JP2008147550A - ワイヤボンディング方法 - Google Patents
ワイヤボンディング方法 Download PDFInfo
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- JP2008147550A JP2008147550A JP2006335577A JP2006335577A JP2008147550A JP 2008147550 A JP2008147550 A JP 2008147550A JP 2006335577 A JP2006335577 A JP 2006335577A JP 2006335577 A JP2006335577 A JP 2006335577A JP 2008147550 A JP2008147550 A JP 2008147550A
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Abstract
【解決手段】キャピラリ100の先端部を、配線50上に形成され当該先端部をクリーニングするためのクリーニング部材としてのボール41に押し当てた状態で、キャピラリ100を振動させることにより、キャピラリ100の先端部に付着した汚れKを擦り落とすクリーニング工程を備える。
【選択図】図3
Description
図1は、本発明の第1実施形態に係る電子装置S1の概略断面図である。
図7(a)は、本発明の第2実施形態に係る電子装置S2の概略断面図であり、図7(b)は(a)中の丸で囲んだA部の拡大図である。
なお、上記実施形態では、上記配線50(図1参照)や上記パッド30(上記図7、図8参照)など、電子装置における既存の部材を利用して、クリーニング工程を行ったが、別途、クリーニング部材を用意してもよい。たとえば、Auめっきされたプレートなどを別途用意してもよい。
30…被接合部材としての導体部材(パッド)、40…ボンディングワイヤ、
41…ボール、50…配線、60…バンプ、100…キャピラリ。
Claims (6)
- ボールボンディング用のキャピラリ(100)の内部にワイヤ(40)を挿入し、
前記キャピラリ(100)の先端部から導出された前記ワイヤ(40)を、被接合部材(20、30)に押し当てた状態で、前記キャピラリ(100)を振動させることにより、前記ワイヤ(40)を前記被接合部材(20、30)に接合するようにしたワイヤボンディング方法において、
前記キャピラリ(100)の先端部を、当該先端部をクリーニングするためのクリーニング部材(30、41、50)に押し当てた状態で、前記キャピラリ(100)を振動させることにより、前記キャピラリ(100)の先端部に付着した汚れを擦り落とすクリーニング工程を備えることを特徴とするワイヤボンディング方法。 - 前記被接合部材(20)は基板(10)の一面上に配置されたものであり、前記基板(10)には前記ワイヤ(40)が接合されない配線(50)が設けられており、
前記クリーニング工程では、前記配線(50)に対して前記ワイヤ(40)によるボールボンディングを行って前記クリーニング部材としてのボール(41)を形成するとともに、このボール(41)に前記キャピラリ(100)の先端部を押し当てて前記汚れを擦り落とすための振動を行うようにすることを特徴とする請求項1に記載のワイヤボンディング方法。 - 前記被接合部材(20)は基板(10)の一面上に配置されたものであり、前記基板(10)には前記ワイヤ(40)が接合されない配線(50)が設けられており、
前記クリーニング工程では、前記配線(50)を前記クリーニング部材として兼用し、前記配線(50)に対して前記ワイヤ(40)による1次ボンディングおよび2次ボンディングを行うとともに、当該2次ボンディングにおいて前記配線(50)に前記キャピラリ(100)の先端部を押し当てて前記汚れを擦り落とすための振動を行うことを特徴とする請求項1に記載のワイヤボンディング方法。 - 前記ワイヤ(40)を前記被接合部材(30)に接合する工程は、前記被接合部材(30)に対して1次ボンディングおよび2次ボンディングを行うことにより、前記被接合部材(30)に接合された前記ワイヤ(40)としてのバンプ(60)を形成するものであり、
前記クリーニング工程は、前記バンプ(60)を形成するための前記2次ボンディングを行うときに同時に行うものであって、前記被接合部材(30)のうち当該2次ボンディングが行われる部位を前記クリーニング部材として、当該部位に前記キャピラリ(100)の先端部を押し当てて振動させるものであることを特徴とする請求項1に記載のワイヤボンディング方法。 - 前記クリーニング部材(30、41、50)は金または銅よりなるものであることを特徴とする請求項1ないし4のいずれか1つに記載のワイヤボンディング方法。
- 前記クリーニング工程における前記キャピラリ(100)の振動パワーを、前記ワイヤ(40)を前記被接合部材(20、30)に接合する工程における前記キャピラリ(100)の振動パワーよりも大きなものとすることを特徴とする請求項1ないし3のいずれか1つに記載のワイヤボンディング方法。
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JP2016167556A (ja) * | 2015-03-10 | 2016-09-15 | 富士ゼロックス株式会社 | 基板、基板装置、光学装置、画像形成装置、ワイヤーボンディング方法及び基板装置の製造方法 |
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