CN101123852A - 电路基板及其制造方法 - Google Patents

电路基板及其制造方法 Download PDF

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Publication number
CN101123852A
CN101123852A CNA2007101357124A CN200710135712A CN101123852A CN 101123852 A CN101123852 A CN 101123852A CN A2007101357124 A CNA2007101357124 A CN A2007101357124A CN 200710135712 A CN200710135712 A CN 200710135712A CN 101123852 A CN101123852 A CN 101123852A
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CN
China
Prior art keywords
layer
metal
wiring diagram
wiring
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101357124A
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English (en)
Chinese (zh)
Inventor
片岡龙男
河村裕和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of CN101123852A publication Critical patent/CN101123852A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
CNA2007101357124A 2006-08-11 2007-08-10 电路基板及其制造方法 Pending CN101123852A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006220685 2006-08-11
JP2006220685A JP2008047655A (ja) 2006-08-11 2006-08-11 配線基板およびその製造方法

Publications (1)

Publication Number Publication Date
CN101123852A true CN101123852A (zh) 2008-02-13

Family

ID=39085958

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101357124A Pending CN101123852A (zh) 2006-08-11 2007-08-10 电路基板及其制造方法

Country Status (5)

Country Link
US (1) US20090183901A1 (enExample)
JP (1) JP2008047655A (enExample)
KR (1) KR20080014623A (enExample)
CN (1) CN101123852A (enExample)
TW (1) TW200819011A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102640577A (zh) * 2009-11-25 2012-08-15 Lg伊诺特有限公司 印刷电路板及其制造方法
EP2874477A4 (en) * 2012-08-09 2016-06-22 Ngk Spark Plug Co CIRCUIT BOARD
CN106356351A (zh) * 2015-07-15 2017-01-25 恒劲科技股份有限公司 基板结构及其制作方法
CN107851484A (zh) * 2015-05-22 2018-03-27 港大科桥有限公司 具有包埋的金属网格的透明导电薄膜
CN111083936A (zh) * 2018-08-20 2020-04-28 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090260862A1 (en) * 2008-04-16 2009-10-22 Andrew Yaung Circuit modification device for printed circuit boards
WO2011090034A1 (ja) * 2010-01-19 2011-07-28 国立大学法人京都大学 導電膜及びその製造方法
WO2012070381A1 (ja) * 2010-11-22 2012-05-31 日本電気株式会社 実装構造及び実装方法
JP2013093405A (ja) * 2011-10-25 2013-05-16 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
US20130186764A1 (en) * 2012-01-19 2013-07-25 Kesheng Feng Low Etch Process for Direct Metallization
JP2013153068A (ja) * 2012-01-25 2013-08-08 Shinko Electric Ind Co Ltd 配線基板、発光装置及び配線基板の製造方法
KR101851882B1 (ko) 2013-07-23 2018-04-24 제이엑스금속주식회사 표면 처리 동박, 캐리어가 형성된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
TWI645755B (zh) * 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method
JP6593979B2 (ja) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、銅張積層板の製造方法、電子機器の製造方法及びプリント配線板の製造方法
KR101482429B1 (ko) * 2013-08-12 2015-01-13 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2015041729A (ja) * 2013-08-23 2015-03-02 イビデン株式会社 プリント配線板
CN103755989B (zh) * 2014-01-14 2017-01-11 广东生益科技股份有限公司 电路基板及其制备方法
JP6385198B2 (ja) * 2014-08-21 2018-09-05 日東電工株式会社 回路付サスペンション基板の製造方法
KR20160093555A (ko) * 2015-01-29 2016-08-08 제이엑스금속주식회사 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP2017011251A (ja) * 2015-06-24 2017-01-12 京セラ株式会社 配線基板およびその製造方法
EP3322267B1 (en) 2016-11-10 2025-02-19 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with adhesion promoting shape of wiring structure
US10512165B2 (en) * 2017-03-23 2019-12-17 Unimicron Technology Corp. Method for manufacturing a circuit board
US20190174632A1 (en) * 2017-12-05 2019-06-06 Canon Components, Inc. Flexible printed circuit and electronic device
KR102872350B1 (ko) * 2019-07-15 2025-10-17 엘지이노텍 주식회사 회로기판
CN114080088B (zh) * 2020-08-10 2024-05-31 鹏鼎控股(深圳)股份有限公司 电路板及其制备方法
KR20230026105A (ko) * 2021-08-17 2023-02-24 삼성전기주식회사 인쇄회로기판
JP2023132391A (ja) * 2022-03-11 2023-09-22 イビデン株式会社 プリント配線板
KR102783065B1 (ko) * 2022-05-26 2025-03-20 (주)테라시스 폴리이미드 필름의 제조 방법, 이에 따라 제조된 폴리이미드 필름, 금속박막 적층판의 제조 방법 및 이에 따라 제조된 금속박막 적층판
JP2025141114A (ja) * 2024-03-15 2025-09-29 株式会社サトー 導電パターンを備えた基材、電子デバイス、電磁波シールドフィルムおよび面状発熱体

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102640577A (zh) * 2009-11-25 2012-08-15 Lg伊诺特有限公司 印刷电路板及其制造方法
CN102640577B (zh) * 2009-11-25 2016-03-30 Lg伊诺特有限公司 印刷电路板及其制造方法
EP2874477A4 (en) * 2012-08-09 2016-06-22 Ngk Spark Plug Co CIRCUIT BOARD
CN107851484A (zh) * 2015-05-22 2018-03-27 港大科桥有限公司 具有包埋的金属网格的透明导电薄膜
US10550490B2 (en) 2015-05-22 2020-02-04 Versitech Limited Transparent conductive films with embedded metal grids
CN107851484B (zh) * 2015-05-22 2021-02-26 港大科桥有限公司 具有包埋的金属网格的透明导电薄膜
CN106356351A (zh) * 2015-07-15 2017-01-25 恒劲科技股份有限公司 基板结构及其制作方法
CN106356351B (zh) * 2015-07-15 2019-02-01 凤凰先驱股份有限公司 基板结构及其制作方法
CN111083936A (zh) * 2018-08-20 2020-04-28 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法
CN111083936B (zh) * 2018-08-20 2023-11-07 株式会社Lg化学 用于透明发光器件显示器的嵌入式电极基板及其制造方法

Also Published As

Publication number Publication date
US20090183901A1 (en) 2009-07-23
JP2008047655A (ja) 2008-02-28
KR20080014623A (ko) 2008-02-14
TW200819011A (en) 2008-04-16

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C02 Deemed withdrawal of patent application after publication (patent law 2001)
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Application publication date: 20080213