JP2008128838A - プローブ装置 - Google Patents

プローブ装置 Download PDF

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Publication number
JP2008128838A
JP2008128838A JP2006314568A JP2006314568A JP2008128838A JP 2008128838 A JP2008128838 A JP 2008128838A JP 2006314568 A JP2006314568 A JP 2006314568A JP 2006314568 A JP2006314568 A JP 2006314568A JP 2008128838 A JP2008128838 A JP 2008128838A
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JP
Japan
Prior art keywords
probe
semiconductor device
support substrate
heating element
resistance heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006314568A
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English (en)
Japanese (ja)
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JP2008128838A5 (https=
Inventor
Masahiro Haruhara
昌宏 春原
Mitsutoshi Azuma
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2006314568A priority Critical patent/JP2008128838A/ja
Priority to KR1020070113563A priority patent/KR20080046093A/ko
Priority to TW096143651A priority patent/TW200823472A/zh
Priority to US11/984,601 priority patent/US7667474B2/en
Priority to EP07022621A priority patent/EP1925945A3/en
Publication of JP2008128838A publication Critical patent/JP2008128838A/ja
Publication of JP2008128838A5 publication Critical patent/JP2008128838A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2006314568A 2006-11-21 2006-11-21 プローブ装置 Pending JP2008128838A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006314568A JP2008128838A (ja) 2006-11-21 2006-11-21 プローブ装置
KR1020070113563A KR20080046093A (ko) 2006-11-21 2007-11-08 프로브 장치
TW096143651A TW200823472A (en) 2006-11-21 2007-11-19 Probe device
US11/984,601 US7667474B2 (en) 2006-11-21 2007-11-20 Probe device
EP07022621A EP1925945A3 (en) 2006-11-21 2007-11-21 Probe device with heating unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006314568A JP2008128838A (ja) 2006-11-21 2006-11-21 プローブ装置

Publications (2)

Publication Number Publication Date
JP2008128838A true JP2008128838A (ja) 2008-06-05
JP2008128838A5 JP2008128838A5 (https=) 2009-09-24

Family

ID=39174214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006314568A Pending JP2008128838A (ja) 2006-11-21 2006-11-21 プローブ装置

Country Status (5)

Country Link
US (1) US7667474B2 (https=)
EP (1) EP1925945A3 (https=)
JP (1) JP2008128838A (https=)
KR (1) KR20080046093A (https=)
TW (1) TW200823472A (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010164490A (ja) * 2009-01-16 2010-07-29 Micronics Japan Co Ltd 集積回路の試験装置
JP2010186851A (ja) * 2009-02-12 2010-08-26 Oki Semiconductor Co Ltd 半導体集積回路の検査装置及び半導体集積回路の検査方法
JP2010266403A (ja) * 2009-05-18 2010-11-25 Micronics Japan Co Ltd 検査装置
JP2012174873A (ja) * 2011-02-21 2012-09-10 Shibasoku:Kk 試験装置
JP2013229496A (ja) * 2012-04-26 2013-11-07 Mitsubishi Electric Corp 検査装置
KR101394354B1 (ko) * 2012-03-09 2014-05-13 도쿄엘렉트론가부시키가이샤 웨이퍼 검사용 인터페이스 및 웨이퍼 검사 장치
CN104237578A (zh) * 2013-06-12 2014-12-24 日本麦可罗尼克斯股份有限公司 探针卡及其制造方法
KR102023742B1 (ko) * 2019-01-31 2019-11-04 (주)래딕스 테스트 핀 조립체
JP2020047849A (ja) * 2018-09-20 2020-03-26 東京エレクトロン株式会社 検査装置及び検査方法
JP2020181970A (ja) * 2019-04-25 2020-11-05 東京エレクトロン株式会社 検査装置及びプローブカードの温度調整方法
JP2022058826A (ja) * 2015-03-30 2022-04-12 株式会社東京精密 プローバ

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5074878B2 (ja) * 2007-10-15 2012-11-14 東京エレクトロン株式会社 検査装置
KR100977165B1 (ko) 2008-08-29 2010-08-20 주식회사 코리아 인스트루먼트 프로브 기판 및 이를 구비하는 프로브 카드
JP5199859B2 (ja) * 2008-12-24 2013-05-15 株式会社日本マイクロニクス プローブカード
JP5258547B2 (ja) 2008-12-26 2013-08-07 株式会社日本マイクロニクス 集積回路の検査方法及び装置
KR101474951B1 (ko) * 2009-02-17 2014-12-24 삼성전자주식회사 반도체 디바이스 테스트 장치
US8400173B2 (en) * 2009-06-26 2013-03-19 Formfactor, Inc. Method and apparatus for thermally conditioning probe cards
US8540422B2 (en) 2010-10-04 2013-09-24 Cameron Health, Inc. Electrical component behavior analysis tools
US8546904B2 (en) * 2011-07-11 2013-10-01 Transcend Information, Inc. Integrated circuit with temperature increasing element and electronic system having the same
TWM436227U (en) * 2012-03-23 2012-08-21 Mpi Corp Heating point testing appliances
TWI506283B (zh) * 2012-11-12 2015-11-01 Mpi Corp Low power loss probe card structure
KR102077062B1 (ko) 2013-02-25 2020-02-13 삼성전자주식회사 프로브 카드 및 이를 포함하는 프로빙 장치
TWI481882B (zh) * 2013-04-12 2015-04-21 Giga Byte Tech Co Ltd 電路板測試系統及其測試方法
US10107856B2 (en) * 2014-10-21 2018-10-23 Stmicroelectronics S.R.L. Apparatus for the thermal testing of electronic devices and corresponding method
US11280827B2 (en) 2016-02-29 2022-03-22 Teradyne, Inc. Thermal control of a probe card assembly
JP6782103B2 (ja) * 2016-06-21 2020-11-11 株式会社日本マイクロニクス プローブカード、検査装置および検査方法
JP7267507B2 (ja) * 2019-12-13 2023-05-01 シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド チップ検出装置、チップ検出システム及び制御方法
JP7829278B2 (ja) * 2020-12-09 2026-03-13 東京エレクトロン株式会社 電源および検査装置
JP2022096153A (ja) * 2020-12-17 2022-06-29 住友電気工業株式会社 電子デバイスの検査装置及び検査方法
TWI782443B (zh) * 2021-03-10 2022-11-01 陽榮科技股份有限公司 半導體測試之溫度控制裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0315989U (https=) * 1989-06-30 1991-02-18
JPH0954116A (ja) * 1995-08-10 1997-02-25 Nippon Denshi Zairyo Kk 高温測定用プローブカード
JP2000346875A (ja) * 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2004150999A (ja) * 2002-10-31 2004-05-27 Advantest Corp プローブカード

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1000697A6 (fr) * 1987-10-28 1989-03-14 Irish Transformers Ltd Appareil pour tester des circuits electriques integres.
US4839587A (en) * 1988-03-29 1989-06-13 Digital Equipment Corporation Test fixture for tab circuits and devices
US5124639A (en) * 1990-11-20 1992-06-23 Motorola, Inc. Probe card apparatus having a heating element and process for using the same
JP3214766B2 (ja) * 1992-08-06 2001-10-02 アジレント・テクノロジーズ・インク 接続検査のための装置
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6181145B1 (en) * 1997-10-13 2001-01-30 Matsushita Electric Industrial Co., Ltd. Probe card
JP2000138268A (ja) 1998-11-04 2000-05-16 Hitachi Chem Co Ltd 半導体回路の検査方法及び検査装置
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
JP4173306B2 (ja) * 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
JP2006314568A (ja) 2005-05-13 2006-11-24 Daiichi Shokai Co Ltd 遊技機
US7495458B2 (en) * 2006-05-17 2009-02-24 Texas Instruments Incorporated Probe card and temperature stabilizer for testing semiconductor devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0315989U (https=) * 1989-06-30 1991-02-18
JPH0954116A (ja) * 1995-08-10 1997-02-25 Nippon Denshi Zairyo Kk 高温測定用プローブカード
JP2000346875A (ja) * 1999-06-07 2000-12-15 Advantest Corp プローブカードおよびこれを用いたｉｃ試験装置
JP2004150999A (ja) * 2002-10-31 2004-05-27 Advantest Corp プローブカード

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010164490A (ja) * 2009-01-16 2010-07-29 Micronics Japan Co Ltd 集積回路の試験装置
JP2010186851A (ja) * 2009-02-12 2010-08-26 Oki Semiconductor Co Ltd 半導体集積回路の検査装置及び半導体集積回路の検査方法
JP2010266403A (ja) * 2009-05-18 2010-11-25 Micronics Japan Co Ltd 検査装置
JP2012174873A (ja) * 2011-02-21 2012-09-10 Shibasoku:Kk 試験装置
KR101394354B1 (ko) * 2012-03-09 2014-05-13 도쿄엘렉트론가부시키가이샤 웨이퍼 검사용 인터페이스 및 웨이퍼 검사 장치
US9395405B2 (en) 2012-03-09 2016-07-19 Tokyo Electron Limited Wafer inspection interface and wafer inspection apparatus
JP2013229496A (ja) * 2012-04-26 2013-11-07 Mitsubishi Electric Corp 検査装置
CN104237578A (zh) * 2013-06-12 2014-12-24 日本麦可罗尼克斯股份有限公司 探针卡及其制造方法
JP2023067997A (ja) * 2015-03-30 2023-05-16 株式会社東京精密 プローバ
JP2022058826A (ja) * 2015-03-30 2022-04-12 株式会社東京精密 プローバ
JP7245984B2 (ja) 2015-03-30 2023-03-27 株式会社東京精密 プローバ
JP7503735B2 (ja) 2015-03-30 2024-06-21 株式会社東京精密 プローバ
JP2024109990A (ja) * 2015-03-30 2024-08-14 株式会社東京精密 プローバ
JP7692145B2 (ja) 2015-03-30 2025-06-13 株式会社東京精密 プローバ
JP2020047849A (ja) * 2018-09-20 2020-03-26 東京エレクトロン株式会社 検査装置及び検査方法
CN110931390A (zh) * 2018-09-20 2020-03-27 东京毅力科创株式会社 检查装置和检查方法
JP7090517B2 (ja) 2018-09-20 2022-06-24 東京エレクトロン株式会社 検査装置及び検査方法
CN110931390B (zh) * 2018-09-20 2023-12-12 东京毅力科创株式会社 检查装置和检查方法
KR102023742B1 (ko) * 2019-01-31 2019-11-04 (주)래딕스 테스트 핀 조립체
JP2020181970A (ja) * 2019-04-25 2020-11-05 東京エレクトロン株式会社 検査装置及びプローブカードの温度調整方法
JP7345320B2 (ja) 2019-04-25 2023-09-15 東京エレクトロン株式会社 検査装置及びプローブカードの温度調整方法

Also Published As

Publication number Publication date
US20080116925A1 (en) 2008-05-22
TW200823472A (en) 2008-06-01
KR20080046093A (ko) 2008-05-26
US7667474B2 (en) 2010-02-23
EP1925945A2 (en) 2008-05-28
EP1925945A3 (en) 2011-04-27

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