発光チップ(21、22、23)を直列に接続する;
h)前記銅サブストレート(1)の表面に中空の環状体(4)を形成し、前記発光チップ(2)のセット、前記金線(3)および前記金属回路(15)を前記環状体(4)中に封入する;
i) 蛍光層(5)を形成するために、一組の発光チップ(2)、前記金線(3)および前記金属回路(15)の前記スズの層(17)の前記表面に蛍光接着剤を付着する;および、
j)前記蛍光層(5)封入するために前記環状体(4)の内部にエポキシ樹脂を注入し、エポキシ樹脂層(6)を形成する、
工程を含む、高冷却効率のLEDのパッケージング方法。 - 工程a)の前記銅サブストレート(1)が円形体であり、複数の位置決め孔(12)が前記くぼみ(11)を囲むよう準備され、また、複数の「U」形開口部(13)が円周端に設けられている、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 工程c)の前記金属回路セット(15)が複数の回路部(151、152、153、154)から成る、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 工程d)の前記絶縁ラッカー(16)が白い、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 工程e)の前記スズの層(17)の厚みが4〜5μある、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 工程f)の前記発光チップセット(2)が複数の発光チップ(21、22、23)から成る、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 工程h)の前記環状体(4)が金属またはプラスチックの1種類材料から成る、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 前記環状体(4)がリング本体(41)を有し、底部に位置決め部(42)を有し、またその反射面(43)を形成するために内壁が傾斜した、請求項7記載の高冷却効率のLEDのパッケージング方法。
- 工程i)の前記蛍光層(5)が蛍光接着剤によって作成される、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 前記工程j)によってエポキシ樹脂層(6)を形成するため前記環状体の内部にエポキシ樹脂を注入する、請求項1記載の高冷却効率のLEDのパッケージング方法。
- 高冷却効率LEDの構造であって、
複数のくぼみ(11)がその上に設けられている銅サブストレート(1)、前記銅サブストレート(1)の表面および前記くぼみ(11)の底に設けられている絶縁層(14)、前記銅サブストレート(1)の前記絶縁層(14)上に配置されている一組の金属回路(15)、電気的接続もケースもない、前記金属回路セット(15)の表面に塗布されている絶縁ラッカー(16)、絶縁ラッカーが塗布されていない前記くぼみ(11)の前記絶縁層(14)の表面および前記金属回路セット(15)の表面に準備されているすずの層(17);
前記くぼみ(11)の前記スズの層(17)上にダイボンドされている一組の発光チップ(2);
前記金属回路セット(15)および前記発光チップセット(2)が電気的に接続されている一組の金線(3);
前記金属回路セット(15)、前記発光チップセット(2)および前記金線(3)をその中に封入するために前記サブストレート(1)上に準備される環状体(4);
前記環状体(4)の中、および前記金属回路セット(15)、前記発光チップセット(2)および前記金線(3)の前記表面に設けられた蛍光層(5); および、前記環状体(4)の中、および、前記蛍光層(5)の前記表面上に準備されたエポキシ樹脂層(6)、
を含む高冷却効率LEDの構造。 - 複数の位置決め孔(12)が前記くぼみ(11)を囲むように準備された円形体の、複数の「U」形の開口部(13)が設けられた円周端に、前記銅サブストレート(1)がある、請求項11記載の高冷却効率LEDの構造。
- 前記金属回路セット(15)が複数の回路部(151、152、153、154)から成る請求項12記載の高冷却効率LEDの構造。
- 前記発光チップセット(2)が複数の発光チップ(21、22、23)から成る請求項11記載の高冷却効率LEDの構造。
- 前記絶縁ラッカー(16)が白い請求項11記載の高冷却効率LEDの構造。
- 前記環状体(4)が金属またはプラスチックのいずれか1種類の材料から作られる請求項11記載の高冷却効率LEDの構造。
- 前記リング本体(41)の底に外側に突き出た位置決め部(42)を有し、前記銅サブストレート(1)の位置決め孔(12)に配置され、また、前記リング本体(4)の内壁が傾斜して反射面(43)を形成する、請求項16記載の高冷却効率LEDの構造。
- 前記スズの層(17)の厚みが約4〜5μある、請求項11記載の高冷却効率LEDの構造。
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TW096114219A TW200843135A (en) | 2007-04-23 | 2007-04-23 | Method of packaging light emitting diode with high heat-dissipating efficiency and the structure thereof |
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61229374A (ja) * | 1985-04-03 | 1986-10-13 | Toshiba Corp | 半導体発光表示装置 |
JPS62185382A (ja) * | 1986-02-08 | 1987-08-13 | Copal Co Ltd | 発光素子アレイ |
JPS6359356U (ja) * | 1986-10-06 | 1988-04-20 | ||
JPS64350U (ja) * | 1987-06-19 | 1989-01-05 | ||
JPH02137389A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | サブマウント及び光半導体装置 |
JPH03230586A (ja) * | 1990-02-05 | 1991-10-14 | Mitsubishi Cable Ind Ltd | Ledモジュール |
JPH077185A (ja) * | 1993-06-15 | 1995-01-10 | Stanley Electric Co Ltd | Led発光ユニット |
JPH1098215A (ja) * | 1996-09-24 | 1998-04-14 | Toyoda Gosei Co Ltd | 発光ダイオード装置 |
JP2006147865A (ja) * | 2004-11-19 | 2006-06-08 | Fujikura Ltd | 発光素子実装用基板とその製造方法、発光素子モジュールとその製造方法、表示装置、照明装置及び交通信号機 |
JP2006332618A (ja) * | 2005-04-25 | 2006-12-07 | Naoya Yanase | 電子部品実装基板、及びその電子部品実装基板の製造方法 |
JP2007027433A (ja) * | 2005-07-15 | 2007-02-01 | Mitsubishi Cable Ind Ltd | 発光装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935665A (en) * | 1987-12-24 | 1990-06-19 | Mitsubishi Cable Industries Ltd. | Light emitting diode lamp |
US6583444B2 (en) * | 1997-02-18 | 2003-06-24 | Tessera, Inc. | Semiconductor packages having light-sensitive chips |
US6614103B1 (en) * | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
US6590346B1 (en) * | 2001-07-16 | 2003-07-08 | Alien Technology Corporation | Double-metal background driven displays |
US6924514B2 (en) * | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
US20060043382A1 (en) * | 2003-02-07 | 2006-03-02 | Nobuyuki Matsui | Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus |
US6841934B2 (en) * | 2003-02-26 | 2005-01-11 | Harvatek Corporation | White light source from light emitting diode |
US20040188696A1 (en) * | 2003-03-28 | 2004-09-30 | Gelcore, Llc | LED power package |
TWI253765B (en) * | 2003-05-26 | 2006-04-21 | Matsushita Electric Works Ltd | Light-emitting device |
JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
KR101197046B1 (ko) * | 2005-01-26 | 2012-11-06 | 삼성디스플레이 주식회사 | 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치 |
US7411225B2 (en) * | 2005-03-21 | 2008-08-12 | Lg Electronics Inc. | Light source apparatus |
JP2007184426A (ja) * | 2006-01-06 | 2007-07-19 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
TWM292879U (en) | 2006-01-20 | 2006-06-21 | I Chiun Precision Ind Co Ltd | Base height improving structure of SMD supporter |
TW200729539A (en) * | 2006-01-26 | 2007-08-01 | Litmx Inc | Making method for the circuit board of separated light emitting diode |
US7586125B2 (en) * | 2006-02-20 | 2009-09-08 | Industrial Technology Research Institute | Light emitting diode package structure and fabricating method thereof |
US7549772B2 (en) * | 2006-03-31 | 2009-06-23 | Pyroswift Holding Co., Limited | LED lamp conducting structure with plate-type heat pipe |
US7708427B2 (en) * | 2006-06-16 | 2010-05-04 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light source device and method of making the device |
US8610134B2 (en) * | 2006-06-29 | 2013-12-17 | Cree, Inc. | LED package with flexible polyimide circuit and method of manufacturing LED package |
KR100854328B1 (ko) * | 2006-07-07 | 2008-08-28 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
-
2007
- 2007-04-23 TW TW096114219A patent/TW200843135A/zh unknown
-
2008
- 2008-01-21 US US12/017,316 patent/US7700386B2/en not_active Expired - Fee Related
- 2008-01-22 EP EP08001139A patent/EP1986235A2/en not_active Withdrawn
- 2008-02-12 JP JP2008030057A patent/JP2008270733A/ja active Pending
- 2008-02-19 KR KR1020080014717A patent/KR20080095169A/ko not_active Application Discontinuation
-
2009
- 2009-07-12 US US12/501,487 patent/US7772610B2/en not_active Expired - Fee Related
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61229374A (ja) * | 1985-04-03 | 1986-10-13 | Toshiba Corp | 半導体発光表示装置 |
JPS62185382A (ja) * | 1986-02-08 | 1987-08-13 | Copal Co Ltd | 発光素子アレイ |
JPS6359356U (ja) * | 1986-10-06 | 1988-04-20 | ||
JPS64350U (ja) * | 1987-06-19 | 1989-01-05 | ||
JPH02137389A (ja) * | 1988-11-18 | 1990-05-25 | Nec Corp | サブマウント及び光半導体装置 |
JPH03230586A (ja) * | 1990-02-05 | 1991-10-14 | Mitsubishi Cable Ind Ltd | Ledモジュール |
JPH077185A (ja) * | 1993-06-15 | 1995-01-10 | Stanley Electric Co Ltd | Led発光ユニット |
JPH1098215A (ja) * | 1996-09-24 | 1998-04-14 | Toyoda Gosei Co Ltd | 発光ダイオード装置 |
JP2006147865A (ja) * | 2004-11-19 | 2006-06-08 | Fujikura Ltd | 発光素子実装用基板とその製造方法、発光素子モジュールとその製造方法、表示装置、照明装置及び交通信号機 |
JP2006332618A (ja) * | 2005-04-25 | 2006-12-07 | Naoya Yanase | 電子部品実装基板、及びその電子部品実装基板の製造方法 |
JP2007027433A (ja) * | 2005-07-15 | 2007-02-01 | Mitsubishi Cable Ind Ltd | 発光装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011093174A1 (ja) * | 2010-01-29 | 2011-08-04 | 日本航空電子工業株式会社 | Ledデバイス、その製造方法、及び発光装置 |
US9425372B2 (en) | 2010-01-29 | 2016-08-23 | Japan Aviation Electronics Industry, Limited | LED device, method of manufacturing the same, and light-emitting apparatus |
WO2013153938A1 (ja) * | 2012-04-11 | 2013-10-17 | 東芝ライテック株式会社 | 光半導体光源及び車両用照明装置 |
JP2013218972A (ja) * | 2012-04-11 | 2013-10-24 | Harison Toshiba Lighting Corp | 光半導体光源及び車両用照明装置 |
CN102856476A (zh) * | 2012-09-12 | 2013-01-02 | 浙江中博光电科技有限公司 | 一种基于均热板的led芯片封装结构及其芯片支架 |
Also Published As
Publication number | Publication date |
---|---|
KR20080095169A (ko) | 2008-10-28 |
US20080258157A1 (en) | 2008-10-23 |
TW200843135A (en) | 2008-11-01 |
US7772610B2 (en) | 2010-08-10 |
US7700386B2 (en) | 2010-04-20 |
EP1986235A2 (en) | 2008-10-29 |
US20090272987A1 (en) | 2009-11-05 |
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