JP2008124446A5 - - Google Patents
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- Publication number
- JP2008124446A5 JP2008124446A5 JP2007268168A JP2007268168A JP2008124446A5 JP 2008124446 A5 JP2008124446 A5 JP 2008124446A5 JP 2007268168 A JP2007268168 A JP 2007268168A JP 2007268168 A JP2007268168 A JP 2007268168A JP 2008124446 A5 JP2008124446 A5 JP 2008124446A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern forming
- conductive pattern
- fine particles
- conductive
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010419 fine particle Substances 0.000 claims 13
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- 239000000843 powder Substances 0.000 claims 6
- 239000000126 substance Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000002245 particle Substances 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000000996 additive effect Effects 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 1
- 229910000480 nickel oxide Inorganic materials 0.000 claims 1
- 238000000879 optical micrograph Methods 0.000 claims 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007268168A JP5252473B2 (ja) | 2006-10-19 | 2007-10-15 | 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 |
| EP07829964.1A EP2075802B1 (en) | 2006-10-19 | 2007-10-17 | Conductive pattern forming film, and conductive pattern forming method |
| US12/443,482 US8278561B2 (en) | 2006-10-19 | 2007-10-17 | Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film |
| KR1020097007319A KR20090064445A (ko) | 2006-10-19 | 2007-10-17 | 도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치 |
| PCT/JP2007/070230 WO2008047823A1 (en) | 2006-10-19 | 2007-10-17 | Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006284445 | 2006-10-19 | ||
| JP2006284445 | 2006-10-19 | ||
| JP2007268168A JP5252473B2 (ja) | 2006-10-19 | 2007-10-15 | 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008124446A JP2008124446A (ja) | 2008-05-29 |
| JP2008124446A5 true JP2008124446A5 (enExample) | 2010-02-25 |
| JP5252473B2 JP5252473B2 (ja) | 2013-07-31 |
Family
ID=39314045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007268168A Expired - Fee Related JP5252473B2 (ja) | 2006-10-19 | 2007-10-15 | 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8278561B2 (enExample) |
| EP (1) | EP2075802B1 (enExample) |
| JP (1) | JP5252473B2 (enExample) |
| KR (1) | KR20090064445A (enExample) |
| WO (1) | WO2008047823A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8802387B2 (en) | 2008-04-30 | 2014-08-12 | Nanyang Technological University | Methods and compounds for detecting beta-lactamase activity |
| WO2011065271A1 (ja) * | 2009-11-24 | 2011-06-03 | 独立行政法人産業技術総合研究所 | 導電性基板とその製造方法 |
| US9412623B2 (en) * | 2011-06-08 | 2016-08-09 | Cbrite Inc. | Metal oxide TFT with improved source/drain contacts and reliability |
| US8679905B2 (en) * | 2011-06-08 | 2014-03-25 | Cbrite Inc. | Metal oxide TFT with improved source/drain contacts |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| CN104885576B (zh) * | 2012-12-31 | 2017-12-05 | 阿莫绿色技术有限公司 | 柔性印刷电路基板及其制造方法 |
| KR101560268B1 (ko) * | 2014-04-21 | 2015-10-14 | 경희대학교 산학협력단 | 플렉서블 기판용 배리어 막 형성 방법 |
| US10235061B1 (en) * | 2016-09-26 | 2019-03-19 | EMC IP Holding Company LLC | Granular virtual machine snapshots |
| CN111356574A (zh) * | 2017-12-22 | 2020-06-30 | 惠普发展公司，有限责任合伙企业 | 三维对象中的编码 |
| CN108718479A (zh) * | 2018-07-13 | 2018-10-30 | 上海德门信息技术有限公司 | 一种液晶聚合物银浆的柔性电路基板及其制备方法和应用 |
| EP4145621A4 (en) * | 2020-05-01 | 2024-04-03 | Dai Nippon Printing Co., Ltd. | PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD |
| CN216930463U (zh) * | 2021-10-09 | 2022-07-08 | 北京梦之墨科技有限公司 | 一种lcp电路板、多层lcp电路板及电子器件 |
| CN114783298B (zh) * | 2022-05-25 | 2023-08-01 | 苏州华星光电技术有限公司 | 柔性屏的校平装置和柔性屏的校平方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB869295A (en) * | 1956-09-28 | 1961-05-31 | Nippon Telegraph & Telephone | Conductive paint and its application |
| JPS59195837A (ja) * | 1983-04-21 | 1984-11-07 | Sharp Corp | Ｌｓｉチツプボンデイング方法 |
| US4960614A (en) * | 1987-02-06 | 1990-10-02 | Key-Tech, Inc. | Printed circuit board |
| JPH03152992A (ja) * | 1989-10-27 | 1991-06-28 | W R Grace & Co | 印刷回路板及びその製造方法 |
| DE69121449T2 (de) * | 1990-04-12 | 1997-02-27 | Matsushita Electric Ind Co Ltd | Leitende Tintenzusammensetzung und Verfahren zum Herstellen eines dickschichtigen Musters |
| DE69216658T2 (de) * | 1991-02-25 | 1997-08-07 | Canon Kk | Vorrichtung und Verfahren zur Verbindung elektrischer Bauelemente |
| US5197655A (en) * | 1992-06-05 | 1993-03-30 | International Business Machines Corporation | Fine pitch solder application |
| US6034331A (en) * | 1996-07-23 | 2000-03-07 | Hitachi Chemical Company, Ltd. | Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet |
| JP2000113919A (ja) * | 1998-08-03 | 2000-04-21 | Sony Corp | 電気的接続装置と電気的接続方法 |
| JP2000195584A (ja) * | 1998-12-25 | 2000-07-14 | Sony Corp | 電気的接続装置と電気的接続方法 |
| KR100305750B1 (ko) * | 1999-03-10 | 2001-09-24 | 윤덕용 | 플라스틱 기판의 플립 칩 접속용 이방성 전도성 접착제의 제조방법 |
| JP2001064547A (ja) * | 1999-09-01 | 2001-03-13 | Toyo Ink Mfg Co Ltd | 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ |
| JP2001135138A (ja) * | 1999-10-29 | 2001-05-18 | Matsushita Electric Ind Co Ltd | 導体ペースト |
| JP2001243836A (ja) | 1999-12-21 | 2001-09-07 | Murata Mfg Co Ltd | 導電性ペースト及びそれを用いた印刷配線板 |
| JP2003089282A (ja) * | 2001-09-18 | 2003-03-25 | Fuji Xerox Co Ltd | スクリーン印刷版及びその製造方法、スクリーン印刷版の製造装置、スクリーン印刷方法、スクリーン印刷装置、並びにスクリーン印刷物 |
| JP4042497B2 (ja) * | 2002-04-15 | 2008-02-06 | セイコーエプソン株式会社 | 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体 |
| EP1398673A3 (en) * | 2002-09-12 | 2005-08-31 | Canon Kabushiki Kaisha | Developer |
| US20040178391A1 (en) | 2003-01-29 | 2004-09-16 | Conaghan Brian F. | High conductivity inks with low minimum curing temperatures |
| JP4414145B2 (ja) | 2003-03-06 | 2010-02-10 | ハリマ化成株式会社 | 導電性ナノ粒子ペースト |
| DE602004024672D1 (de) * | 2003-06-25 | 2010-01-28 | Hitachi Chemical Co Ltd | Schaltglied-verbindungsstruktur und herstellungsverfahren dafür |
| US20050153107A1 (en) * | 2004-01-12 | 2005-07-14 | Tdk Corporation | Substrate having functional layer pattern formed thereon and method of forming functional layer pattern |
| JP2005259848A (ja) | 2004-03-10 | 2005-09-22 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2006024485A (ja) * | 2004-07-09 | 2006-01-26 | Mitsubishi Paper Mills Ltd | 導電性膜または導電性画像作製方法 |
| JP4934993B2 (ja) * | 2005-05-25 | 2012-05-23 | 住友電気工業株式会社 | 導電性ペーストおよびそれを用いた配線基板 |
-
2007
- 2007-10-15 JP JP2007268168A patent/JP5252473B2/ja not_active Expired - Fee Related
- 2007-10-17 EP EP07829964.1A patent/EP2075802B1/en not_active Ceased
- 2007-10-17 US US12/443,482 patent/US8278561B2/en not_active Expired - Fee Related
- 2007-10-17 WO PCT/JP2007/070230 patent/WO2008047823A1/ja not_active Ceased
- 2007-10-17 KR KR1020097007319A patent/KR20090064445A/ko not_active Ceased
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