JP2008122504A - 表示装置とその製造方法 - Google Patents
表示装置とその製造方法 Download PDFInfo
- Publication number
- JP2008122504A JP2008122504A JP2006303826A JP2006303826A JP2008122504A JP 2008122504 A JP2008122504 A JP 2008122504A JP 2006303826 A JP2006303826 A JP 2006303826A JP 2006303826 A JP2006303826 A JP 2006303826A JP 2008122504 A JP2008122504 A JP 2008122504A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- film
- gate
- capacitor lower
- lower electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/13—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body combined with thin-film or thick-film passive components
Abstract
【解決手段】本発明にかかる表示装置は、基板1と、基板1上に形成された多結晶シリコン膜4と多結晶シリコン膜4上に設けられたコンタクトメタル膜5とを有するキャパシタ下部電極20と、キャパシタ下部電極20上に形成されたゲート絶縁膜6と、ゲート絶縁膜6上にキャパシタ下部電極20と対向する位置に形成されたゲートメタル電極7とを備え、ゲートメタル電極7は、上面視でキャパシタ下部電極20の内側に形成されている。
【選択図】図3
Description
以下、実施の形態2にかかる表示装置について、図4及び図5を用いて説明する。図4は、発明の実施の形態2にかかる表示装置の一部であるキャパシタ130の平面図である。図5は、発明の実施の形態2にかかる表示装置の一部であるキャパシタ130の断面図であり、図4のB−B'における断面図である。
4 多結晶シリコン膜、 5 コンタクトメタル膜、 6 ゲート絶縁膜、
7 ゲートメタル電極、 8 層間絶縁膜、 9 信号線、 10 保護膜、
11 コンタクトホール、 12 接続パターン、 14 半導体薄膜、
20 キャパシタ下部電極、 21 引き出し配線、 110 基板、
111 表示領域、 112 額縁領域、 113 ゲート配線、
114 信号線、 115 走査信号駆動回路部、 116 表示信号駆動回路部、
117 画素、 118 外部配線、 119 外部配線、 120 TFT、
130 キャパシタ、 140 液晶画素、 141 画素電極
Claims (6)
- 基板と、
前記基板上に形成された多結晶シリコン膜と前記多結晶シリコン膜上に設けられたコンタクトメタル膜とを有するキャパシタ下部電極と、
前記キャパシタ下部電極上に形成されたゲート絶縁膜と、
前記ゲート絶縁膜上に前記キャパシタ下部電極と対向する位置に形成されたゲートメタル電極とを備え、
前記ゲートメタル電極は、上面視で前記キャパシタ下部電極の内側に形成されている表示装置。 - 前記ゲートメタル電極から引き出された幅15μm以下の引き出し配線が、前記キャパシタ下部電極の縁部を乗り越えていることを特徴とする請求項1に記載の表示装置。
- 前記ゲートメタル電極が、コンタクトホールを介して上層の接続パターンに接続し、
前記上層の接続パターンが、前記キャパシタ下部電極の縁部を乗り越えることを特徴とする請求項1に記載の表示装置。 - 基板上に、多結晶シリコン膜と前記多結晶シリコン膜上に配置されたコンタクトメタル膜とを有するキャパシタ下部電極を形成するキャパシタ下部電極形成工程と、
前記キャパシタ下部電極上にゲート絶縁膜を形成するゲート絶縁膜形成工程と、
前記ゲート絶縁膜上に上面視で前記キャパシタ下部電極の内側に配置されるゲートメタル電極を形成するゲートメタル電極形成工程と、を備えた表示装置の製造方法。 - 前記ゲートメタル電極を形成する工程では、前記ゲートメタル電極から引き出された幅15μm以下の引き出し配線を、前記キャパシタ下部電極の縁部を乗り越えるように形成する請求項4に記載の表示装置の製造方法。
- 前記ゲートメタル電極を形成する工程では、前記ゲートメタル電極の上層にコンタクトホールを介して前記ゲートメタル電極と接続する接続パターンを形成する工程をさらに備え、
前記接続パターンが、前記キャパシタ下部電極の縁部を乗り越えるように形成する請求項4に記載の表示装置の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006303826A JP2008122504A (ja) | 2006-11-09 | 2006-11-09 | 表示装置とその製造方法 |
TW096132858A TW200821722A (en) | 2006-11-09 | 2007-09-04 | Display device and method of manufacturing the same |
US11/852,732 US20080157275A1 (en) | 2006-11-09 | 2007-09-10 | Display device and method of manufacturing the same |
KR1020070111315A KR20080042691A (ko) | 2006-11-09 | 2007-11-02 | 표시장치와 그 제조 방법 |
CNA2007101860202A CN101179084A (zh) | 2006-11-09 | 2007-11-09 | 显示装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006303826A JP2008122504A (ja) | 2006-11-09 | 2006-11-09 | 表示装置とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008122504A true JP2008122504A (ja) | 2008-05-29 |
Family
ID=39405253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006303826A Pending JP2008122504A (ja) | 2006-11-09 | 2006-11-09 | 表示装置とその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080157275A1 (ja) |
JP (1) | JP2008122504A (ja) |
KR (1) | KR20080042691A (ja) |
CN (1) | CN101179084A (ja) |
TW (1) | TW200821722A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101970783B1 (ko) * | 2012-05-07 | 2019-04-23 | 삼성디스플레이 주식회사 | 반도체 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03288824A (ja) * | 1990-04-05 | 1991-12-19 | Sharp Corp | アクティブマトリクス表示装置 |
JP2000138346A (ja) * | 1998-10-30 | 2000-05-16 | Fujitsu Ltd | Mos型容量素子、液晶表示装置、半導体集積回路装置、およびその製造方法 |
JP2000353811A (ja) * | 1999-04-07 | 2000-12-19 | Semiconductor Energy Lab Co Ltd | 電気光学装置およびその作製方法 |
JP2001013906A (ja) * | 1999-06-25 | 2001-01-19 | Sharp Corp | 表示素子および投射型表示装置 |
JP2001290171A (ja) * | 2000-01-26 | 2001-10-19 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2006222437A (ja) * | 2006-03-03 | 2006-08-24 | Semiconductor Energy Lab Co Ltd | 液晶表示装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01283863A (ja) * | 1988-05-10 | 1989-11-15 | Nec Corp | Mos型半導体装置 |
JP3700697B2 (ja) * | 2002-02-12 | 2005-09-28 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
-
2006
- 2006-11-09 JP JP2006303826A patent/JP2008122504A/ja active Pending
-
2007
- 2007-09-04 TW TW096132858A patent/TW200821722A/zh unknown
- 2007-09-10 US US11/852,732 patent/US20080157275A1/en not_active Abandoned
- 2007-11-02 KR KR1020070111315A patent/KR20080042691A/ko not_active Application Discontinuation
- 2007-11-09 CN CNA2007101860202A patent/CN101179084A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03288824A (ja) * | 1990-04-05 | 1991-12-19 | Sharp Corp | アクティブマトリクス表示装置 |
JP2000138346A (ja) * | 1998-10-30 | 2000-05-16 | Fujitsu Ltd | Mos型容量素子、液晶表示装置、半導体集積回路装置、およびその製造方法 |
JP2000353811A (ja) * | 1999-04-07 | 2000-12-19 | Semiconductor Energy Lab Co Ltd | 電気光学装置およびその作製方法 |
JP2001013906A (ja) * | 1999-06-25 | 2001-01-19 | Sharp Corp | 表示素子および投射型表示装置 |
JP2001290171A (ja) * | 2000-01-26 | 2001-10-19 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2006222437A (ja) * | 2006-03-03 | 2006-08-24 | Semiconductor Energy Lab Co Ltd | 液晶表示装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101179084A (zh) | 2008-05-14 |
US20080157275A1 (en) | 2008-07-03 |
TW200821722A (en) | 2008-05-16 |
KR20080042691A (ko) | 2008-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5044273B2 (ja) | 薄膜トランジスタアレイ基板、その製造方法、及び表示装置 | |
US8436358B2 (en) | Image display device and manufacturing method thereof | |
JP4967631B2 (ja) | 表示装置 | |
US20080083927A1 (en) | Display device and method of manufacturing the same | |
US8035108B2 (en) | Thin film transistor substrate, liquid crystal display panel including the same, and method of manufacturing liquid crystal display panel | |
JP4872591B2 (ja) | Tft基板とその製法、ならびに該tft基板を備えた表示装置 | |
US20060273316A1 (en) | Array substrate having enhanced aperture ratio, method of manufacturing the same and display apparatus having the same | |
US20060119778A1 (en) | Active matrix display device and method for manufacturing the same | |
JP2011090281A (ja) | 平板表示装置及びその製造方法 | |
JP5266645B2 (ja) | 薄膜トランジスタと該薄膜トランジスタを用いた表示装置 | |
JP5026019B2 (ja) | 薄膜トランジスタ基板、薄膜トランジスタの製造方法、及び表示装置 | |
JPH11112002A (ja) | 半導体装置およびその製造方法 | |
US7612377B2 (en) | Thin film transistor array panel with enhanced storage capacitors | |
US20130193440A1 (en) | Display Device and Manufacturing Method Thereof | |
JP2010243741A (ja) | 薄膜トランジスタアレイ基板、及びその製造方法、並びに液晶表示装置 | |
JP5475250B2 (ja) | 半導体装置の製造方法及び半導体装置 | |
JP5032077B2 (ja) | 表示装置及びその製造方法 | |
JP2019040026A (ja) | 表示装置 | |
JP6960807B2 (ja) | 表示装置及びその製造方法 | |
JP2006098641A (ja) | 薄膜半導体装置、電気光学装置、および電子機器 | |
JP2008122504A (ja) | 表示装置とその製造方法 | |
JP2008218626A (ja) | Tftアレイ基板及びその製造方法 | |
KR101044542B1 (ko) | 액정표시소자 | |
JP2009210681A (ja) | 表示装置及びその製造方法 | |
JP2009224396A (ja) | 薄膜トランジスタ基板、およびその製造方法、並びに表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091015 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101006 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111220 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120417 |