JP5252473B2 - 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 - Google Patents

導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 Download PDF

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Publication number
JP5252473B2
JP5252473B2 JP2007268168A JP2007268168A JP5252473B2 JP 5252473 B2 JP5252473 B2 JP 5252473B2 JP 2007268168 A JP2007268168 A JP 2007268168A JP 2007268168 A JP2007268168 A JP 2007268168A JP 5252473 B2 JP5252473 B2 JP 5252473B2
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JP
Japan
Prior art keywords
conductive pattern
pattern forming
pressure
conductive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007268168A
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English (en)
Japanese (ja)
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JP2008124446A (ja
JP2008124446A5 (enExample
Inventor
俊英 鎌田
学 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
National Institute of Advanced Industrial Science and Technology AIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute of Advanced Industrial Science and Technology AIST filed Critical National Institute of Advanced Industrial Science and Technology AIST
Priority to JP2007268168A priority Critical patent/JP5252473B2/ja
Priority to EP07829964.1A priority patent/EP2075802B1/en
Priority to KR1020097007319A priority patent/KR20090064445A/ko
Priority to PCT/JP2007/070230 priority patent/WO2008047823A1/ja
Priority to US12/443,482 priority patent/US8278561B2/en
Publication of JP2008124446A publication Critical patent/JP2008124446A/ja
Publication of JP2008124446A5 publication Critical patent/JP2008124446A5/ja
Application granted granted Critical
Publication of JP5252473B2 publication Critical patent/JP5252473B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2007268168A 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置 Expired - Fee Related JP5252473B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007268168A JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置
EP07829964.1A EP2075802B1 (en) 2006-10-19 2007-10-17 Conductive pattern forming film, and conductive pattern forming method
KR1020097007319A KR20090064445A (ko) 2006-10-19 2007-10-17 도전 패턴 형성 필름과, 그것을 위한 도전 패턴 형성방법 및 도전 패턴 형성장치
PCT/JP2007/070230 WO2008047823A1 (en) 2006-10-19 2007-10-17 Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film
US12/443,482 US8278561B2 (en) 2006-10-19 2007-10-17 Conductive pattern forming film, and conductive pattern forming method and conductive pattern forming apparatus for the conductive pattern forming film

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006284445 2006-10-19
JP2006284445 2006-10-19
JP2007268168A JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置

Publications (3)

Publication Number Publication Date
JP2008124446A JP2008124446A (ja) 2008-05-29
JP2008124446A5 JP2008124446A5 (enExample) 2010-02-25
JP5252473B2 true JP5252473B2 (ja) 2013-07-31

Family

ID=39314045

Family Applications (1)

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JP2007268168A Expired - Fee Related JP5252473B2 (ja) 2006-10-19 2007-10-15 導電パターン形成フィルムと、そのための導電パターン形成方法及び導電パターン形成装置

Country Status (5)

Country Link
US (1) US8278561B2 (enExample)
EP (1) EP2075802B1 (enExample)
JP (1) JP5252473B2 (enExample)
KR (1) KR20090064445A (enExample)
WO (1) WO2008047823A1 (enExample)

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US8927054B2 (en) * 2009-11-24 2015-01-06 National Institute Of Advanced Industrial Science And Technology Conductive substrate and process for producing same
US8679905B2 (en) * 2011-06-08 2014-03-25 Cbrite Inc. Metal oxide TFT with improved source/drain contacts
US9412623B2 (en) * 2011-06-08 2016-08-09 Cbrite Inc. Metal oxide TFT with improved source/drain contacts and reliability
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
KR101639411B1 (ko) * 2012-12-31 2016-07-14 주식회사 아모그린텍 연성인쇄회로기판
KR101560268B1 (ko) * 2014-04-21 2015-10-14 경희대학교 산학협력단 플렉서블 기판용 배리어 막 형성 방법
US10235061B1 (en) * 2016-09-26 2019-03-19 EMC IP Holding Company LLC Granular virtual machine snapshots
EP3681700A4 (en) * 2017-12-22 2021-04-28 Hewlett-Packard Development Company, L.P. CODING IN THREE-DIMENSIONAL OBJECTS
CN108718479A (zh) * 2018-07-13 2018-10-30 上海德门信息技术有限公司 一种液晶聚合物银浆的柔性电路基板及其制备方法和应用
EP4145621A4 (en) * 2020-05-01 2024-04-03 Dai Nippon Printing Co., Ltd. PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD
CN216930463U (zh) * 2021-10-09 2022-07-08 北京梦之墨科技有限公司 一种lcp电路板、多层lcp电路板及电子器件
CN114783298B (zh) * 2022-05-25 2023-08-01 苏州华星光电技术有限公司 柔性屏的校平装置和柔性屏的校平方法

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Also Published As

Publication number Publication date
KR20090064445A (ko) 2009-06-18
EP2075802A4 (en) 2010-11-03
JP2008124446A (ja) 2008-05-29
WO2008047823A1 (en) 2008-04-24
US20100025088A1 (en) 2010-02-04
US8278561B2 (en) 2012-10-02
EP2075802A1 (en) 2009-07-01
EP2075802B1 (en) 2013-11-20

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