JP2008166327A5 - - Google Patents

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Publication number
JP2008166327A5
JP2008166327A5 JP2006351000A JP2006351000A JP2008166327A5 JP 2008166327 A5 JP2008166327 A5 JP 2008166327A5 JP 2006351000 A JP2006351000 A JP 2006351000A JP 2006351000 A JP2006351000 A JP 2006351000A JP 2008166327 A5 JP2008166327 A5 JP 2008166327A5
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JP
Japan
Prior art keywords
wiring board
base
wiring
resin portion
silicon interposer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006351000A
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English (en)
Japanese (ja)
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JP4926692B2 (ja
JP2008166327A (ja
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Publication date
Application filed filed Critical
Priority to JP2006351000A priority Critical patent/JP4926692B2/ja
Priority claimed from JP2006351000A external-priority patent/JP4926692B2/ja
Priority to TW096141679A priority patent/TW200832673A/zh
Priority to US11/984,004 priority patent/US7901986B2/en
Priority to CNA2007103011690A priority patent/CN101211888A/zh
Publication of JP2008166327A publication Critical patent/JP2008166327A/ja
Publication of JP2008166327A5 publication Critical patent/JP2008166327A5/ja
Application granted granted Critical
Publication of JP4926692B2 publication Critical patent/JP4926692B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006351000A 2006-12-27 2006-12-27 配線基板及びその製造方法と半導体装置 Active JP4926692B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006351000A JP4926692B2 (ja) 2006-12-27 2006-12-27 配線基板及びその製造方法と半導体装置
TW096141679A TW200832673A (en) 2006-12-27 2007-11-05 Wiring substrate, manufacturing method thereof, and semiconductor device
US11/984,004 US7901986B2 (en) 2006-12-27 2007-11-13 Wiring substrate, manufacturing method thereof, and semiconductor device
CNA2007103011690A CN101211888A (zh) 2006-12-27 2007-12-26 布线基板及其制造方法以及半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006351000A JP4926692B2 (ja) 2006-12-27 2006-12-27 配線基板及びその製造方法と半導体装置

Publications (3)

Publication Number Publication Date
JP2008166327A JP2008166327A (ja) 2008-07-17
JP2008166327A5 true JP2008166327A5 (cg-RX-API-DMAC7.html) 2009-12-10
JP4926692B2 JP4926692B2 (ja) 2012-05-09

Family

ID=39581929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006351000A Active JP4926692B2 (ja) 2006-12-27 2006-12-27 配線基板及びその製造方法と半導体装置

Country Status (4)

Country Link
US (1) US7901986B2 (cg-RX-API-DMAC7.html)
JP (1) JP4926692B2 (cg-RX-API-DMAC7.html)
CN (1) CN101211888A (cg-RX-API-DMAC7.html)
TW (1) TW200832673A (cg-RX-API-DMAC7.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102017133B (zh) 2008-05-09 2012-10-10 国立大学法人九州工业大学 芯片尺寸两面连接封装件及其制造方法
US20090277670A1 (en) * 2008-05-10 2009-11-12 Booth Jr Roger A High Density Printed Circuit Board Interconnect and Method of Assembly
KR20100037300A (ko) * 2008-10-01 2010-04-09 삼성전자주식회사 내장형 인터포저를 갖는 반도체장치의 형성방법
JP5518879B2 (ja) * 2009-09-21 2014-06-11 株式会社東芝 ３次元集積回路製造方法、及び装置
US8592973B2 (en) * 2009-10-16 2013-11-26 Stats Chippac Ltd. Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof
JP5352437B2 (ja) 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8581394B2 (en) 2010-06-21 2013-11-12 Samsung Electro-Mechanics Co., Ltd Semiconductor package module and electric circuit assembly with the same
US9059187B2 (en) * 2010-09-30 2015-06-16 Ibiden Co., Ltd. Electronic component having encapsulated wiring board and method for manufacturing the same
KR101719636B1 (ko) * 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법
US20120292777A1 (en) * 2011-05-18 2012-11-22 Lotz Jonathan P Backside Power Delivery Using Die Stacking
US20130154106A1 (en) 2011-12-14 2013-06-20 Broadcom Corporation Stacked Packaging Using Reconstituted Wafers
US9548251B2 (en) 2012-01-12 2017-01-17 Broadcom Corporation Semiconductor interposer having a cavity for intra-interposer die
US20130187284A1 (en) 2012-01-24 2013-07-25 Broadcom Corporation Low Cost and High Performance Flip Chip Package
US8587132B2 (en) 2012-02-21 2013-11-19 Broadcom Corporation Semiconductor package including an organic substrate and interposer having through-semiconductor vias
US8558395B2 (en) 2012-02-21 2013-10-15 Broadcom Corporation Organic interface substrate having interposer with through-semiconductor vias
US9275976B2 (en) 2012-02-24 2016-03-01 Broadcom Corporation System-in-package with integrated socket
US8872321B2 (en) 2012-02-24 2014-10-28 Broadcom Corporation Semiconductor packages with integrated heat spreaders
DE102012202826A1 (de) * 2012-02-24 2013-08-29 Robert Bosch Gmbh Stromsensor zur Befestigung an einer Stromschiene
US8749072B2 (en) 2012-02-24 2014-06-10 Broadcom Corporation Semiconductor package with integrated selectively conductive film interposer
US8928128B2 (en) 2012-02-27 2015-01-06 Broadcom Corporation Semiconductor package with integrated electromagnetic shielding
US9368458B2 (en) 2013-07-10 2016-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Die-on-interposer assembly with dam structure and method of manufacturing the same
CN105493268B (zh) 2013-08-26 2019-01-22 日立金属株式会社 安装基板用衬底、多层陶瓷基板、安装基板、芯片模块和安装基板用衬底的制造方法
TWI493195B (zh) * 2013-11-04 2015-07-21 Via Tech Inc 探針卡
US12068231B2 (en) * 2014-05-24 2024-08-20 Broadpak Corporation 3D integrations and methods of making thereof
JP2016058596A (ja) * 2014-09-11 2016-04-21 ソニー株式会社 電子デバイス、部品実装基板及び電子機器
TWI566305B (zh) * 2014-10-29 2017-01-11 巨擘科技股份有限公司 製造三維積體電路的方法
US10068181B1 (en) 2015-04-27 2018-09-04 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafer and methods for making the same
US9859202B2 (en) * 2015-06-24 2018-01-02 Dyi-chung Hu Spacer connector
WO2017082416A1 (ja) * 2015-11-11 2017-05-18 京セラ株式会社 電子部品パッケージ
FR3044864B1 (fr) * 2015-12-02 2018-01-12 Valeo Systemes De Controle Moteur Dispositif electrique et procede d'assemblage d'un tel dispositif electrique
US10181447B2 (en) 2017-04-21 2019-01-15 Invensas Corporation 3D-interconnect
US10687419B2 (en) * 2017-06-13 2020-06-16 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
US11121301B1 (en) 2017-06-19 2021-09-14 Rigetti & Co, Inc. Microwave integrated quantum circuits with cap wafers and their methods of manufacture
US11281608B2 (en) * 2017-12-11 2022-03-22 Micron Technology, Inc. Translation system for finer grain memory architectures
KR102661196B1 (ko) * 2019-11-08 2024-04-29 삼성전자 주식회사 적층형 기판을 포함하는 전자 장치
CN113053758A (zh) 2019-12-27 2021-06-29 台湾积体电路制造股份有限公司 半导体器件的制造方法
US11515173B2 (en) * 2019-12-27 2022-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices and methods of manufacturing
US11540396B2 (en) * 2020-08-28 2022-12-27 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
US20220069489A1 (en) * 2020-08-28 2022-03-03 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
CN111933590B (zh) * 2020-09-11 2021-01-01 甬矽电子(宁波)股份有限公司 封装结构和封装结构制作方法
CN113270327B (zh) * 2021-07-20 2021-12-07 珠海越亚半导体股份有限公司 主被动器件垂直叠层嵌埋封装结构及其制作方法
US12040284B2 (en) 2021-11-12 2024-07-16 Invensas Llc 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna
CN116825746A (zh) * 2023-07-03 2023-09-29 武汉新芯集成电路制造有限公司 半导体封装结构及其制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG75958A1 (en) * 1998-06-01 2000-10-24 Hitachi Ulsi Sys Co Ltd Semiconductor device and a method of producing semiconductor device
JP2001102479A (ja) * 1999-09-27 2001-04-13 Toshiba Corp 半導体集積回路装置およびその製造方法
JP2002222901A (ja) * 2001-01-29 2002-08-09 Sony Corp 半導体デバイスの実装方法及びその実装構造、半導体装置の製造方法及び半導体装置
JP3679786B2 (ja) * 2002-06-25 2005-08-03 松下電器産業株式会社 半導体装置の製造方法
JP4390541B2 (ja) * 2003-02-03 2009-12-24 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
JP3917946B2 (ja) 2003-03-11 2007-05-23 富士通株式会社 積層型半導体装置
KR100702566B1 (ko) * 2003-04-07 2007-04-04 히다치 가세고교 가부시끼가이샤 밀봉용 에폭시 수지 성형 재료 및 반도체 장치
JP2005039232A (ja) * 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP4205613B2 (ja) * 2004-03-01 2009-01-07 エルピーダメモリ株式会社 半導体装置
JP4441328B2 (ja) * 2004-05-25 2010-03-31 株式会社ルネサステクノロジ 半導体装置及びその製造方法
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
JP4551255B2 (ja) * 2005-03-31 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置
JP2007036104A (ja) * 2005-07-29 2007-02-08 Nec Electronics Corp 半導体装置およびその製造方法
US7608921B2 (en) * 2006-12-07 2009-10-27 Stats Chippac, Inc. Multi-layer semiconductor package

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