CN101153852B - 外观检查装置 - Google Patents

外观检查装置 Download PDF

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Publication number
CN101153852B
CN101153852B CN200710161667XA CN200710161667A CN101153852B CN 101153852 B CN101153852 B CN 101153852B CN 200710161667X A CN200710161667X A CN 200710161667XA CN 200710161667 A CN200710161667 A CN 200710161667A CN 101153852 B CN101153852 B CN 101153852B
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CN
China
Prior art keywords
wafer
inspection
circumference
appearance inspection
appearance
Prior art date
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Expired - Fee Related
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CN200710161667XA
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English (en)
Chinese (zh)
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CN101153852A (zh
Inventor
小室考广
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Olympus Corp
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Olympus Corp
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Publication date
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Publication of CN101153852A publication Critical patent/CN101153852A/zh
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Publication of CN101153852B publication Critical patent/CN101153852B/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
CN200710161667XA 2006-09-29 2007-09-27 外观检查装置 Expired - Fee Related CN101153852B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006268479 2006-09-29
JP2006-268479 2006-09-29
JP2006268479A JP2008091476A (ja) 2006-09-29 2006-09-29 外観検査装置

Publications (2)

Publication Number Publication Date
CN101153852A CN101153852A (zh) 2008-04-02
CN101153852B true CN101153852B (zh) 2011-07-06

Family

ID=39255620

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710161667XA Expired - Fee Related CN101153852B (zh) 2006-09-29 2007-09-27 外观检查装置

Country Status (4)

Country Link
US (1) US20080225281A1 (enExample)
JP (1) JP2008091476A (enExample)
CN (1) CN101153852B (enExample)
TW (1) TWI443763B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099848B2 (ja) * 2006-08-10 2012-12-19 芝浦メカトロニクス株式会社 円盤状基板の検査装置及び検査方法
US7977123B2 (en) * 2009-05-22 2011-07-12 Lam Research Corporation Arrangements and methods for improving bevel etch repeatability among substrates
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
CN103529544A (zh) * 2013-11-04 2014-01-22 山东理工大学 一种可自动调位和聚焦的纳米膜厚测量仪
KR101540885B1 (ko) * 2014-07-29 2015-07-30 주식회사 엘지실트론 웨이퍼의 결함 측정장치
KR20160040044A (ko) * 2014-10-02 2016-04-12 삼성전자주식회사 패널 검사장치 및 검사방법
JP6752593B2 (ja) * 2016-03-07 2020-09-09 東レエンジニアリング株式会社 欠陥検査装置
JP6537992B2 (ja) 2016-03-30 2019-07-03 東京エレクトロン株式会社 基板処理装置、基板処理装置の制御方法、及び基板処理システム
JP6944291B2 (ja) * 2017-07-05 2021-10-06 株式会社ディスコ 加工装置
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
US10978331B2 (en) * 2018-03-30 2021-04-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for orientator based wafer defect sensing
CN110823915B (zh) * 2018-08-08 2021-02-19 合肥晶合集成电路股份有限公司 一种晶元破片分析装置及其晶元破片分析方法
CN114365272B (zh) * 2019-09-30 2025-11-18 应用材料公司 输送机检查系统、基板旋转器和具有前述项的测试系统
US10937683B1 (en) * 2019-09-30 2021-03-02 Applied Materials, Inc. Conveyor inspection system, substrate rotator, and test system having the same
US11600504B2 (en) 2020-06-29 2023-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
CN112133651A (zh) * 2020-09-24 2020-12-25 争丰半导体科技(苏州)有限公司 晶圆自动排序分片机
JP7711637B2 (ja) * 2022-06-15 2025-07-23 株式会社Sumco ウェーハの判定方法、判定プログラム、判定装置、ウェーハの製造方法及びウェーハ
TWI838023B (zh) * 2022-12-19 2024-04-01 萬潤科技股份有限公司 調光模組、光源裝置、光學影像檢查方法及設備
CN119915735A (zh) * 2025-03-28 2025-05-02 杭州光研科技有限公司 一种晶圆定位和缺陷检测方法、设备及介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1417008A (zh) * 2001-11-09 2003-05-14 株式会社迪斯科 在切割机上找正工件的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3941375B2 (ja) * 2000-10-26 2007-07-04 ソニー株式会社 基板周縁検査方法、電子基板の製造方法および基板周縁検査装置
KR100416791B1 (ko) * 2001-03-19 2004-01-31 삼성전자주식회사 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2004227671A (ja) * 2003-01-23 2004-08-12 Tdk Corp 光記録媒体製造装置
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
DE10324474B4 (de) * 2003-05-30 2006-05-04 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Wafer-Inspektion

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1417008A (zh) * 2001-11-09 2003-05-14 株式会社迪斯科 在切割机上找正工件的方法

Also Published As

Publication number Publication date
CN101153852A (zh) 2008-04-02
JP2008091476A (ja) 2008-04-17
TWI443763B (zh) 2014-07-01
TW200824023A (en) 2008-06-01
US20080225281A1 (en) 2008-09-18

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Granted publication date: 20110706

Termination date: 20200927