JP2008252012A - ウェハ搬送用ブレード - Google Patents
ウェハ搬送用ブレード Download PDFInfo
- Publication number
- JP2008252012A JP2008252012A JP2007094552A JP2007094552A JP2008252012A JP 2008252012 A JP2008252012 A JP 2008252012A JP 2007094552 A JP2007094552 A JP 2007094552A JP 2007094552 A JP2007094552 A JP 2007094552A JP 2008252012 A JP2008252012 A JP 2008252012A
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- JP
- Japan
- Prior art keywords
- wafer
- blade
- main body
- rough surface
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 本発明に係るブレード16は、本体部18のブレード面のウェハ搭載領域18bに設けられた突起部22により、ブレード面18aに搭載されるウェハWを支持する。そして、突起部22にはその上面に粗面処理が施されて微小溝が形成されているため、ウェハWは位置ズレが抑制された状態で突起部22に保持される。すなわち、このブレード16においては、真空吸着を利用せずにウェハWを保持するため簡素な構成であり、また、ブレード16の本体部18に収容穴を設けずにウェハWを保持することができるため、ウェハの欠損を効果的に回避することができる。
【選択図】 図2
Description
(第1実施形態)
(第2実施形態)
Claims (13)
- 本体部のブレード面にウェハを搭載した状態で前記ウェハを搬送するウェハ搬送用ブレードであって、前記本体部の前記ブレード面のウェハ搭載領域に、上面に粗面処理が施された突起部が設けられている、ウェハ搬送用ブレード。
- 前記突起部の構成材料が、前記本体部の構成材料と同一材料である、請求項1に記載のウェハ搬送用ブレード。
- 前記突起部が前記本体部に一体的に設けられている、請求項1又2に記載のウェハ搬送用ブレード。
- 前記突起部には、前記粗面処理として、一方向に延びる鋸刃断面の溝が形成されている、請求項1〜3のいずれか一項に記載のウェハ搬送用ブレード。
- 前記突起部に形成された溝が、前記ウェハ搬送用ブレードの回転方向に略直交する方向に延びている、請求項4に記載のウェハ搬送用ブレード。
- 前記突起部に形成された溝が、30番〜90番のグラインディング加工により形成されている、請求項4又は5に記載のウェハ搬送用ブレード。
- 前記突起部には、前記粗面処理として、サンドブラスト処理が施されている、請求項1〜3のいずれか一項に記載のウェハ搬送用ブレード。
- 本体部のブレード面にウェハを搭載した状態で前記ウェハを搬送するウェハ搬送用ブレードであって、
前記本体部の前記ブレード面のウェハ搭載領域の少なくとも一部に、粗面処理が施された粗面領域が形成されており、
前記ウェハ搭載領域の周辺領域の高さが、前記ウェハ搭載領域の高さ以下である、ウェハ搬送用ブレード。 - 前記ウェハ搭載領域の全領域に前記粗面領域が形成されている、請求項8に記載のウェハ搬送用ブレード。
- 前記粗面領域には、前記粗面処理として、一方向に延びる鋸刃断面の溝が形成されている、請求項8又は9に記載のウェハ搬送用ブレード。
- 前記粗面領域に形成された溝は、前記ウェハ搬送用ブレードの回転方向に略直交する方向に延びている、請求項10に記載のウェハ搬送用ブレード。
- 前記粗面領域に形成された溝が、30番〜90番のグラインディング加工により形成されている、請求項10又は11に記載のウェハ搬送用ブレード。
- 前記粗面領域には、前記粗面処理として、サンドブラスト処理が施されている、請求項8又は9に記載のウェハ搬送用ブレード。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007094552A JP4516089B2 (ja) | 2007-03-30 | 2007-03-30 | ウェハ搬送用ブレード |
KR1020080027856A KR100989752B1 (ko) | 2007-03-30 | 2008-03-26 | 웨이퍼 이송 블레이드 |
TW097111463A TWI455237B (zh) | 2007-03-30 | 2008-03-28 | 晶圓傳輸葉片 |
EP08153643A EP1975997A3 (en) | 2007-03-30 | 2008-03-28 | Wafer transfer blade |
CNA2008100898067A CN101320704A (zh) | 2007-03-30 | 2008-03-28 | 晶圆传送叶片 |
SG200802468-9A SG146590A1 (en) | 2007-03-30 | 2008-03-28 | Wafer transfer blade |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007094552A JP4516089B2 (ja) | 2007-03-30 | 2007-03-30 | ウェハ搬送用ブレード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008252012A true JP2008252012A (ja) | 2008-10-16 |
JP4516089B2 JP4516089B2 (ja) | 2010-08-04 |
Family
ID=39472606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007094552A Expired - Fee Related JP4516089B2 (ja) | 2007-03-30 | 2007-03-30 | ウェハ搬送用ブレード |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1975997A3 (ja) |
JP (1) | JP4516089B2 (ja) |
KR (1) | KR100989752B1 (ja) |
CN (1) | CN101320704A (ja) |
SG (1) | SG146590A1 (ja) |
TW (1) | TWI455237B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009720A (ja) * | 2010-06-28 | 2012-01-12 | Nikon Corp | ウェハホルダおよび露光装置 |
JP2012514873A (ja) * | 2009-01-11 | 2012-06-28 | アプライド マテリアルズ インコーポレイテッド | 基板を移動させるシステム、装置、および方法 |
KR20180091961A (ko) * | 2013-09-26 | 2018-08-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105097623A (zh) * | 2014-05-07 | 2015-11-25 | 盛美半导体设备(上海)有限公司 | 晶圆装载端口结构 |
US10580681B2 (en) | 2016-07-10 | 2020-03-03 | Yaskawa America Inc. | Robotic apparatus and method for transport of a workpiece |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0295244U (ja) * | 1989-01-13 | 1990-07-30 | ||
JPH0474439U (ja) * | 1990-11-13 | 1992-06-30 | ||
JPH0661331A (ja) * | 1992-08-06 | 1994-03-04 | Tokyo Electron Tohoku Ltd | 基板搬送装置 |
JPH0727783U (ja) * | 1994-02-07 | 1995-05-23 | 東京エレクトロン九州株式会社 | 搬入搬出装置 |
JPH08327959A (ja) * | 1994-06-30 | 1996-12-13 | Seiko Epson Corp | ウエハ及び基板の処理装置及び処理方法、ウエハ及び基板の移載装置 |
JPH09246353A (ja) * | 1996-03-08 | 1997-09-19 | Yaskawa Electric Corp | 搬送フォーク |
US6187103B1 (en) * | 1998-08-27 | 2001-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for transporting wafers |
JP2001223252A (ja) * | 2000-02-07 | 2001-08-17 | Assist Japan Kk | ロボットの吸着レスハンド |
JP2002057209A (ja) * | 2000-06-01 | 2002-02-22 | Tokyo Electron Ltd | 枚葉式処理装置および枚葉式処理方法 |
JP2003168717A (ja) * | 2001-12-03 | 2003-06-13 | Yaskawa Electric Corp | ウェハ搬送フォーク |
JP2004165284A (ja) * | 2002-11-11 | 2004-06-10 | Kazuo Tanabe | ウエーハセンタリング装置 |
JP2005101226A (ja) * | 2003-09-24 | 2005-04-14 | Hoya Corp | 基板保持装置,基板処理装置,基板検査装置及び基板保持方法 |
JP2005183784A (ja) * | 2003-12-22 | 2005-07-07 | Optrex Corp | 基板搬送装置 |
JP2006049352A (ja) * | 2004-07-30 | 2006-02-16 | Sumitomo Osaka Cement Co Ltd | サセプタ装置 |
JP2006157012A (ja) * | 2004-11-29 | 2006-06-15 | Asm Japan Kk | ウエハ移送機構 |
JP2006261377A (ja) * | 2005-03-17 | 2006-09-28 | Ulvac Japan Ltd | 基板搬送ロボット及びこれを備えた基板搬送システム |
JP2006294786A (ja) * | 2005-04-08 | 2006-10-26 | Ulvac Japan Ltd | 基板搬送システム |
JP2006351949A (ja) * | 2005-06-17 | 2006-12-28 | Tokyo Electron Ltd | 基板載置台、基板処理装置および基板載置台の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3138554B2 (ja) | 1992-12-11 | 2001-02-26 | 株式会社荏原製作所 | ウエハ支持装置 |
JP2961480B2 (ja) * | 1993-07-13 | 1999-10-12 | 東芝セラミックス株式会社 | 半導体ウエハ移載用フォーク |
JPH0729959A (ja) * | 1993-07-15 | 1995-01-31 | Kyocera Corp | ウェハ搬送装置 |
JPH10247680A (ja) * | 1997-03-04 | 1998-09-14 | Tokyo Electron Ltd | 高温炉への搬送用フォークおよび熱処理装置 |
TW543079B (en) | 1999-06-03 | 2003-07-21 | Applied Materials Inc | Robot blade for semiconductor processing equipment |
JP2005019700A (ja) | 2003-06-26 | 2005-01-20 | Sumitomo Osaka Cement Co Ltd | 吸着固定装置の製造方法 |
KR20060023735A (ko) * | 2004-09-10 | 2006-03-15 | 삼성전자주식회사 | 웨이퍼 이송 아암 |
-
2007
- 2007-03-30 JP JP2007094552A patent/JP4516089B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-26 KR KR1020080027856A patent/KR100989752B1/ko active IP Right Grant
- 2008-03-28 EP EP08153643A patent/EP1975997A3/en not_active Withdrawn
- 2008-03-28 SG SG200802468-9A patent/SG146590A1/en unknown
- 2008-03-28 CN CNA2008100898067A patent/CN101320704A/zh active Pending
- 2008-03-28 TW TW097111463A patent/TWI455237B/zh not_active IP Right Cessation
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0295244U (ja) * | 1989-01-13 | 1990-07-30 | ||
JPH0474439U (ja) * | 1990-11-13 | 1992-06-30 | ||
JPH0661331A (ja) * | 1992-08-06 | 1994-03-04 | Tokyo Electron Tohoku Ltd | 基板搬送装置 |
JPH0727783U (ja) * | 1994-02-07 | 1995-05-23 | 東京エレクトロン九州株式会社 | 搬入搬出装置 |
JPH08327959A (ja) * | 1994-06-30 | 1996-12-13 | Seiko Epson Corp | ウエハ及び基板の処理装置及び処理方法、ウエハ及び基板の移載装置 |
JPH09246353A (ja) * | 1996-03-08 | 1997-09-19 | Yaskawa Electric Corp | 搬送フォーク |
US6187103B1 (en) * | 1998-08-27 | 2001-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for transporting wafers |
JP2001223252A (ja) * | 2000-02-07 | 2001-08-17 | Assist Japan Kk | ロボットの吸着レスハンド |
JP2002057209A (ja) * | 2000-06-01 | 2002-02-22 | Tokyo Electron Ltd | 枚葉式処理装置および枚葉式処理方法 |
JP2003168717A (ja) * | 2001-12-03 | 2003-06-13 | Yaskawa Electric Corp | ウェハ搬送フォーク |
JP2004165284A (ja) * | 2002-11-11 | 2004-06-10 | Kazuo Tanabe | ウエーハセンタリング装置 |
JP2005101226A (ja) * | 2003-09-24 | 2005-04-14 | Hoya Corp | 基板保持装置,基板処理装置,基板検査装置及び基板保持方法 |
JP2005183784A (ja) * | 2003-12-22 | 2005-07-07 | Optrex Corp | 基板搬送装置 |
JP2006049352A (ja) * | 2004-07-30 | 2006-02-16 | Sumitomo Osaka Cement Co Ltd | サセプタ装置 |
JP2006157012A (ja) * | 2004-11-29 | 2006-06-15 | Asm Japan Kk | ウエハ移送機構 |
JP2006261377A (ja) * | 2005-03-17 | 2006-09-28 | Ulvac Japan Ltd | 基板搬送ロボット及びこれを備えた基板搬送システム |
JP2006294786A (ja) * | 2005-04-08 | 2006-10-26 | Ulvac Japan Ltd | 基板搬送システム |
JP2006351949A (ja) * | 2005-06-17 | 2006-12-28 | Tokyo Electron Ltd | 基板載置台、基板処理装置および基板載置台の製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012514873A (ja) * | 2009-01-11 | 2012-06-28 | アプライド マテリアルズ インコーポレイテッド | 基板を移動させるシステム、装置、および方法 |
JP2012009720A (ja) * | 2010-06-28 | 2012-01-12 | Nikon Corp | ウェハホルダおよび露光装置 |
KR20180091961A (ko) * | 2013-09-26 | 2018-08-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들 |
JP2019004158A (ja) * | 2013-09-26 | 2019-01-10 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板処理のための混合プラットフォームの装置、システム、及び方法 |
US10595415B2 (en) | 2013-09-26 | 2020-03-17 | Applied Materials, Inc. | Electronic device manufacturing system |
KR102161685B1 (ko) | 2013-09-26 | 2020-10-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 프로세싱을 위한 혼합형-플랫폼 장치, 시스템들, 및 방법들 |
US11576264B2 (en) | 2013-09-26 | 2023-02-07 | Applied Materials, Inc. | Electronic device manufacturing system |
Also Published As
Publication number | Publication date |
---|---|
SG146590A1 (en) | 2008-10-30 |
KR20080089207A (ko) | 2008-10-06 |
EP1975997A3 (en) | 2009-10-07 |
CN101320704A (zh) | 2008-12-10 |
JP4516089B2 (ja) | 2010-08-04 |
EP1975997A2 (en) | 2008-10-01 |
KR100989752B1 (ko) | 2010-10-26 |
TWI455237B (zh) | 2014-10-01 |
TW200849458A (en) | 2008-12-16 |
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