JP2008091476A - 外観検査装置 - Google Patents

外観検査装置 Download PDF

Info

Publication number
JP2008091476A
JP2008091476A JP2006268479A JP2006268479A JP2008091476A JP 2008091476 A JP2008091476 A JP 2008091476A JP 2006268479 A JP2006268479 A JP 2006268479A JP 2006268479 A JP2006268479 A JP 2006268479A JP 2008091476 A JP2008091476 A JP 2008091476A
Authority
JP
Japan
Prior art keywords
wafer
inspection
unit
recipe
peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006268479A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008091476A5 (enExample
Inventor
Naruhiro Komuro
考広 小室
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2006268479A priority Critical patent/JP2008091476A/ja
Priority to CN200710161667XA priority patent/CN101153852B/zh
Priority to US11/904,421 priority patent/US20080225281A1/en
Priority to TW096136188A priority patent/TWI443763B/zh
Publication of JP2008091476A publication Critical patent/JP2008091476A/ja
Publication of JP2008091476A5 publication Critical patent/JP2008091476A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2006268479A 2006-09-29 2006-09-29 外観検査装置 Pending JP2008091476A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006268479A JP2008091476A (ja) 2006-09-29 2006-09-29 外観検査装置
CN200710161667XA CN101153852B (zh) 2006-09-29 2007-09-27 外观检查装置
US11/904,421 US20080225281A1 (en) 2006-09-29 2007-09-27 Visual inspection apparatus
TW096136188A TWI443763B (zh) 2006-09-29 2007-09-28 外觀檢查裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006268479A JP2008091476A (ja) 2006-09-29 2006-09-29 外観検査装置

Publications (2)

Publication Number Publication Date
JP2008091476A true JP2008091476A (ja) 2008-04-17
JP2008091476A5 JP2008091476A5 (enExample) 2009-03-26

Family

ID=39255620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006268479A Pending JP2008091476A (ja) 2006-09-29 2006-09-29 外観検査装置

Country Status (4)

Country Link
US (1) US20080225281A1 (enExample)
JP (1) JP2008091476A (enExample)
CN (1) CN101153852B (enExample)
TW (1) TWI443763B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527760A (ja) * 2009-05-22 2012-11-08 ラム リサーチ コーポレーション 基板間のベベルエッチング再現性を改善する装置及び方法
JP2017183494A (ja) * 2016-03-30 2017-10-05 東京エレクトロン株式会社 基板処理装置、基板処理装置の制御方法、及び基板処理システム
JP2019062011A (ja) * 2017-09-25 2019-04-18 東京エレクトロン株式会社 基板処理装置
WO2023243253A1 (ja) * 2022-06-15 2023-12-21 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099848B2 (ja) * 2006-08-10 2012-12-19 芝浦メカトロニクス株式会社 円盤状基板の検査装置及び検査方法
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
CN103529544A (zh) * 2013-11-04 2014-01-22 山东理工大学 一种可自动调位和聚焦的纳米膜厚测量仪
KR101540885B1 (ko) * 2014-07-29 2015-07-30 주식회사 엘지실트론 웨이퍼의 결함 측정장치
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
JP6752593B2 (ja) * 2016-03-07 2020-09-09 東レエンジニアリング株式会社 欠陥検査装置
JP6944291B2 (ja) * 2017-07-05 2021-10-06 株式会社ディスコ 加工装置
US10978331B2 (en) * 2018-03-30 2021-04-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for orientator based wafer defect sensing
CN110823915B (zh) * 2018-08-08 2021-02-19 合肥晶合集成电路股份有限公司 一种晶元破片分析装置及其晶元破片分析方法
CN114365272B (zh) * 2019-09-30 2025-11-18 应用材料公司 输送机检查系统、基板旋转器和具有前述项的测试系统
US10937683B1 (en) * 2019-09-30 2021-03-02 Applied Materials, Inc. Conveyor inspection system, substrate rotator, and test system having the same
US11600504B2 (en) 2020-06-29 2023-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
CN112133651A (zh) * 2020-09-24 2020-12-25 争丰半导体科技(苏州)有限公司 晶圆自动排序分片机
TWI838023B (zh) * 2022-12-19 2024-04-01 萬潤科技股份有限公司 調光模組、光源裝置、光學影像檢查方法及設備
CN119915735A (zh) * 2025-03-28 2025-05-02 杭州光研科技有限公司 一种晶圆定位和缺陷检测方法、设备及介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134575A (ja) * 2000-10-26 2002-05-10 Sony Corp 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
JP2003151920A (ja) * 2001-11-09 2003-05-23 Disco Abrasive Syst Ltd 切削機における被加工物位置合わせ方法
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2004227671A (ja) * 2003-01-23 2004-08-12 Tdk Corp 光記録媒体製造装置
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
DE10324474B4 (de) * 2003-05-30 2006-05-04 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Wafer-Inspektion

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134575A (ja) * 2000-10-26 2002-05-10 Sony Corp 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527760A (ja) * 2009-05-22 2012-11-08 ラム リサーチ コーポレーション 基板間のベベルエッチング再現性を改善する装置及び方法
JP2017183494A (ja) * 2016-03-30 2017-10-05 東京エレクトロン株式会社 基板処理装置、基板処理装置の制御方法、及び基板処理システム
TWI686855B (zh) * 2016-03-30 2020-03-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理裝置之控制方法及基板處理系統
US11011436B2 (en) 2016-03-30 2021-05-18 Tokyo Electron Limited Substrate processing apparatus, control method of substrate processing apparatus and substrate processing system
JP2019062011A (ja) * 2017-09-25 2019-04-18 東京エレクトロン株式会社 基板処理装置
JP7029914B2 (ja) 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
WO2023243253A1 (ja) * 2022-06-15 2023-12-21 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ
JP2023183314A (ja) * 2022-06-15 2023-12-27 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ
JP7711637B2 (ja) 2022-06-15 2025-07-23 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ

Also Published As

Publication number Publication date
CN101153852A (zh) 2008-04-02
TWI443763B (zh) 2014-07-01
TW200824023A (en) 2008-06-01
US20080225281A1 (en) 2008-09-18
CN101153852B (zh) 2011-07-06

Similar Documents

Publication Publication Date Title
TWI443763B (zh) 外觀檢查裝置
JP4468696B2 (ja) 半導体ウエハ検査装置
CN100419410C (zh) 缺陷检查数据处理系统
EP4220116A1 (en) Bearing element inspection system and method
TWI390660B (zh) 用於半導體晶圓對準之方法與設備
JP2008267904A (ja) 外観検査装置および表面状態の検査方法
WO2006118152A1 (ja) 外観検査装置及び外観検査方法並びに外観検査装置に装着可能な周縁部検査ユニット
US7456947B2 (en) Inspecting apparatus and inspecting method
JP2008064595A (ja) 基板検査装置
US20070222976A1 (en) Visual inspection apparatus
CN110168354A (zh) 检查装置和检查方法
JPWO2009072483A1 (ja) 観察装置および観察方法
JP2007234932A (ja) 外観検査装置
JP2000114329A (ja) 基板端部の研削面の検査方法とその装置
JP2004179581A (ja) 半導体ウエハ検査装置
JP4981703B2 (ja) 外観検査装置および外観検査方法
JP2008089351A (ja) 外観検査装置及び外観検査方法
JP2011029324A (ja) レシピ更新方法およびレシピ更新システム
JP2007059640A (ja) 外観検査装置
JP5316924B2 (ja) 観察装置および観察方法
JP2007033372A (ja) 外観検査装置
JP2009210419A (ja) 基板検査装置、及び、基板検査方法
JP2009063365A (ja) 検査装置及び検査方法
JP2001091474A (ja) 欠陥検査システム
JP4586272B2 (ja) 基板検査装置と基板検査方法、及び液晶表示装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090205

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090205

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111220

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120612