JP2007524243A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007524243A5 JP2007524243A5 JP2007500029A JP2007500029A JP2007524243A5 JP 2007524243 A5 JP2007524243 A5 JP 2007524243A5 JP 2007500029 A JP2007500029 A JP 2007500029A JP 2007500029 A JP2007500029 A JP 2007500029A JP 2007524243 A5 JP2007524243 A5 JP 2007524243A5
- Authority
- JP
- Japan
- Prior art keywords
- transparent material
- protective layer
- replication tool
- layer
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims 16
- 238000000034 method Methods 0.000 claims 15
- 230000010076 replication Effects 0.000 claims 11
- 239000010410 layer Substances 0.000 claims 10
- 239000011241 protective layer Substances 0.000 claims 9
- 239000012780 transparent material Substances 0.000 claims 9
- 239000007788 liquid Substances 0.000 claims 3
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000003362 replicative effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04405110A EP1569276A1 (en) | 2004-02-27 | 2004-02-27 | Micro-optics on optoelectronics |
| EP04405110.0 | 2004-02-27 | ||
| PCT/CH2005/000109 WO2005083789A2 (en) | 2004-02-27 | 2005-02-25 | Micro-optics on optoelectronics |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007524243A JP2007524243A (ja) | 2007-08-23 |
| JP2007524243A5 true JP2007524243A5 (enExample) | 2008-03-27 |
| JP4903685B2 JP4903685B2 (ja) | 2012-03-28 |
Family
ID=34746192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007500029A Expired - Lifetime JP4903685B2 (ja) | 2004-02-27 | 2005-02-25 | 集積光学システムを製造する方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7457490B2 (enExample) |
| EP (2) | EP1569276A1 (enExample) |
| JP (1) | JP4903685B2 (enExample) |
| KR (1) | KR101194452B1 (enExample) |
| CN (1) | CN1947254B (enExample) |
| AT (1) | ATE498910T1 (enExample) |
| DE (1) | DE602005026367D1 (enExample) |
| TW (1) | TWI362058B (enExample) |
| WO (1) | WO2005083789A2 (enExample) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6297548B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
| JP2009516913A (ja) * | 2005-11-22 | 2009-04-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光モジュール及びその製造方法 |
| JP2007258672A (ja) * | 2006-02-22 | 2007-10-04 | Sharp Corp | 発光ダイオード及びその製造方法 |
| JP4765663B2 (ja) * | 2006-02-23 | 2011-09-07 | パナソニック電工株式会社 | 赤外線通信用モジュールの製造方法 |
| US7785915B2 (en) * | 2006-10-30 | 2010-08-31 | Aptina Imaging Corporation | Wafer level method of locating focal plane of imager devices |
| US20080181558A1 (en) * | 2007-01-31 | 2008-07-31 | Hartwell Peter G | Electronic and optical circuit integration through wafer bonding |
| US7754600B2 (en) | 2007-03-01 | 2010-07-13 | Hewlett-Packard Development Company, L.P. | Methods of forming nanostructures on metal-silicide crystallites, and resulting structures and devices |
| US20090032925A1 (en) * | 2007-07-31 | 2009-02-05 | England Luke G | Packaging with a connection structure |
| US20100323105A1 (en) | 2007-08-31 | 2010-12-23 | Shigeru Hosoe | Molding method, optical element manufacturing method, and arrayed optical element |
| EP2060493B1 (en) * | 2007-11-13 | 2010-06-23 | Oy M. Haloila Ab | Film delivery device and use of same |
| TWI481496B (zh) | 2007-12-19 | 2015-04-21 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
| TWI478808B (zh) | 2007-12-19 | 2015-04-01 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
| SG142321A1 (en) | 2008-04-24 | 2009-11-26 | Micron Technology Inc | Pre-encapsulated cavity interposer |
| GB2460822A (en) * | 2008-06-03 | 2009-12-16 | Cambridge Display Tech Ltd | Organic electroluminescent device |
| US7920342B2 (en) * | 2008-07-01 | 2011-04-05 | Aptina Imaging Corporation | Over-molded glass lenses and method of forming the same |
| US8542310B2 (en) | 2008-07-04 | 2013-09-24 | Konica Minolta Opto, Inc. | Imaging lens, manufacturing method and imaging unit therefor |
| CN101364568B (zh) * | 2008-07-10 | 2011-11-30 | 旭丽电子(广州)有限公司 | 镜头模块的制造方法及以该方法所制成的镜头模块 |
| TWI419557B (zh) * | 2008-07-11 | 2013-12-11 | Lite On Electronics Guangzhou | 鏡頭模組、其製作方法及形成多個鏡頭模組的晶圓結構 |
| US8828174B2 (en) | 2008-08-20 | 2014-09-09 | Heptagon Micro Optics Pte. Ltd. | Method of manufacturing a plurality of optical devices |
| JP5715747B2 (ja) * | 2008-09-30 | 2015-05-13 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
| US20110187878A1 (en) * | 2010-02-02 | 2011-08-04 | Primesense Ltd. | Synchronization of projected illumination with rolling shutter of image sensor |
| EP2580781A1 (en) | 2010-06-14 | 2013-04-17 | Heptagon Micro Optics Pte. Ltd. | Method of manufacturing a plurality of optical devices |
| SG191817A1 (en) | 2011-07-19 | 2013-08-30 | Heptagon Micro Optics Pte Ltd | Opto -electronic modules and methods of manufacturing the same |
| SG10201605834YA (en) | 2011-07-19 | 2016-09-29 | Heptagon Micro Optics Pte Ltd | Method for manufacturing passive optical components, and devices comprising the same |
| EP2742529B1 (en) | 2011-08-10 | 2020-11-11 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module and method for manufacturing the same |
| DE102011113483B4 (de) * | 2011-09-13 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement |
| SG11201400917VA (en) * | 2011-10-06 | 2014-07-30 | Heptagon Micro Optics Pte Ltd | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
| EP2795674B1 (en) | 2011-12-22 | 2021-12-15 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
| CN104160240B (zh) | 2012-02-15 | 2017-02-22 | 苹果公司 | 扫描深度引擎 |
| US9329080B2 (en) | 2012-02-15 | 2016-05-03 | Aplle Inc. | Modular optics for scanning engine having beam combining optics with a prism intercepted by both beam axis and collection axis |
| TW201417250A (zh) * | 2012-07-17 | 2014-05-01 | 海特根微光學公司 | 光學模組,特別是光電模組,及其製造方法 |
| WO2014012603A1 (en) | 2012-07-17 | 2014-01-23 | Heptagon Micro Optics Pte. Ltd. | Optical devices, in particular computational cameras, and methods for manufacturing the same |
| TWI707483B (zh) | 2012-07-17 | 2020-10-11 | 新加坡商新加坡恒立私人有限公司 | 發射可變強度分布的光線的光電模組 |
| TWM448798U (zh) * | 2012-08-10 | 2013-03-11 | 麥瑟半導體股份有限公司 | 光學元件封裝模組 |
| DE102012109183A1 (de) * | 2012-09-27 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronische Vorrichtung |
| US8606057B1 (en) | 2012-11-02 | 2013-12-10 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules including electrically conductive connections for integration with an electronic device |
| WO2015088442A1 (en) * | 2013-12-10 | 2015-06-18 | Heptagon Micro Optics Pte. Ltd. | Wafer-level optical modules and methods for manufacturing the same |
| US10018788B2 (en) | 2014-10-28 | 2018-07-10 | Hewlett Packard Enterprise Development Lp | Photonic interposer with wafer bonded microlenses |
| DE102014116134A1 (de) * | 2014-11-05 | 2016-05-12 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
| DE102016100220A1 (de) * | 2015-01-06 | 2016-07-07 | Huf Hülsbeck & Fürst Gmbh & Co. Kg | Optische Vorrichtung zur Belichtung einer Sensorvorrichtung für ein Fahrzeug |
| JP6783435B2 (ja) | 2015-10-01 | 2020-11-11 | トルンプ フォトニック コンポーネンツ ゲーエムベーハー | 発光デバイス |
| DE102016103123A1 (de) * | 2016-02-23 | 2017-08-24 | Vishay Semiconductor Gmbh | Optoelektronische Vorrichtung |
| WO2017176213A1 (en) * | 2016-04-08 | 2017-10-12 | Heptagon Micro Optics Pte. Ltd. | Thin optoelectronic modules with apertures and their manufacture |
| DE102017100997A1 (de) | 2017-01-19 | 2018-07-19 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und Verfahren zur Herstellung eines solchen Halbleiterlasers |
| KR102698883B1 (ko) * | 2019-02-22 | 2024-08-28 | 삼성디스플레이 주식회사 | 표시장치 및 그의 제조방법 |
| WO2020185162A1 (en) * | 2019-03-12 | 2020-09-17 | Ams Sensors Singapore Pte. Ltd. | Method of manufacturing a plurality of optical elements and product thereof |
| EP3986718A4 (en) * | 2019-06-24 | 2022-09-14 | Magic Leap, Inc. | FABRICATION OF POLYMER PATTERN DISC STACKS |
| US10777611B1 (en) * | 2019-09-27 | 2020-09-15 | Sony Semiconductor Solutions Corporation | Image sensor |
| US11747555B2 (en) | 2021-10-04 | 2023-09-05 | Eagle Technology, Llc | Optical assembly having commonly-shaped optical modules and associated methods |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56103483A (en) * | 1980-01-21 | 1981-08-18 | Fuji Photo Film Co Ltd | Manufacture of semiconductor device for photoelectric conversion |
| JPH07111343A (ja) * | 1993-10-13 | 1995-04-25 | Matsushita Electron Corp | 光電装置 |
| US20020053742A1 (en) * | 1995-09-01 | 2002-05-09 | Fumio Hata | IC package and its assembly method |
| US6235141B1 (en) * | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
| JPH11340480A (ja) | 1998-05-21 | 1999-12-10 | Tokai Rika Co Ltd | プラスティックパッケージ |
| JP2000275405A (ja) * | 1999-03-29 | 2000-10-06 | Canon Inc | マイクロ構造体アレイの作製方法、マイクロレンズアレイ用金型の作製方法、及びこれを用いたマイクロレンズアレイの作製方法 |
| US6436265B1 (en) | 1999-03-29 | 2002-08-20 | Canon Kabushiki Kaisha | Microstructure array, and apparatus and method for forming the microstructure array, and a mold for fabricating a microstructure array |
| TW588414B (en) * | 2000-06-08 | 2004-05-21 | Toshiba Corp | Alignment method, overlap inspecting method and mask |
| US20040012698A1 (en) * | 2001-03-05 | 2004-01-22 | Yasuo Suda | Image pickup model and image pickup device |
| JP2002353763A (ja) * | 2001-05-29 | 2002-12-06 | Mitsubishi Electric Corp | 圧電素子デバイスの製造方法 |
| JP4167443B2 (ja) | 2002-01-30 | 2008-10-15 | 日本放送協会 | 固体撮像素子 |
| JP2004063751A (ja) | 2002-07-29 | 2004-02-26 | Fuji Photo Film Co Ltd | 固体撮像素子およびその製造方法 |
| GB0213722D0 (en) * | 2002-06-14 | 2002-07-24 | Suisse Electronique Microtech | Micro electrical mechanical systems |
| US7414661B2 (en) * | 2002-08-13 | 2008-08-19 | Micron Technology, Inc. | CMOS image sensor using gradient index chip scale lenses |
| JP4241457B2 (ja) * | 2003-06-26 | 2009-03-18 | 富士ゼロックス株式会社 | レンズ付き発光素子の製造方法 |
-
2004
- 2004-02-27 EP EP04405110A patent/EP1569276A1/en not_active Withdrawn
-
2005
- 2005-02-24 TW TW094105676A patent/TWI362058B/zh not_active IP Right Cessation
- 2005-02-25 DE DE602005026367T patent/DE602005026367D1/de not_active Expired - Lifetime
- 2005-02-25 WO PCT/CH2005/000109 patent/WO2005083789A2/en not_active Ceased
- 2005-02-25 KR KR1020067019870A patent/KR101194452B1/ko not_active Expired - Lifetime
- 2005-02-25 JP JP2007500029A patent/JP4903685B2/ja not_active Expired - Lifetime
- 2005-02-25 CN CN2005800133746A patent/CN1947254B/zh not_active Expired - Lifetime
- 2005-02-25 EP EP05706528A patent/EP1719178B1/en not_active Expired - Lifetime
- 2005-02-25 AT AT05706528T patent/ATE498910T1/de not_active IP Right Cessation
-
2006
- 2006-08-23 US US11/466,640 patent/US7457490B2/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007524243A5 (enExample) | ||
| JP4591378B2 (ja) | 半導体装置の製造方法 | |
| WO2008087763A1 (ja) | 半導体装置およびその製造方法 | |
| CN104245234B (zh) | 单片化装置用真空吸附片和固定夹具的制造方法 | |
| EP1507292A4 (en) | LAMINATED SUBSTRATE, METHOD FOR MANUFACTURING SUBSTRATE, AND PRINTING JIG FOR EXTERNAL PERIPHERY OF PLATELETS USED THEREIN | |
| WO2002084739A1 (fr) | Procede de fabrication d'un dispositif a film mince et dispositif a semi-conducteur | |
| JP2005332982A5 (enExample) | ||
| JP2005340423A5 (enExample) | ||
| SG135043A1 (en) | Wafer processing method | |
| JP2015005748A5 (enExample) | ||
| EP1788621A3 (en) | Method for manufacturing bonded substrate and bonded substrate manufactured by the method | |
| TW200633149A (en) | Semiconductor die package including universal footprint and method for manufacturing the same | |
| WO2009006284A3 (en) | Semiconductor die having a redistribution layer | |
| TW200507208A (en) | Laminated sheet | |
| TW200715396A (en) | Manufacturing method for a semiconductor device | |
| JP2002118081A5 (enExample) | ||
| WO2009032536A3 (en) | Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby | |
| TW200501216A (en) | Organic semiconductor device and method of manufacture of same | |
| TW200605227A (en) | Semiconductor device and manufacturing method thereof | |
| JP2001345294A5 (enExample) | ||
| WO2017045202A1 (en) | Method of manufacturing flexible display device | |
| JP2005513781A5 (enExample) | ||
| CN105097990B (zh) | 半导体结构的制造方法 | |
| JP2006012914A5 (enExample) | ||
| JP2005501420A5 (enExample) |