JP2008060537A - 半導体装置及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 90
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000004020 conductor Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000009792 diffusion process Methods 0.000 claims description 77
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 38
- 229910052710 silicon Inorganic materials 0.000 claims description 38
- 239000010703 silicon Substances 0.000 claims description 38
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 22
- 229920005591 polysilicon Polymers 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 37
- 229910052814 silicon oxide Inorganic materials 0.000 description 37
- 238000002955 isolation Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 229910052796 boron Inorganic materials 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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Abstract
【解決手段】半導体装置は、半導体基板(5)と、半導体基板(5)に埋設された複数のゲート電極11a〜11cと、複数のゲート電極11a〜11cの各々の上に設けられた第1の絶縁層(12a〜12c)と、半導体基板(5)の表面に形成された導電層(13)と、導電層(13)上に設けられた導体層15とを備える。
【選択図】図1
Description
型ボディ用拡散層(チャネル層)14が二重拡散によって形成されている。エピタキシャルシリコン層5には、その表面から下方に向かってトレンチ9a〜9cが形成されている。トレンチ9a〜9cは、ソース拡散層13およびボディ用拡散層14を貫通し、埋込拡散層3に到達しない深さで形成されている。トレンチ9a〜9cの内面は、それぞれその略全面にわたってゲート絶縁膜10a〜10cで被覆されている。トレンチ9a〜9cの内部には、ゲート絶縁膜10a〜10cを覆うようにゲート電極11a〜11cが充填されている。ゲート電極11a〜11cは、多量のN型不純物、たとえば燐(P)が導入されたポリシリコンで形成され、ゲート絶縁膜10a〜10cはシリコン酸化膜で形成されている。ゲート電極11a〜11cの上には、ゲート電極11a〜11c(ポリシリコン)を自己整合的に酸化することによってシリコン酸化膜12a〜12cが形成されている。シリコン酸化膜12a〜12cの上面は、ソース拡散層13の上面と略同一である。図2に示すように、ゲート電極11a〜11cは並列に延設され、ソース拡散層13を複数の領域に区画している。第1実施形態では、ソース拡散層13が本発明の「導電層」を構成し、シリコン酸化膜12a〜12cの各々が本発明の「第1の絶縁層」を構成し、ゲート絶縁膜10a〜10cの各々が本発明の「第2の絶縁層」を構成する。
2cの上方に導体層15が面状に形成される。上記したように、シリコン酸化膜12a〜12cの上面はソース拡散層13の上面と略同一に形成されている。従って、導体層15の上面は平坦に形成される。その結果、後続の工程で形成されるソース電極23aの製造バラツキを抑制して、ソース電極23aと導体層15との接続信頼性を向上することができる。
レジストマスクを除去する。
図21は、本発明の第2実施形態に係る半導体装置である。図21では、ソース拡散層13及びボディ用拡散層14が、ゲート電極11a,11b間及びゲート電極11b,11c間にのみ形成される。この場合、導体層15は、ソース拡散層13上及びシリコン酸化膜12a〜12c上に形成され、エピタキシャルシリコン層5上には配置されない。この場合も上記(1)と同様な効果が得られる。
することができる。
S層、9a〜9c・・・トレンチ、10a〜10c・・・ゲート絶縁膜、11a〜11c・・・ゲート電極、12a〜12c・・・シリコン酸化膜、13・・・N型ソース拡散層、14・・・P型ボディ用拡散層、15・・・導体層、16・・・シリコン酸化膜、17・・・トレンチ、18・・・シリコン酸化膜、19・・・引き出し層、20・・・絶縁層、21a,21b・・・コンタクトホール、22a,22b・・・コンタクトプラグ、23a・・・ソース電極、23b・・・ドレイン電極。
Claims (12)
- 半導体装置であって、
半導体基板と、
前記半導体基板に埋設された複数のゲート電極と、
前記複数のゲート電極の各々の上に設けられた第1の絶縁層と、
前記半導体基板の表面に形成された導電層と、
前記導電層上に設けられた導体層と、
を備えた半導体装置。 - 請求項1記載の半導体装置は更に、
前記各ゲート電極と前記半導体基板との間に配置された第2の絶縁層を備え、
前記導電層は前記第2の絶縁層に隣接して形成され、
前記導体層は前記導電層上及び前記第1の絶縁層上に設けられている、半導体装置。 - 請求項1記載の半導体装置は更に、
前記導電層に隣接して前記半導体基板に形成された拡散層を備え、
前記導体層は前記導電層上及び前記拡散層上に設けられている、半導体装置。 - 請求項3記載の半導体装置において、
前記第1の絶縁層の上面、前記導電層の上面及び前記拡散層の上面は略同一である、半導体装置。 - 請求項1乃至4の何れか一項記載の半導体装置において、
前記半導体基板はシリコン基板であり、
前記導体層はポリシリコンで形成されている、半導体装置。 - 請求項1乃至4の何れか一項記載の半導体装置において、
前記半導体基板はシリコン基板であり、
前記導体層は金属材料で形成されている、半導体装置。 - 請求項1乃至6の何れか一項記載の半導体装置において、
前記導体層は面状である、半導体装置。 - 請求項1乃至6の何れか一項記載の半導体装置は更に、
前記導体層の上方に設けられ、接続孔を有する第3の絶縁層と、
前記第3の絶縁層上に設けられ、前記接続孔を介して前記導体層に接続された電極層と、
を備える、半導体装置。 - 半導体装置の製造方法であって、
半導体基板を準備する工程と、
前記半導体基板に複数のゲート電極を埋設する工程と、
前記複数のゲート電極の各々の上に第1の絶縁層を設ける工程と、
前記半導体基板の表面に導電層を形成する工程と、
前記導電層上に導体層を設ける工程と、
を備えた半導体装置の製造方法。 - 請求項9記載の半導体装置の製造方法は更に、
前記各ゲート電極と前記半導体基板との間に配置された第2の絶縁層を設ける工程を備
え、
前記導電層を形成する工程は、前記導電層を前記第2の絶縁層に隣接して形成する工程を含み、
前記導体層を設ける工程は、前記導体層を前記導電層上及び前記第1の絶縁層上に設ける工程を含む、半導体装置の製造方法。 - 請求項9記載の半導体装置の製造方法は更に、
前記導電層に隣接する拡散層を前記半導体基板に形成する工程を備え、
前記導体層を設ける工程は、前記導体層を前記導電層上及び前記拡散層上に設ける工程を含む、半導体装置の製造方法。 - 請求項9乃至11の何れか一項記載の半導体装置の製造方法は更に、
前記導体層の上方に第3の絶縁層を設ける工程と、
前記第3の絶縁層に接続孔を形成する工程と、
前記第3の絶縁層上に前記接続孔を介して前記導体層に接続される電極層を設ける工程と、
を備える、半導体装置の製造方法。
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JP2007155471A JP2008060537A (ja) | 2006-07-31 | 2007-06-12 | 半導体装置及びその製造方法 |
US11/830,369 US20080173924A1 (en) | 2006-07-31 | 2007-07-30 | Semiconductor device and method for manufacturing semiconductor device |
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US7851856B2 (en) * | 2008-12-29 | 2010-12-14 | Alpha & Omega Semiconductor, Ltd | True CSP power MOSFET based on bottom-source LDMOS |
KR101171886B1 (ko) * | 2009-07-31 | 2012-08-07 | 에스케이하이닉스 주식회사 | 매립게이트를 구비한 반도체장치 및 그 제조 방법 |
WO2015140806A1 (en) * | 2014-03-20 | 2015-09-24 | Skokie Swift Corporation | Vertical field effect transistor having a disc shaped gate |
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