TWI443763B - 外觀檢查裝置 - Google Patents

外觀檢查裝置 Download PDF

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Publication number
TWI443763B
TWI443763B TW096136188A TW96136188A TWI443763B TW I443763 B TWI443763 B TW I443763B TW 096136188 A TW096136188 A TW 096136188A TW 96136188 A TW96136188 A TW 96136188A TW I443763 B TWI443763 B TW I443763B
Authority
TW
Taiwan
Prior art keywords
wafer
inspection
unit
visual inspection
peripheral portion
Prior art date
Application number
TW096136188A
Other languages
English (en)
Chinese (zh)
Other versions
TW200824023A (en
Inventor
Takahrio Komuro
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200824023A publication Critical patent/TW200824023A/zh
Application granted granted Critical
Publication of TWI443763B publication Critical patent/TWI443763B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW096136188A 2006-09-29 2007-09-28 外觀檢查裝置 TWI443763B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006268479A JP2008091476A (ja) 2006-09-29 2006-09-29 外観検査装置

Publications (2)

Publication Number Publication Date
TW200824023A TW200824023A (en) 2008-06-01
TWI443763B true TWI443763B (zh) 2014-07-01

Family

ID=39255620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096136188A TWI443763B (zh) 2006-09-29 2007-09-28 外觀檢查裝置

Country Status (4)

Country Link
US (1) US20080225281A1 (enExample)
JP (1) JP2008091476A (enExample)
CN (1) CN101153852B (enExample)
TW (1) TWI443763B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099848B2 (ja) * 2006-08-10 2012-12-19 芝浦メカトロニクス株式会社 円盤状基板の検査装置及び検査方法
US7977123B2 (en) * 2009-05-22 2011-07-12 Lam Research Corporation Arrangements and methods for improving bevel etch repeatability among substrates
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
CN103529544A (zh) * 2013-11-04 2014-01-22 山东理工大学 一种可自动调位和聚焦的纳米膜厚测量仪
KR101540885B1 (ko) * 2014-07-29 2015-07-30 주식회사 엘지실트론 웨이퍼의 결함 측정장치
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
JP6752593B2 (ja) * 2016-03-07 2020-09-09 東レエンジニアリング株式会社 欠陥検査装置
JP6537992B2 (ja) 2016-03-30 2019-07-03 東京エレクトロン株式会社 基板処理装置、基板処理装置の制御方法、及び基板処理システム
JP6944291B2 (ja) * 2017-07-05 2021-10-06 株式会社ディスコ 加工装置
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
US10978331B2 (en) * 2018-03-30 2021-04-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for orientator based wafer defect sensing
CN110823915B (zh) * 2018-08-08 2021-02-19 合肥晶合集成电路股份有限公司 一种晶元破片分析装置及其晶元破片分析方法
CN114365272B (zh) * 2019-09-30 2025-11-18 应用材料公司 输送机检查系统、基板旋转器和具有前述项的测试系统
US10937683B1 (en) * 2019-09-30 2021-03-02 Applied Materials, Inc. Conveyor inspection system, substrate rotator, and test system having the same
US11600504B2 (en) 2020-06-29 2023-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
CN112133651A (zh) * 2020-09-24 2020-12-25 争丰半导体科技(苏州)有限公司 晶圆自动排序分片机
JP7711637B2 (ja) * 2022-06-15 2025-07-23 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ
TWI838023B (zh) * 2022-12-19 2024-04-01 萬潤科技股份有限公司 調光模組、光源裝置、光學影像檢查方法及設備
CN119915735A (zh) * 2025-03-28 2025-05-02 杭州光研科技有限公司 一种晶圆定位和缺陷检测方法、设备及介质

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3941375B2 (ja) * 2000-10-26 2007-07-04 ソニー株式会社 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
JP2003151920A (ja) * 2001-11-09 2003-05-23 Disco Abrasive Syst Ltd 切削機における被加工物位置合わせ方法
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2004227671A (ja) * 2003-01-23 2004-08-12 Tdk Corp 光記録媒体製造装置
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
DE10324474B4 (de) * 2003-05-30 2006-05-04 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Wafer-Inspektion

Also Published As

Publication number Publication date
CN101153852A (zh) 2008-04-02
JP2008091476A (ja) 2008-04-17
TW200824023A (en) 2008-06-01
US20080225281A1 (en) 2008-09-18
CN101153852B (zh) 2011-07-06

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