JP2008218974A - 電子部品およびその製造方法 - Google Patents
電子部品およびその製造方法 Download PDFInfo
- Publication number
- JP2008218974A JP2008218974A JP2007326152A JP2007326152A JP2008218974A JP 2008218974 A JP2008218974 A JP 2008218974A JP 2007326152 A JP2007326152 A JP 2007326152A JP 2007326152 A JP2007326152 A JP 2007326152A JP 2008218974 A JP2008218974 A JP 2008218974A
- Authority
- JP
- Japan
- Prior art keywords
- internal electrode
- electrode layer
- electronic component
- film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 46
- 229910052762 osmium Inorganic materials 0.000 claims abstract description 43
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 42
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 239000010408 film Substances 0.000 claims description 62
- 238000000034 method Methods 0.000 claims description 58
- 229910045601 alloy Inorganic materials 0.000 claims description 45
- 239000000956 alloy Substances 0.000 claims description 45
- 239000012298 atmosphere Substances 0.000 claims description 42
- 239000000843 powder Substances 0.000 claims description 37
- 238000000137 annealing Methods 0.000 claims description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 29
- 239000001301 oxygen Substances 0.000 claims description 29
- 229910052760 oxygen Inorganic materials 0.000 claims description 29
- 238000010304 firing Methods 0.000 claims description 26
- 239000002245 particle Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 238000010298 pulverizing process Methods 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 abstract description 44
- 230000006866 deterioration Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 227
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 41
- 239000003990 capacitor Substances 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 29
- 239000004020 conductor Substances 0.000 description 24
- 239000007789 gas Substances 0.000 description 18
- 239000011230 binding agent Substances 0.000 description 17
- 238000005245 sintering Methods 0.000 description 17
- 238000005259 measurement Methods 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000012790 adhesive layer Substances 0.000 description 12
- 230000015556 catabolic process Effects 0.000 description 12
- 239000003989 dielectric material Substances 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 10
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 239000000523 sample Substances 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229910000691 Re alloy Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 5
- 229910002113 barium titanate Inorganic materials 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000012159 carrier gas Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 239000002003 electrode paste Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000013077 target material Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- DEPMYWCZAIMWCR-UHFFFAOYSA-N nickel ruthenium Chemical compound [Ni].[Ru] DEPMYWCZAIMWCR-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 239000003232 water-soluble binding agent Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 101000892301 Phomopsis amygdali Geranylgeranyl diphosphate synthase Proteins 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326152A JP2008218974A (ja) | 2007-02-05 | 2007-12-18 | 電子部品およびその製造方法 |
TW097102362A TW200839813A (en) | 2007-02-05 | 2008-01-22 | Electronic device and manufacturing method thereof |
US12/010,814 US20080212258A1 (en) | 2007-02-05 | 2008-01-30 | Electronic device and manufacturing method thereof |
KR1020080011884A KR20080073259A (ko) | 2007-02-05 | 2008-02-05 | 전자 부품 및 그 제조 방법 |
CN2008100881210A CN101241799B (zh) | 2007-02-05 | 2008-02-05 | 电子部件及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007025970 | 2007-02-05 | ||
JP2007326152A JP2008218974A (ja) | 2007-02-05 | 2007-12-18 | 電子部品およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008218974A true JP2008218974A (ja) | 2008-09-18 |
Family
ID=39838601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007326152A Pending JP2008218974A (ja) | 2007-02-05 | 2007-12-18 | 電子部品およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008218974A (zh) |
KR (1) | KR20080073259A (zh) |
CN (1) | CN101241799B (zh) |
TW (1) | TW200839813A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011218268A (ja) * | 2010-04-07 | 2011-11-04 | Murata Mfg Co Ltd | 塗膜形成方法および電子部品 |
JP2019067827A (ja) * | 2017-09-28 | 2019-04-25 | Tdk株式会社 | 積層電子部品 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9450556B2 (en) * | 2009-10-16 | 2016-09-20 | Avx Corporation | Thin film surface mount components |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004319969A (ja) * | 2003-03-31 | 2004-11-11 | Tdk Corp | 電子部品、積層セラミックコンデンサおよびその製造方法 |
WO2005117041A1 (ja) * | 2004-05-31 | 2005-12-08 | Tdk Corporation | 電子部品、積層セラミックコンデンサおよびその製造方法 |
JP2006310646A (ja) * | 2005-04-28 | 2006-11-09 | Tdk Corp | 積層セラミック電子部品の製造方法 |
JP2006319359A (ja) * | 2003-02-05 | 2006-11-24 | Tdk Corp | 電子部品およびその製造方法 |
WO2006137533A1 (ja) * | 2005-06-24 | 2006-12-28 | Tdk Corporation | 電子部品およびその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4098329B2 (ja) * | 2003-02-05 | 2008-06-11 | Tdk株式会社 | 電子部品およびその製造方法 |
-
2007
- 2007-12-18 JP JP2007326152A patent/JP2008218974A/ja active Pending
-
2008
- 2008-01-22 TW TW097102362A patent/TW200839813A/zh unknown
- 2008-02-05 KR KR1020080011884A patent/KR20080073259A/ko not_active Withdrawn
- 2008-02-05 CN CN2008100881210A patent/CN101241799B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319359A (ja) * | 2003-02-05 | 2006-11-24 | Tdk Corp | 電子部品およびその製造方法 |
JP2004319969A (ja) * | 2003-03-31 | 2004-11-11 | Tdk Corp | 電子部品、積層セラミックコンデンサおよびその製造方法 |
WO2005117041A1 (ja) * | 2004-05-31 | 2005-12-08 | Tdk Corporation | 電子部品、積層セラミックコンデンサおよびその製造方法 |
JP2006310646A (ja) * | 2005-04-28 | 2006-11-09 | Tdk Corp | 積層セラミック電子部品の製造方法 |
WO2006137533A1 (ja) * | 2005-06-24 | 2006-12-28 | Tdk Corporation | 電子部品およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011218268A (ja) * | 2010-04-07 | 2011-11-04 | Murata Mfg Co Ltd | 塗膜形成方法および電子部品 |
JP2019067827A (ja) * | 2017-09-28 | 2019-04-25 | Tdk株式会社 | 積層電子部品 |
Also Published As
Publication number | Publication date |
---|---|
TW200839813A (en) | 2008-10-01 |
CN101241799A (zh) | 2008-08-13 |
KR20080073259A (ko) | 2008-08-08 |
CN101241799B (zh) | 2012-06-13 |
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