JP2007533921A - マイクロバルブ形成のための選択的ボンディング - Google Patents
マイクロバルブ形成のための選択的ボンディング Download PDFInfo
- Publication number
- JP2007533921A JP2007533921A JP2007501807A JP2007501807A JP2007533921A JP 2007533921 A JP2007533921 A JP 2007533921A JP 2007501807 A JP2007501807 A JP 2007501807A JP 2007501807 A JP2007501807 A JP 2007501807A JP 2007533921 A JP2007533921 A JP 2007533921A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- coating
- bonding
- silicon
- microvalve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title description 15
- 238000000034 method Methods 0.000 claims abstract description 118
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 112
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 111
- 239000010703 silicon Substances 0.000 claims abstract description 111
- 239000011248 coating agent Substances 0.000 claims abstract description 109
- 238000000576 coating method Methods 0.000 claims abstract description 109
- 239000000463 material Substances 0.000 claims abstract description 96
- 230000008569 process Effects 0.000 claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 claims description 28
- 230000004927 fusion Effects 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 230000000873 masking effect Effects 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 3
- 229920006254 polymer film Polymers 0.000 claims 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 310
- 239000012530 fluid Substances 0.000 description 24
- 238000000708 deep reactive-ion etching Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 7
- 238000005459 micromachining Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 230000003466 anti-cipated effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 240000005020 Acaciella glauca Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000009462 micro packaging Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 235000003499 redwood Nutrition 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/004—Preventing sticking together, e.g. of some areas of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/026—Chemical pre-treatments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
- B29C66/543—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining more than two hollow-preforms to form said hollow articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7317—Hydrophilicity or hydrophobicity
- B29C66/73171—Hydrophilicity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Electrically Driven Valve-Operating Means (AREA)
Abstract
Description
発明の要約
Claims (38)
- 複数の材料層の選択的ボンディングによってマイクロマシン装置を作製する方法であって、
a)第1材料層を提供すること、
b)第2材料層を提供すること、
c)前記第1層の第1部分上に被覆を設けること、および
d)マイクロマシン装置を形成するために前記第1層と前記第2層を互いにボンディングすることを含み、前記被覆が、前記被覆部分が前記第2層にボンディングするのを防ぐのに効果的であるマイクロマシン装置の作製方法。 - 前記被覆材料が、窒化ケイ素、炭化ケイ素、ポリマー・フィルム、フルオロカーボン・フィルムおよびケイ素セラミック材料からなる群より選択される、請求項1に記載の方法。
- 前記被覆材料が、窒化ケイ素である、請求項1に記載の方法。
- 前記第2層が、層内に形成された複数の機械的部品を有し、前記機械的部品が前記第2層の静止部分に対して移動できる、請求項1に記載の方法。
- 段階c)では、前記被覆が、前記第2層内に形成される前記機械的部品の位置に一致する位置で、前記第1層上に設けられ、したがって前記第1層が前記第2層に隣接して配置される場合に、前記被覆部分が前記機械的部品に隣接する、請求項4に記載の方法。
- 更に、次の段階d)が、
e)第3材料層を提供する段階と、
f)前記第3層の第1部分上に被覆を設ける段階と、
g)前記第3層と前記第2層をボンディングする段階とを含み、前記第3層上の前記被覆が、前記被覆部分が前記第2層にボンディングするのを防ぐのに効果的である、請求項5に記載の方法。 - 段階f)では、前記被覆が、前記第2層上に形成される前記機械的部品の位置に一致する位置で、前記第3層上に設けられ、したがって前記第3層が前記第2層に隣接して配置された場合に、前記被覆部分が前記機械的部品に隣接する、請求項6に記載の方法。
- 更に、次の段階a)が、a1)前記被覆材料が段階c)で前記部分に適用される場合に、前記被覆の上面が、ほぼ前記第1層の隣接上面と同一平面にあるように、そこの厚さを低減するために前記第1層の前記第1部分を薄くする段階を含む、請求項1に記載の方法。
- 段階d)では、フュージョン・ボンディング工程が、前記第1層を前記第2層にボンディングするのに用いられる、請求項1に記載の方法。
- 段階d)では、直接ボンディング工程が、前記第1層を前記第2層にボンディングするのに用いられる、請求項1に記載の方法。
- 更に、段階c)の前に、
c’)前記第1層の第2部分のマスク段階であって、前記第2部分が、前記被覆によって覆われない前記第1層の領域を含むマスク段階を備える、請求項1に記載の方法。 - 前記被覆が、10Åから100μmの厚さで適用される、請求項1に記載の方法。
- 複数の材料層の選択的ボンディングによるマイクロマシン装置の製造方法であって、
a)第1材料層を提供すること、
b)第2材料層を提供すること、
c)前記第1層と前記第2層のうち少なくとも1つの一部分上に被覆を設けること、および
d)マイクロマシン装置を形成するための前記第1層と前記第2層を互いにボンディングすることを含み、前記第2層と前記第1層のボンディングが、前記被覆が両層に接触するところだけに生じるマイクロマシン装置の製造方法 - 前記第2層がその中に形成される複数の機械的部品を有し、前記機械部品が前記第2層の静止部分に対して移動できる、請求項13に記載の方法。
- 更に、段階c)の前に、
c’)前記被覆が段階c)で設けられる場合に、前記機械的部品が被覆されずに残るように、前記第2層内に形成される前記機械的部品のマスク段階を含む、請求項14に記載の方法。 - c)段階の間に、前記第1層の選択された部分だけが被覆され、したがって前記第1層の一部分は被覆されずに残り、更に段階d)前に、
d’)前記第1層の前記被覆されない部分が前記第2層の前記機械的部品に隣接して配置されるように前記第1層と前記第2層を互いに隣接して配置する段階を含む、請求項14に記載の方法。 - 更に、次の段階d)が、
e)第3材料層を提供する段階と、
f)前記第3層の一部分が被覆されずに残るように前記第3層の選択的部分に被覆する段階と、
g)前記第3層の前記被覆されない部分が前記第2層の前記機械的部品に隣接して配置されるように前記第3層および前記第2層を互いに隣接して配置する段階と、
h)前記第3層および前記第2層を互いにボンディングする段階とを含み、前記第2層および前記第3層のボンディングが、ただ、前記被覆が両層に接触するところだけに生じる、請求項14に記載の方法。 - 更に、次の段階a)が、
a1)前記被覆材料が段階c)で前記部分に適用される場合に、前記被覆の上面が、ほぼ前記第1層の隣接上面と同一平面にあるように、そこの厚さを低減するために前記第1層の前記部分を薄くする段階を含む、請求項13に記載の方法。 - 前記被覆材料が、シリコン、二酸化ケイ素、ガラス、金、銀、およびはんだ材料からなる群より選択される、請求項13に記載の方法。
- 前記被覆が、10Åから100μmの厚さで適用される、請求項13に記載の方法。
- マイクロバルブの形成方法であって、
a)少なくとも第1層と第2層を含む複数の材料層を提供し、少なくとも前記第1層が、前記第1層の静止部分に対して移動できる可動のマイクロバルブ部分を備えること、
b)前記第2層の一部分を被覆すること、
c)前記第1層の前記可動マイクロバルブ部分に隣接して前記第2層の前記被覆された部分を配置すること、および
d)前記複数の層を合わせてボンディングするボンディング動作を実施することを含み、前記被覆が、前記第1層の前記可動マイクロバルブ部分が前記第2層の前記被覆された部分とボンディングするのを防ぎ、一方前記第2層の被覆されない部分が前記第1層の前記静止部分にボンディングするマイクロバルブ形成方法。 - 前記被覆材料が、窒化ケイ素、炭化ケイ素、ポリマー・フィルム、フルオロカーボン・フィルムおよびケイ素セラミック材料からなる群より選択される、請求項21に記載の方法。
- 前記被覆材料が窒化ケイ素である、請求項21に記載の方法。
- 前記複数の層が第3材料層を含み、更に、次の段階d)が、
e)前記第3層の一部分上に被覆を設ける段階と、
f)前記第3層を前記第1層にボンディングする段階とを含み、前記第3層上の前記被覆が、前記第1層の前記可動マイクロバルブ部分が前記第3層の前記被覆された部分にボンディングするのを防ぐのに効果的であり、一方前記第3層の被覆されない部分が前記第1層の前記静止位置にボンディングする、請求項21に記載の方法。 - 段階e)の間に、前記第3層の一部分だけが被覆され、したがって前記被覆が、前記第1層の前記可動マイクロバルブ部分の前記位置に一致する位置で前記第3層上に設けられ、前記第3層の一部分が被覆されずに残され、更に、段階e)の後に、
e1)前記被覆部分が前記第1層の前記可動マイクロバルブ部分に隣接するように前記第3層を前記第1層に隣接して配置する段階を含む、請求項24に記載の方法。 - 更に、次の段階a)が、
a1)前記被覆材料が段階b)で前記部分に適用される場合に、前記被覆の上面が、ほぼ前記第2層の隣接上面と同一平面にあるように、そこの厚さを低減するために前記第2層の第1部分を薄くする段階を含む、請求項21に記載の方法。 - 段階d)では、フュージョン・ボンディング工程が、前記第1層を前記第2層にボンディングするのに用いられる、請求項21に記載の方法。
- 段階d)では、直接ボンディング工程が、前記第1層を前記第2層にボンディングするのに用いられる、請求項21に記載の方法。
- 更に、段階b)の前に、
b’)前記第2層の第2部分のマスク段階であって、前記第2部分が、前記被覆が段階b)で前記第2層の残りの部分に適用される場合に、前記被覆によって被覆されない前記第2層の領域を含むマスク段階を備える、請求項21に記載の方法。 - 前記被覆が、10Åから100μmの厚さで適用される、請求項21に記載の方法。
- マイクロバルブの形成方法であって、
a)少なくとも前記第1層が、前記第1層の静止部分に対して移動できる可動のマイクロバルブ部分を備える、複数の材料層を提供すること、
b)第2層の一部分を被覆すること、
c)前記第1層の前記静止部分に隣接して前記第2層の前記被覆された部分を配置すること、および
d)前記複数の層を合わせてボンディングするボンディング動作を実施することを含み、前記被覆が、前記静止部分を前記第2層の前記被覆された部分にボンディングさせ、一方前記第2層の被覆されない部分が、前記第1層の前記可動マイクロバルブ部分にボンディングしないマイクロバルブ形成方法。 - マイクロマシン装置の形成方法であって、
a)第1シリコン層を提供すること、
b)第2シリコン層を提供すること、
c)摺動部分が、層部分に対して移動できるような前記摺動部分と前記層部分とを含むマイクロマシン装置の一部分を形成するために、前記第2シリコン層の一部分をエッチングすること、
d)前記摺動部分の寸法および形状に一致する寸法および形状を有して、前記第1シリコン層の一部分を被覆材料で被覆すること、
e)前記第1シリコン層の前記被覆された部分が、ほぼ前記第2シリコン層の前記摺動部分に位置合わせされるように、前記第1シリコン層を前記第2シリコン層上に配置すること、および
f)前記第1シリコン層を前記第2シリコン層に接着するためにボンディング動作を実施することを含み、
前記被覆材料が、前記ボンディング動作の間に前記摺動部分を前記第1シリコン層から分離して前記摺動部分が前記第1層にボンディングするのを防止するマイクロマシン装置の形成方法。 - マイクロマシン装置の形成方法であって、
a)第1シリコン層を提供すること、
b)第2シリコン層を提供すること、
c)層部分に対して移動できる摺動部分と前記層部分とを含むマイクロマシン装置の一部分を形成するために、前記第2シリコン層の一部分をエッチングすること、
d)被覆材料で前記第1シリコン層の一部を被覆し、ボンディングが望まれる領域内に前記被覆が配置され、前記被覆材料が、前記摺動部分上の領域が被覆されるのを防ぐように選択的にマスクされたものと、後続の段階で、前記摺動部分の上の領域から取り除かれるもののうち少なくとも1つであること、
e)前記第1層の被覆されない部分が、ほぼ前記第2シリコン層の前記摺動部分に位置合わせされるように前記第2シリコン層の上に前記第1シリコン層を配置すること、および
f)前記被覆が置かれている領域内だけで前記第1シリコン層を前記第2シリコン層にボンディングするボンディング動作を実施することを含み、前記被覆されない領域が、前記ボンディング動作の間に前記摺動部分を前記第1シリコン層から分離して前記摺動部分が、前記第1層にボンディングするのを防止するマイクロマシン装置の形成方法。 - 前記被覆材料が、シリコン、二酸化ケイ素、ガラス、金、銀、およびはんだ材料からなる群より選択される、請求項33に記載の方法。
- 前記被覆が、10Åから100μmの厚さで適用される、請求項33に記載の方法。
- マイクロマシン装置を形成する複数の材料層の選択ボンディング方法であって、
a)第1材料層を提供すること、
b)第2材料層を提供すること、
c)前記第1材料層の一部に被覆を設けること、
d)層部分に対して移動でき、かつ前記被覆部分の寸法および形状にほぼ一致する、前記第1層内の摺動部分と前記層部分とを含むマイクロマシン装置の一部分を形成するために前記第1材料層をエッチングすること、および
e)前記第1層と前記第2層を互いにボンディングすることを含み、前記被覆が、前記被覆部分が前記第2層にボンディングするのを防ぐのに効果的である選択ボンディング方法。 - 前記被覆材料が、窒化ケイ素、炭化ケイ素、ポリマー・フィルム、フルオロカーボン・フィルムおよびケイ素セラミック材料からなる群より選択される、請求項36に記載の方法。
- 前記被覆が、10Åから100μmの厚さで適用される、請求項36に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55065304P | 2004-03-05 | 2004-03-05 | |
US60/550,653 | 2004-03-05 | ||
PCT/US2005/004821 WO2005091820A2 (en) | 2004-03-05 | 2005-02-15 | Selective bonding for forming a microvalve |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007533921A true JP2007533921A (ja) | 2007-11-22 |
JP5196422B2 JP5196422B2 (ja) | 2013-05-15 |
Family
ID=35056646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007501807A Active JP5196422B2 (ja) | 2004-03-05 | 2005-02-15 | マイクロバルブ形成のための選択的ボンディング |
Country Status (6)
Country | Link |
---|---|
US (1) | US7803281B2 (ja) |
EP (1) | EP1732653A2 (ja) |
JP (1) | JP5196422B2 (ja) |
KR (1) | KR20060128042A (ja) |
CN (1) | CN1942222B (ja) |
WO (1) | WO2005091820A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008508485A (ja) * | 2004-07-27 | 2008-03-21 | ケルシ・ヘイズ、カムパニ | マイクロバルブ・アクチュエータの制御方法 |
JP2011198309A (ja) * | 2010-03-24 | 2011-10-06 | li-li Fan | 電極の敷設方法とその構造 |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5196422B2 (ja) | 2004-03-05 | 2013-05-15 | ドゥンアン、マイクロスタック、インク | マイクロバルブ形成のための選択的ボンディング |
CN102759466A (zh) | 2004-09-15 | 2012-10-31 | 英特基因有限公司 | 微流体装置 |
GB0421529D0 (en) | 2004-09-28 | 2004-10-27 | Landegren Gene Technology Ab | Microfluidic structure |
CA2641271A1 (en) | 2006-02-03 | 2008-03-13 | Microchip Biotechnologies, Inc. | Microfluidic devices |
US20110039303A1 (en) | 2007-02-05 | 2011-02-17 | Stevan Bogdan Jovanovich | Microfluidic and nanofluidic devices, systems, and applications |
DE112008000862T5 (de) * | 2007-03-30 | 2010-03-11 | Microstaq, Inc., Austin | Vorgesteuertes Mikroschieberventil |
CN101668973B (zh) * | 2007-03-31 | 2013-03-13 | 盾安美斯泰克公司(美国) | 先导式滑阀 |
WO2009108260A2 (en) | 2008-01-22 | 2009-09-03 | Microchip Biotechnologies, Inc. | Universal sample preparation system and use in an integrated analysis system |
JP2011530683A (ja) | 2008-08-09 | 2011-12-22 | マイクラスタック、インク | 改良型のマイクロバルブ・デバイス |
CN102308131B (zh) | 2008-12-06 | 2014-01-08 | 盾安美斯泰克有限公司 | 流体流动控制组件 |
WO2010077322A1 (en) | 2008-12-31 | 2010-07-08 | Microchip Biotechnologies, Inc. | Instrument with microfluidic chip |
WO2010117874A2 (en) | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Method and structure for optimizing heat exchanger performance |
WO2010141326A1 (en) | 2009-06-02 | 2010-12-09 | Integenx Inc. | Fluidic devices with diaphragm valves |
SG176669A1 (en) | 2009-06-05 | 2012-01-30 | Integenx Inc | Universal sample preparation system and use in an integrated analysis system |
CN102575782B (zh) * | 2009-08-17 | 2014-04-09 | 盾安美斯泰克股份有限公司 | 微型机械装置和控制方法 |
US8584703B2 (en) | 2009-12-01 | 2013-11-19 | Integenx Inc. | Device with diaphragm valve |
CN102792419B (zh) * | 2010-01-28 | 2015-08-05 | 盾安美斯泰克股份有限公司 | 高温选择性融合接合的工艺与构造 |
WO2011094302A2 (en) | 2010-01-28 | 2011-08-04 | Microstaq, Inc. | Process for reconditioning semiconductor surface to facilitate bonding |
US8512538B2 (en) | 2010-05-28 | 2013-08-20 | Integenx Inc. | Capillary electrophoresis device |
US8763642B2 (en) | 2010-08-20 | 2014-07-01 | Integenx Inc. | Microfluidic devices with mechanically-sealed diaphragm valves |
WO2012024658A2 (en) | 2010-08-20 | 2012-02-23 | IntegenX, Inc. | Integrated analysis system |
US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller |
US10865440B2 (en) | 2011-10-21 | 2020-12-15 | IntegenX, Inc. | Sample preparation, processing and analysis systems |
US20150136604A1 (en) | 2011-10-21 | 2015-05-21 | Integenx Inc. | Sample preparation, processing and analysis systems |
US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor |
WO2014101057A1 (zh) * | 2012-12-27 | 2014-07-03 | 浙江盾安人工环境股份有限公司 | 微阀器件与阀体组件 |
US20150345663A1 (en) * | 2013-01-11 | 2015-12-03 | Tinghou Jiang | Microvalve Device and Manufacturing Method Therefor |
CN104329484B (zh) * | 2013-06-24 | 2018-11-30 | 浙江盾安禾田金属有限公司 | 具有增强的抗污性的微型阀 |
CN104455629B (zh) * | 2013-09-13 | 2018-03-16 | 浙江盾安人工环境股份有限公司 | 一种微阀 |
CN104445043B (zh) * | 2013-09-13 | 2017-07-07 | 浙江盾安人工环境股份有限公司 | 一种mems微阀及其制作工艺 |
CN104609357B (zh) * | 2013-11-01 | 2017-11-07 | 浙江盾安人工环境股份有限公司 | 一种微阀 |
CN110560187B (zh) | 2013-11-18 | 2022-01-11 | 尹特根埃克斯有限公司 | 用于样本分析的卡盒和仪器 |
CN104653854B (zh) * | 2013-11-22 | 2018-04-20 | 浙江盾安人工环境股份有限公司 | 温差致动式微阀 |
US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly |
WO2015179098A1 (en) | 2014-05-21 | 2015-11-26 | Integenx Inc. | Fluidic cartridge with valve mechanism |
US10690627B2 (en) | 2014-10-22 | 2020-06-23 | IntegenX, Inc. | Systems and methods for sample preparation, processing and analysis |
US9970572B2 (en) | 2014-10-30 | 2018-05-15 | Dunan Microstaq, Inc. | Micro-electric mechanical system control valve and method for controlling a sensitive fluid |
CN104728492A (zh) * | 2015-01-27 | 2015-06-24 | 东南大学 | 一种微型被动流量调节阀及其制作工艺 |
DE102015210919A1 (de) | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
US10094490B2 (en) | 2015-06-16 | 2018-10-09 | Dunan Microstaq, Inc. | Microvalve having contamination resistant features |
US10233491B2 (en) | 2015-06-19 | 2019-03-19 | IntegenX, Inc. | Valved cartridge and system |
US10190702B2 (en) * | 2016-03-15 | 2019-01-29 | Dunan Microstaq, Inc. | MEMS based solenoid valve |
DE102017206766A1 (de) | 2017-04-21 | 2018-10-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-wandler zum interagieren mit einem volumenstrom eines fluids und verfahren zum herstellen desselben |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05505447A (ja) * | 1991-01-21 | 1993-08-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 超小型弁 |
JP2000187041A (ja) * | 1998-12-24 | 2000-07-04 | Mitsubishi Electric Corp | 容量式加速度センサ及びその製造方法 |
JP2001281265A (ja) * | 2000-03-31 | 2001-10-10 | Sumitomo Precision Prod Co Ltd | 加速度センサとその使用及び製造方法 |
Family Cites Families (135)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US886045A (en) * | 1906-03-06 | 1908-04-28 | Herman J Ehrlich | Valve. |
US1926031A (en) * | 1927-05-17 | 1933-09-12 | Chas A Beatty | Automatic stage lift flowing device |
US1886205A (en) | 1929-07-01 | 1932-11-01 | Int Harvester Co | Spring pressure contact element |
US2412205A (en) | 1945-05-12 | 1946-12-10 | John A Cook | Pontoon metering valve and combination |
US2504055A (en) * | 1948-10-08 | 1950-04-11 | Stewart Warner Corp | High-pressure lubricant receiving fitting |
US2875779A (en) * | 1954-02-08 | 1959-03-03 | John F Campbell | Variable area metering valve |
US2840107A (en) * | 1955-01-31 | 1958-06-24 | John F Campbell | Variable area scheduling valve |
US3031747A (en) * | 1957-12-31 | 1962-05-01 | Tung Sol Electric Inc | Method of forming ohmic contact to silicon |
GB1374626A (en) * | 1970-10-30 | 1974-11-20 | Matsushita Electronics Corp | Method of making a semiconductor device |
NL7102074A (ja) * | 1971-02-17 | 1972-08-21 | ||
DE2215526C3 (de) | 1972-03-30 | 1979-02-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines sperrfreien Metallanschlußkontaktes an p- oder n-leitende Halbleiterkörper |
US3860949A (en) * | 1973-09-12 | 1975-01-14 | Rca Corp | Semiconductor mounting devices made by soldering flat surfaces to each other |
GB1457806A (en) * | 1974-03-04 | 1976-12-08 | Mullard Ltd | Semiconductor device manufacture |
DE2514922C2 (de) * | 1975-04-05 | 1983-01-27 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Gegen thermische Wechselbelastung beständiges Halbleiterbauelement |
US4019388A (en) * | 1976-03-11 | 1977-04-26 | Bailey Meter Company | Glass to metal seal |
US4152540A (en) * | 1977-05-03 | 1979-05-01 | American Pacemaker Corporation | Feedthrough connector for implantable cardiac pacer |
US4181249A (en) * | 1977-08-26 | 1980-01-01 | Hughes Aircraft Company | Eutectic die attachment method for integrated circuits |
DE2930779C2 (de) | 1978-07-28 | 1983-08-04 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Halbleitervorrichtung |
DE2933835A1 (de) * | 1979-08-21 | 1981-03-26 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum befestigen von in scheiben- oder plattenform vorliegenden targetmaterialien auf kuehlteller fuer aufstaeubanlagen |
US4476893A (en) | 1980-07-04 | 1984-10-16 | Barmag Barmer Maschinenfabrik Ag | Hydraulic flow control valve |
US4298023A (en) | 1980-09-09 | 1981-11-03 | Mcginnis Gerald E | Spring loaded exhalation valve |
US4434813A (en) * | 1981-11-19 | 1984-03-06 | The United States Of America As Represented By The Secretary Of The Army | Laminar proportional amplifier and laminar jet angular rate sensor with rotating splitter for null adjustment |
DE3401404A1 (de) | 1984-01-17 | 1985-07-25 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
US4581624A (en) * | 1984-03-01 | 1986-04-08 | Allied Corporation | Microminiature semiconductor valve |
US4593719A (en) | 1984-11-30 | 1986-06-10 | Leonard Willie B | Spool valve |
US4772935A (en) * | 1984-12-19 | 1988-09-20 | Fairchild Semiconductor Corporation | Die bonding process |
US4647013A (en) * | 1985-02-21 | 1987-03-03 | Ford Motor Company | Silicon valve |
US4628576A (en) | 1985-02-21 | 1986-12-16 | Ford Motor Company | Method for fabricating a silicon valve |
US4821997A (en) * | 1986-09-24 | 1989-04-18 | The Board Of Trustees Of The Leland Stanford Junior University | Integrated, microminiature electric-to-fluidic valve and pressure/flow regulator |
US4824073A (en) * | 1986-09-24 | 1989-04-25 | Stanford University | Integrated, microminiature electric to fluidic valve |
US4943032A (en) * | 1986-09-24 | 1990-07-24 | Stanford University | Integrated, microminiature electric to fluidic valve and pressure/flow regulator |
US4966646A (en) * | 1986-09-24 | 1990-10-30 | Board Of Trustees Of Leland Stanford University | Method of making an integrated, microminiature electric-to-fluidic valve |
DE3738630C2 (de) * | 1987-11-13 | 1995-06-08 | Rexroth Mannesmann Gmbh | Elektrohydraulische Druckwandlervorrichtung |
US4938742A (en) * | 1988-02-04 | 1990-07-03 | Smits Johannes G | Piezoelectric micropump with microvalves |
JP2503569B2 (ja) | 1988-02-24 | 1996-06-05 | 株式会社豊田自動織機製作所 | ワブル型コンプレッサの駆動制御装置 |
DE3814150A1 (de) * | 1988-04-27 | 1989-11-09 | Draegerwerk Ag | Ventilanordnung aus mikrostrukturierten komponenten |
US5065978A (en) | 1988-04-27 | 1991-11-19 | Dragerwerk Aktiengesellschaft | Valve arrangement of microstructured components |
US4828184A (en) * | 1988-08-12 | 1989-05-09 | Ford Motor Company | Silicon micromachined compound nozzle |
US4826131A (en) * | 1988-08-22 | 1989-05-02 | Ford Motor Company | Electrically controllable valve etched from silicon substrates |
US5074629A (en) | 1988-10-26 | 1991-12-24 | Stanford University | Integrated variable focal length lens and its applications |
US4869282A (en) * | 1988-12-09 | 1989-09-26 | Rosemount Inc. | Micromachined valve with polyimide film diaphragm |
US5177579A (en) * | 1989-04-07 | 1993-01-05 | Ic Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
US5209118A (en) * | 1989-04-07 | 1993-05-11 | Ic Sensors | Semiconductor transducer or actuator utilizing corrugated supports |
US5064165A (en) | 1989-04-07 | 1991-11-12 | Ic Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
US5116457A (en) * | 1989-04-07 | 1992-05-26 | I C Sensors, Inc. | Semiconductor transducer or actuator utilizing corrugated supports |
US5037778A (en) * | 1989-05-12 | 1991-08-06 | Intel Corporation | Die attach using gold ribbon with gold/silicon eutectic alloy cladding |
DE3917423C1 (ja) * | 1989-05-29 | 1990-05-31 | Buerkert Gmbh & Co Werk Ingelfingen, 7118 Ingelfingen, De | |
DE3917396A1 (de) * | 1989-05-29 | 1990-12-06 | Buerkert Gmbh | Mikroventil |
DE3919876A1 (de) | 1989-06-19 | 1990-12-20 | Bosch Gmbh Robert | Mikroventil |
US5069419A (en) | 1989-06-23 | 1991-12-03 | Ic Sensors Inc. | Semiconductor microactuator |
US5061914A (en) * | 1989-06-27 | 1991-10-29 | Tini Alloy Company | Shape-memory alloy micro-actuator |
US5066533A (en) | 1989-07-11 | 1991-11-19 | The Perkin-Elmer Corporation | Boron nitride membrane in wafer structure and process of forming the same |
DE3926647A1 (de) * | 1989-08-11 | 1991-02-14 | Bosch Gmbh Robert | Verfahren zur herstellung eines mikroventils |
US5238223A (en) * | 1989-08-11 | 1993-08-24 | Robert Bosch Gmbh | Method of making a microvalve |
GB2238267A (en) | 1989-11-01 | 1991-05-29 | Stc Plc | Brazing process |
DE3940427A1 (de) * | 1989-12-07 | 1991-06-13 | Bosch Gmbh Robert | Fahrzeugbremsanlage mit blockierschutzvorrichtung |
US5082242A (en) * | 1989-12-27 | 1992-01-21 | Ulrich Bonne | Electronic microvalve apparatus and fabrication |
US5180623A (en) * | 1989-12-27 | 1993-01-19 | Honeywell Inc. | Electronic microvalve apparatus and fabrication |
US5244537A (en) * | 1989-12-27 | 1993-09-14 | Honeywell, Inc. | Fabrication of an electronic microvalve apparatus |
US5133379A (en) * | 1990-01-31 | 1992-07-28 | University Of Utah Research Foundation | Servovalve apparatus for use in fluid systems |
DE4003619A1 (de) | 1990-02-07 | 1991-08-14 | Bosch Gmbh Robert | Mikroventil |
DE4006152A1 (de) * | 1990-02-27 | 1991-08-29 | Fraunhofer Ges Forschung | Mikrominiaturisierte pumpe |
DE4009090A1 (de) | 1990-03-21 | 1991-09-26 | Bosch Gmbh Robert | Verfahren zur herstellung von mehrschichtigen siliziumstrukturen |
AU8299191A (en) * | 1990-07-13 | 1992-02-04 | Transkaryotic Therapies, Inc. | Library screening method |
US5050838A (en) * | 1990-07-31 | 1991-09-24 | Hewlett-Packard Company | Control valve utilizing mechanical beam buckling |
DE4035852A1 (de) * | 1990-11-10 | 1992-05-14 | Bosch Gmbh Robert | Mikroventil in mehrschichtenaufbau |
DE4041579A1 (de) * | 1990-12-22 | 1992-06-25 | Bosch Gmbh Robert | Mikroventil |
GB2251703B (en) * | 1991-01-11 | 1994-08-03 | Marconi Gec Ltd | Valve devices |
US5400824A (en) * | 1991-01-21 | 1995-03-28 | Robert Bosch Gmbh | Microvalve |
DE4107660C2 (de) * | 1991-03-09 | 1995-05-04 | Bosch Gmbh Robert | Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen |
US5058856A (en) * | 1991-05-08 | 1991-10-22 | Hewlett-Packard Company | Thermally-actuated microminiature valve |
US5176358A (en) * | 1991-08-08 | 1993-01-05 | Honeywell Inc. | Microstructure gas valve control |
US5355712A (en) * | 1991-09-13 | 1994-10-18 | Lucas Novasensor | Method and apparatus for thermally actuated self testing of silicon structures |
US5217283A (en) * | 1991-09-25 | 1993-06-08 | Ford Motor Company | Integral anti-lock brake/traction control system |
US5179499A (en) * | 1992-04-14 | 1993-01-12 | Cornell Research Foundation, Inc. | Multi-dimensional precision micro-actuator |
US5222521A (en) | 1992-05-08 | 1993-06-29 | Moog Controls, Inc. | Hydraulic valve |
US5271597A (en) | 1992-05-29 | 1993-12-21 | Ic Sensors, Inc. | Bimetallic diaphragm with split hinge for microactuator |
JPH0656014A (ja) | 1992-08-07 | 1994-03-01 | Nisshinbo Ind Inc | アンチスキッド制御方法 |
US5309943A (en) * | 1992-12-07 | 1994-05-10 | Ford Motor Company | Micro-valve and method of manufacturing |
US5300461A (en) * | 1993-01-25 | 1994-04-05 | Intel Corporation | Process for fabricating sealed semiconductor chip using silicon nitride passivation film |
US5333831A (en) * | 1993-02-19 | 1994-08-02 | Hewlett-Packard Company | High performance micromachined valve orifice and seat |
JPH06286600A (ja) * | 1993-03-31 | 1994-10-11 | Toyota Motor Corp | 車両用ブレーキ圧制御装置 |
US5445185A (en) * | 1993-04-05 | 1995-08-29 | Ford Motor Company | Piezoelectric fluid control valve |
US5267589A (en) | 1993-04-05 | 1993-12-07 | Ford Motor Company | Piezoelectric pressure control valve |
US5325880A (en) * | 1993-04-19 | 1994-07-05 | Tini Alloy Company | Shape memory alloy film actuated microvalve |
US5417235A (en) * | 1993-07-28 | 1995-05-23 | Regents Of The University Of Michigan | Integrated microvalve structures with monolithic microflow controller |
US5368704A (en) | 1993-08-06 | 1994-11-29 | Teknekron Corporation | Micro-electrochemical valves and method |
DE4331851A1 (de) * | 1993-09-20 | 1995-03-23 | Bosch Gmbh Robert | Lochkörper und Ventil mit Lochkörper |
DE4417251A1 (de) | 1994-05-17 | 1995-11-23 | Bosch Gmbh Robert | Druckausgeglichenes Mikroventil |
DE4422942B4 (de) | 1994-06-30 | 2004-07-08 | Robert Bosch Gmbh | Vorrichtung für den Antrieb eines Mikroventils |
US5611214A (en) * | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
US5473944A (en) * | 1994-08-18 | 1995-12-12 | Kulite Semi Conductor Products, Inc. | Seam pressure sensor employing dielectically isolated resonant beams and related method of manufacture |
US5577533A (en) | 1994-09-13 | 1996-11-26 | Cook, Jr.; Joseph S. | Flexured shaft poppet |
DE19526897A1 (de) * | 1995-07-22 | 1997-01-23 | Bosch Gmbh Robert | Mikroventil mit verbundenen Schichten und Verfahren zur Herstellung eines Mikroventils |
US5838351A (en) | 1995-10-26 | 1998-11-17 | Hewlett-Packard Company | Valve assembly for controlling fluid flow within an ink-jet pen |
US5941608A (en) * | 1996-03-07 | 1999-08-24 | Kelsey-Hayes Company | Electronic brake management system with manual fail safe |
US5954079A (en) * | 1996-04-30 | 1999-09-21 | Hewlett-Packard Co. | Asymmetrical thermal actuation in a microactuator |
US6533366B1 (en) * | 1996-05-29 | 2003-03-18 | Kelsey-Hayes Company | Vehicle hydraulic braking systems incorporating micro-machined technology |
US6019437A (en) * | 1996-05-29 | 2000-02-01 | Kelsey-Hayes Company | Vehicle hydraulic braking systems incorporating micro-machined technology |
US6105737A (en) * | 1996-06-05 | 2000-08-22 | Varity Kelsey-Hayes Gmbh | Programmable electronic pedal simulator |
JP3649743B2 (ja) * | 1996-06-12 | 2005-05-18 | ウシオ電機株式会社 | 陽極の窓領域が薄いモノリシックシリコン膜により形成される化学線源 |
US5810325A (en) * | 1996-06-25 | 1998-09-22 | Bcam International, Inc. | Microvalve |
US5785295A (en) * | 1996-08-27 | 1998-07-28 | Industrial Technology Research Institute | Thermally buckling control microvalve |
US6038928A (en) * | 1996-10-07 | 2000-03-21 | Lucas Novasensor | Miniature gauge pressure sensor using silicon fusion bonding and back etching |
US5909078A (en) * | 1996-12-16 | 1999-06-01 | Mcnc | Thermal arched beam microelectromechanical actuators |
US5994816A (en) * | 1996-12-16 | 1999-11-30 | Mcnc | Thermal arched beam microelectromechanical devices and associated fabrication methods |
US6124663A (en) | 1996-12-16 | 2000-09-26 | The Boeing Company | Fiber optic connector having a microelectromechanical positioning apparatus and an associated fabrication method |
US6096149A (en) * | 1997-04-21 | 2000-08-01 | Ford Global Technologies, Inc. | Method for fabricating adhesion-resistant micromachined devices |
US6116863A (en) | 1997-05-30 | 2000-09-12 | University Of Cincinnati | Electromagnetically driven microactuated device and method of making the same |
US5873385A (en) | 1997-07-21 | 1999-02-23 | Emhart Inc. | Check valve |
US5848605A (en) | 1997-11-12 | 1998-12-15 | Cybor Corporation | Check valve |
US5970998A (en) * | 1998-02-27 | 1999-10-26 | The Regents Of The University Of California | Microfabricated cantilever ratchet valve, and method for using same |
US6171972B1 (en) * | 1998-03-17 | 2001-01-09 | Rosemount Aerospace Inc. | Fracture-resistant micromachined devices |
US6523560B1 (en) * | 1998-09-03 | 2003-02-25 | General Electric Corporation | Microvalve with pressure equalization |
ATE393319T1 (de) * | 1998-09-03 | 2008-05-15 | Ge Novasensor Inc | Proportionale, mikromechanische vorrichtung |
US7011378B2 (en) | 1998-09-03 | 2006-03-14 | Ge Novasensor, Inc. | Proportional micromechanical valve |
JP2000220763A (ja) | 1999-01-29 | 2000-08-08 | Toyota Autom Loom Works Ltd | 可変容量型圧縮機用の容量制御弁 |
US6540203B1 (en) * | 1999-03-22 | 2003-04-01 | Kelsey-Hayes Company | Pilot operated microvalve device |
JP4020233B2 (ja) * | 1999-08-25 | 2007-12-12 | セイコーインスツル株式会社 | 近視野光ヘッドとその製造方法 |
US6255757B1 (en) | 1999-09-01 | 2001-07-03 | Jds Uniphase Inc. | Microactuators including a metal layer on distal portions of an arched beam |
US6279606B1 (en) * | 1999-10-18 | 2001-08-28 | Kelsey-Hayes Company | Microvalve device having a check valve |
US6477901B1 (en) * | 1999-12-21 | 2002-11-12 | Integrated Sensing Systems, Inc. | Micromachined fluidic apparatus |
US6390782B1 (en) * | 2000-03-21 | 2002-05-21 | Alumina Micro Llc | Control valve for a variable displacement compressor |
US6694998B1 (en) | 2000-03-22 | 2004-02-24 | Kelsey-Hayes Company | Micromachined structure usable in pressure regulating microvalve and proportional microvalve |
US6845962B1 (en) * | 2000-03-22 | 2005-01-25 | Kelsey-Hayes Company | Thermally actuated microvalve device |
US6494804B1 (en) * | 2000-06-20 | 2002-12-17 | Kelsey-Hayes Company | Microvalve for electronically controlled transmission |
US6505811B1 (en) * | 2000-06-27 | 2003-01-14 | Kelsey-Hayes Company | High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate |
US6581640B1 (en) * | 2000-08-16 | 2003-06-24 | Kelsey-Hayes Company | Laminated manifold for microvalve |
US20020096421A1 (en) * | 2000-11-29 | 2002-07-25 | Cohn Michael B. | MEMS device with integral packaging |
JP3943871B2 (ja) | 2001-07-25 | 2007-07-11 | 株式会社テージーケー | 可変容量圧縮機および可変容量圧縮機用容量制御弁 |
US6958255B2 (en) * | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
KR20060109959A (ko) | 2003-11-24 | 2006-10-23 | 알루미나 마이크로 엘엘씨 | 가변형 변위 압축기 제어용 마이크로밸브 장치 |
US20080042084A1 (en) | 2004-02-27 | 2008-02-21 | Edward Nelson Fuller | Hybrid Micro/Macro Plate Valve |
JP5196422B2 (ja) | 2004-03-05 | 2013-05-15 | ドゥンアン、マイクロスタック、インク | マイクロバルブ形成のための選択的ボンディング |
JP2006307828A (ja) | 2005-03-31 | 2006-11-09 | Tgk Co Ltd | 可変容量圧縮機用制御弁 |
-
2005
- 2005-02-15 JP JP2007501807A patent/JP5196422B2/ja active Active
- 2005-02-15 US US10/590,954 patent/US7803281B2/en active Active
- 2005-02-15 WO PCT/US2005/004821 patent/WO2005091820A2/en active Application Filing
- 2005-02-15 CN CN2005800110903A patent/CN1942222B/zh active Active
- 2005-02-15 EP EP20050713615 patent/EP1732653A2/en not_active Withdrawn
- 2005-02-15 KR KR1020067020632A patent/KR20060128042A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05505447A (ja) * | 1991-01-21 | 1993-08-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 超小型弁 |
JP2000187041A (ja) * | 1998-12-24 | 2000-07-04 | Mitsubishi Electric Corp | 容量式加速度センサ及びその製造方法 |
JP2001281265A (ja) * | 2000-03-31 | 2001-10-10 | Sumitomo Precision Prod Co Ltd | 加速度センサとその使用及び製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008508485A (ja) * | 2004-07-27 | 2008-03-21 | ケルシ・ヘイズ、カムパニ | マイクロバルブ・アクチュエータの制御方法 |
JP2011198309A (ja) * | 2010-03-24 | 2011-10-06 | li-li Fan | 電極の敷設方法とその構造 |
Also Published As
Publication number | Publication date |
---|---|
EP1732653A2 (en) | 2006-12-20 |
CN1942222A (zh) | 2007-04-04 |
WO2005091820A3 (en) | 2006-10-26 |
US20070289941A1 (en) | 2007-12-20 |
US7803281B2 (en) | 2010-09-28 |
JP5196422B2 (ja) | 2013-05-15 |
CN1942222B (zh) | 2011-08-31 |
WO2005091820A2 (en) | 2005-10-06 |
KR20060128042A (ko) | 2006-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5196422B2 (ja) | マイクロバルブ形成のための選択的ボンディング | |
JP4831446B2 (ja) | マイクロバルブ装置 | |
US7090471B2 (en) | Integrated electrostatic peristaltic pump method and apparatus | |
US6386507B2 (en) | Microelectromechanical valves including single crystalline material components | |
US4966646A (en) | Method of making an integrated, microminiature electric-to-fluidic valve | |
US7011378B2 (en) | Proportional micromechanical valve | |
JP4383053B2 (ja) | 超小型流体用バルブ、および、超小型バルブ用マイクロアクチュエータ | |
EP2013137B1 (en) | Process for collective manufacturing of membranes and small volume cavities having high dimensional accuracy | |
WO2010019329A2 (en) | Improved microvalve device | |
WO2000032972A1 (en) | Micro-electromechanical block regulating fluid flow | |
TWI277600B (en) | Single wafer fabrication of integrated micro-fluidic system | |
CN105659013A (zh) | 微阀装置和微阀装置的制造方法 | |
Kuehl et al. | Advanced silicon trench etching in MEMS applications | |
JP2628019B2 (ja) | 静電駆動型マイクロアクチュエータとバルブの製作方法、及び静電駆動型ポンプ | |
GB2295441A (en) | Microminature fluid flow device | |
US11927281B1 (en) | Piezoelectrically-actuated microvalve device and method of fabrication | |
JP4529619B2 (ja) | マイクロバルブ | |
JP4353006B2 (ja) | 半導体構造の製造方法 | |
JP2009186017A (ja) | マイクロバルブ | |
JP2006015440A (ja) | 半導体構造の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080115 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101207 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110302 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110309 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110607 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120110 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120409 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120416 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120704 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130122 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130130 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160215 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5196422 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |