GB869295A - Conductive paint and its application - Google Patents

Conductive paint and its application

Info

Publication number
GB869295A
GB869295A GB1745057A GB1745057A GB869295A GB 869295 A GB869295 A GB 869295A GB 1745057 A GB1745057 A GB 1745057A GB 1745057 A GB1745057 A GB 1745057A GB 869295 A GB869295 A GB 869295A
Authority
GB
United Kingdom
Prior art keywords
granules
resin
conductive
plasticizer
room temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1745057A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Publication of GB869295A publication Critical patent/GB869295A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D157/00—Coating compositions based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

An electrically conductive coating composition comprises granules of thermoplastic resin and granules of a conductive material of smaller size than the resin dispersed in a medium in which the resin is insoluble at room temperature. The dispersing medium may be water, a plasticizer or mixture of plasticizer and diluent. The coating may be dried at room temperature or by heating, if desired under pressure. The mean diameter of the conductive granules is preferably below 0,3, e.g. 0,05 to 0,1, microns. The specified resin granules have diameters of 0,2 to 1 micron. Specified ingredients are:-resins-polyvinyl acetate, polyvinyl chloride, polystyrene, polyvinylidene chloride; conductive material-copper, silver, acetylene black; plasticizers-dioctyl phthalate and adipate. The coatings may be applied to non-conductive surfaces and used as a base in electroplating, or cast into films, or the compositions may be used as inks.
GB1745057A 1956-09-28 1957-05-31 Conductive paint and its application Expired GB869295A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP869295X 1956-09-28

Publications (1)

Publication Number Publication Date
GB869295A true GB869295A (en) 1961-05-31

Family

ID=13900536

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1745057A Expired GB869295A (en) 1956-09-28 1957-05-31 Conductive paint and its application

Country Status (2)

Country Link
DE (1) DE1200405B (en)
GB (1) GB869295A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3162551A (en) * 1962-12-07 1964-12-22 Du Pont Solder
US3331127A (en) * 1962-02-15 1967-07-18 Kerkhof Horst Method of produing printed circuit boards
DE1301186B (en) * 1963-09-19 1969-08-14 Basf Ag Process for the metallization of surfaces of plastic objects
US4221830A (en) * 1975-10-24 1980-09-09 Societe Des Plastiques De Carmaux Scasar Method for producing antistatic synthetic polymer film, article made thereby, and method of use
US4282682A (en) * 1976-12-07 1981-08-11 Societe Des Plastiques De Carmaux Scasar Method of mulching with antistatic synthetic polymer film
FR2560603A1 (en) * 1984-03-02 1985-09-06 Seiko Instr & Electronics CONDUCTIVE COMPOSITION FOR ELECTRODEPOSITION CONTAINING A POLYMER
WO2008047823A1 (en) 2006-10-19 2008-04-24 National Institute Of Advanced Industrial Science And Technology Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
ES2345426A1 (en) * 2009-03-02 2010-09-22 Vicenta De La Montaña Exposito Transformation procedure for children's shoes or sports decorative sports and children's or metalized sports shoes. (Machine-translation by Google Translate, not legally binding)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2461352A (en) * 1946-11-06 1949-02-08 California Research Corp Water-in-oil emulsion paints containing a leafing pigment
CH286858A (en) * 1950-05-27 1952-11-15 Robert Dr Jucker Process for protecting metallic surfaces against corrosion.
US2718506A (en) * 1950-08-22 1955-09-20 Ici Ltd Electrically conducting coating compositions containing a nonoxidized magnetic metal powder

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3331127A (en) * 1962-02-15 1967-07-18 Kerkhof Horst Method of produing printed circuit boards
US3162551A (en) * 1962-12-07 1964-12-22 Du Pont Solder
DE1301186B (en) * 1963-09-19 1969-08-14 Basf Ag Process for the metallization of surfaces of plastic objects
US4221830A (en) * 1975-10-24 1980-09-09 Societe Des Plastiques De Carmaux Scasar Method for producing antistatic synthetic polymer film, article made thereby, and method of use
US4282682A (en) * 1976-12-07 1981-08-11 Societe Des Plastiques De Carmaux Scasar Method of mulching with antistatic synthetic polymer film
GB2155023A (en) * 1984-03-02 1985-09-18 Seiko Instr & Electronics Electrically conductive high molecular resin composition for electrodeposition coating
FR2560603A1 (en) * 1984-03-02 1985-09-06 Seiko Instr & Electronics CONDUCTIVE COMPOSITION FOR ELECTRODEPOSITION CONTAINING A POLYMER
NL8500576A (en) * 1984-03-02 1985-10-01 Seiko Instr & Electronics ELECTRICALLY CONDUCTIVE COMPOSITION FOR ELECTROLYTIC COATING.
WO2008047823A1 (en) 2006-10-19 2008-04-24 National Institute Of Advanced Industrial Science And Technology Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
EP2075802A1 (en) * 2006-10-19 2009-07-01 National Institute Of Advanced Industrial Science and Technology Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
EP2075802A4 (en) * 2006-10-19 2010-11-03 Nat Inst Of Advanced Ind Scien Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
US8278561B2 (en) 2006-10-19 2012-10-02 National Institute Of Advanced Industrial Science And Technology Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
ES2345426A1 (en) * 2009-03-02 2010-09-22 Vicenta De La Montaña Exposito Transformation procedure for children's shoes or sports decorative sports and children's or metalized sports shoes. (Machine-translation by Google Translate, not legally binding)

Also Published As

Publication number Publication date
DE1200405B (en) 1965-09-09

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