JP2008047655A - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法 Download PDF

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Publication number
JP2008047655A
JP2008047655A JP2006220685A JP2006220685A JP2008047655A JP 2008047655 A JP2008047655 A JP 2008047655A JP 2006220685 A JP2006220685 A JP 2006220685A JP 2006220685 A JP2006220685 A JP 2006220685A JP 2008047655 A JP2008047655 A JP 2008047655A
Authority
JP
Japan
Prior art keywords
wiring pattern
layer
forming
metal foil
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006220685A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008047655A5 (enExample
Inventor
Tatsuo Kataoka
龍男 片岡
Hirokazu Kawamura
裕和 河村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2006220685A priority Critical patent/JP2008047655A/ja
Priority to TW096128805A priority patent/TW200819011A/zh
Priority to KR1020070079052A priority patent/KR20080014623A/ko
Priority to US11/836,522 priority patent/US20090183901A1/en
Priority to CNA2007101357124A priority patent/CN101123852A/zh
Publication of JP2008047655A publication Critical patent/JP2008047655A/ja
Publication of JP2008047655A5 publication Critical patent/JP2008047655A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2006220685A 2006-08-11 2006-08-11 配線基板およびその製造方法 Pending JP2008047655A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006220685A JP2008047655A (ja) 2006-08-11 2006-08-11 配線基板およびその製造方法
TW096128805A TW200819011A (en) 2006-08-11 2007-08-06 Wiring boards and processes for manufacturing the same
KR1020070079052A KR20080014623A (ko) 2006-08-11 2007-08-07 배선 기판 및 그 제조 방법
US11/836,522 US20090183901A1 (en) 2006-08-11 2007-08-09 Wiring Boards and Processes for Manufacturing the Same
CNA2007101357124A CN101123852A (zh) 2006-08-11 2007-08-10 电路基板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006220685A JP2008047655A (ja) 2006-08-11 2006-08-11 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2008047655A true JP2008047655A (ja) 2008-02-28
JP2008047655A5 JP2008047655A5 (enExample) 2008-07-31

Family

ID=39085958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006220685A Pending JP2008047655A (ja) 2006-08-11 2006-08-11 配線基板およびその製造方法

Country Status (5)

Country Link
US (1) US20090183901A1 (enExample)
JP (1) JP2008047655A (enExample)
KR (1) KR20080014623A (enExample)
CN (1) CN101123852A (enExample)
TW (1) TW200819011A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065757A3 (en) * 2009-11-25 2011-09-29 Lg Innotek Co., Ltd. Printed circuit board and manufacturing method thereof
JPWO2011090034A1 (ja) * 2010-01-19 2013-05-23 国立大学法人京都大学 導電膜及びその製造方法
CN103755989A (zh) * 2014-01-14 2014-04-30 广东生益科技股份有限公司 电路基板及其制备方法
WO2015012376A1 (ja) * 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
JP2015042779A (ja) * 2013-07-24 2015-03-05 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
CN105835478A (zh) * 2015-01-29 2016-08-10 Ｊｘ金属株式会社 表面处理铜箔、及关于它的制品
JP2017011251A (ja) * 2015-06-24 2017-01-12 京セラ株式会社 配線基板およびその製造方法
JP2022540683A (ja) * 2019-07-15 2022-09-16 エルジー イノテック カンパニー リミテッド プリント回路基板
WO2025192205A1 (ja) * 2024-03-15 2025-09-18 株式会社サトー 導電パターンを備えた基材、電子デバイス、電磁波シールドフィルムおよび面状発熱体

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090260862A1 (en) * 2008-04-16 2009-10-22 Andrew Yaung Circuit modification device for printed circuit boards
JPWO2012070381A1 (ja) * 2010-11-22 2014-05-19 日本電気株式会社 実装構造及び実装方法
JP2013093405A (ja) * 2011-10-25 2013-05-16 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
JP2013153068A (ja) * 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
JP5410580B1 (ja) 2012-08-09 2014-02-05 日本特殊陶業株式会社 配線基板
MY168616A (en) * 2013-07-23 2018-11-14 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
KR101482429B1 (ko) * 2013-08-12 2015-01-13 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
JP6385198B2 (ja) * 2014-08-21 2018-09-05 日東電工株式会社 回路付サスペンション基板の製造方法
US10550490B2 (en) * 2015-05-22 2020-02-04 Versitech Limited Transparent conductive films with embedded metal grids
CN106356351B (zh) * 2015-07-15 2019-02-01 凤凰先驱股份有限公司 基板结构及其制作方法
EP3322267B1 (en) 2016-11-10 2025-02-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with adhesion promoting shape of wiring structure
US10512165B2 (en) * 2017-03-23 2019-12-17 Unimicron Technology Corp. Method for manufacturing a circuit board
US20190174632A1 (en) * 2017-12-05 2019-06-06 Canon Components, Inc. Flexible printed circuit and electronic device
EP3651216B1 (en) * 2018-08-20 2024-03-13 LG Chem, Ltd. Embedded electrode substrate for transparent light-emitting element display, and method for manufacturing same
CN114080088B (zh) * 2020-08-10 2024-05-31 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
KR20230026105A (ko) * 2021-08-17 2023-02-24 삼성전기주식회사 인쇄회로기판
JP2023132391A (ja) * 2022-03-11 2023-09-22 イビデン株式会社 プリント配線板
KR102783065B1 (ko) * 2022-05-26 2025-03-20 (주)테라시스 폴리이미드 필름의 제조 방법, 이에 따라 제조된 폴리이미드 필름, 금속박막 적층판의 제조 방법 및 이에 따라 제조된 금속박막 적층판

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9532462B2 (en) 2009-11-25 2016-12-27 Lg Innotek Co., Ltd. Printed circuit board and manufacturing method thereof
WO2011065757A3 (en) * 2009-11-25 2011-09-29 Lg Innotek Co., Ltd. Printed circuit board and manufacturing method thereof
US9125315B2 (en) 2010-01-19 2015-09-01 Kyoto University Conductive film and method for its production
JPWO2011090034A1 (ja) * 2010-01-19 2013-05-23 国立大学法人京都大学 導電膜及びその製造方法
CN105408524A (zh) * 2013-07-24 2016-03-16 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、树脂基材、印刷配线板、覆铜积层板及印刷配线板的制造方法
JP2015042779A (ja) * 2013-07-24 2015-03-05 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
WO2015012376A1 (ja) * 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
US10257938B2 (en) 2013-07-24 2019-04-09 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
CN103755989A (zh) * 2014-01-14 2014-04-30 广东生益科技股份有限公司 电路基板及其制备方法
CN105835478A (zh) * 2015-01-29 2016-08-10 Ｊｘ金属株式会社 表面处理铜箔、及关于它的制品
CN105835478B (zh) * 2015-01-29 2019-08-09 Jx 金属株式会社 表面处理铜箔、及关于它的制品
JP2017011251A (ja) * 2015-06-24 2017-01-12 京セラ株式会社 配線基板およびその製造方法
JP2022540683A (ja) * 2019-07-15 2022-09-16 エルジー イノテック カンパニー リミテッド プリント回路基板
JP7654628B2 (ja) 2019-07-15 2025-04-01 エルジー イノテック カンパニー リミテッド プリント回路基板
WO2025192205A1 (ja) * 2024-03-15 2025-09-18 株式会社サトー 導電パターンを備えた基材、電子デバイス、電磁波シールドフィルムおよび面状発熱体

Also Published As

Publication number Publication date
KR20080014623A (ko) 2008-02-14
US20090183901A1 (en) 2009-07-23
TW200819011A (en) 2008-04-16
CN101123852A (zh) 2008-02-13

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