SG10201605834YA - Method for manufacturing passive optical components, and devices comprising the same - Google Patents

Method for manufacturing passive optical components, and devices comprising the same

Info

Publication number
SG10201605834YA
SG10201605834YA SG10201605834YA SG10201605834YA SG10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA
Authority
SG
Singapore
Prior art keywords
devices
same
optical components
passive optical
manufacturing passive
Prior art date
Application number
SG10201605834YA
Inventor
Hartmut Rudmann
Susanne Westenhoefer
Bojan Tesanovic
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG10201605834YA publication Critical patent/SG10201605834YA/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/0006Arrays
    • G02B3/0012Arrays characterised by the manufacturing method
    • G02B3/0031Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00278Lenticular sheets
    • B29D11/00307Producing lens wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00365Production of microlenses
    • B29D11/00375Production of microlenses by moulding lenses in holes through a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0074Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00932Combined cutting and grinding thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00Optical elements, e.g. lenses, prisms
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Light Receiving Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Device Packages (AREA)
SG10201605834YA 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same SG10201605834YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161509357P 2011-07-19 2011-07-19

Publications (1)

Publication Number Publication Date
SG10201605834YA true SG10201605834YA (en) 2016-09-29

Family

ID=46639253

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201605834YA SG10201605834YA (en) 2011-07-19 2012-07-10 Method for manufacturing passive optical components, and devices comprising the same

Country Status (8)

Country Link
US (4) US8767303B2 (en)
EP (1) EP2735029B1 (en)
JP (2) JP2014521992A (en)
KR (1) KR101966478B1 (en)
CN (1) CN103975436B (en)
SG (1) SG10201605834YA (en)
TW (3) TWI635601B (en)
WO (1) WO2013010285A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6162114B2 (en) * 2011-07-19 2017-07-12 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. Optoelectronic module, optoelectronic module manufacturing method, and apparatus and device including the optoelectronic module
JP6247633B2 (en) * 2011-08-10 2017-12-13 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. Optoelectronic module and manufacturing method thereof
TWI593091B (en) 2012-08-20 2017-07-21 海特根微光學公司 Fabrication of optics wafer
EP2827368B1 (en) * 2013-07-19 2019-06-05 ams AG Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
WO2015016772A1 (en) 2013-07-31 2015-02-05 Heptagon Micro Optics Pte. Ltd. Micro-optical orientation sensor and related methods
NL2011843C2 (en) 2013-11-26 2015-05-27 Anteryon Wafer Optics B V A method for manufacturing an optical assembly.
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
WO2016208403A1 (en) * 2015-06-23 2016-12-29 ソニー株式会社 Image sensor and electronic device
JP2017022200A (en) * 2015-07-08 2017-01-26 ソニーセミコンダクタソリューションズ株式会社 Image sensor, and electronic apparatus
CN108352396B (en) * 2015-10-07 2023-08-01 天津极豪科技有限公司 Image sensor structure for fingerprint sensing
KR101738883B1 (en) * 2016-01-06 2017-05-23 한국과학기술원 Ultrathin digital camera and manufacturing method of the same
JP6740628B2 (en) * 2016-02-12 2020-08-19 凸版印刷株式会社 Solid-state image sensor and manufacturing method thereof
WO2017155460A1 (en) * 2016-03-08 2017-09-14 Tnc Optics & Technologies Pte. Ltd. A fabrication method of optical sensor cover having a lens
WO2020176037A1 (en) * 2019-02-25 2020-09-03 Ams Sensors Singapore Pte. Ltd. Manufacture of optical diffusers elements and optical diffuser element
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3532038A (en) * 1967-06-05 1970-10-06 Ibm Multi-lens devices for the fabrication of semiconductor devices
JPS5590909A (en) * 1978-12-28 1980-07-10 Canon Inc Production of compound eye lens device
US4952026A (en) * 1988-10-14 1990-08-28 Corning Incorporated Integral optical element and method
CN1190467A (en) * 1994-12-23 1998-08-12 迪吉雷德公司 Semiconductor gamma-ray camera and medical imaging system
JP2003004909A (en) * 2001-04-20 2003-01-08 Matsushita Electric Ind Co Ltd Microlens array and method for manufacturing it
US6814901B2 (en) * 2001-04-20 2004-11-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing microlens array and microlens array
TW200506418A (en) * 2003-07-01 2005-02-16 Nippon Sheet Glass Co Ltd Lens plate, its manufacturing method, and image transmitting apparatus
JP2005072662A (en) * 2003-08-25 2005-03-17 Sharp Corp Light transmitting plate and manufacturing method thereof, image input apparatus using light transmitting plate
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US7399421B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Injection molded microoptics
JP2007148297A (en) 2005-11-30 2007-06-14 Hitachi Maxell Ltd Optical sheet for backlight, backlight and display device
KR100802199B1 (en) * 2006-05-25 2008-03-17 정경희 Optical module and fabrication method of the same
EP1870936A1 (en) * 2006-06-19 2007-12-26 STMicroelectronics (Rousset) SAS Method to produce lenses, particularly for integrated imager
US8013289B2 (en) * 2006-11-15 2011-09-06 Ether Precision, Inc. Lens array block for image capturing unit and methods of fabrication
US20080290435A1 (en) * 2007-05-21 2008-11-27 Micron Technology, Inc. Wafer level lens arrays for image sensor packages and the like, image sensor packages, and related methods
KR101575915B1 (en) * 2007-11-27 2015-12-08 헵타곤 마이크로 옵틱스 피티이. 리미티드 Encapsulated lens stack
TWI505703B (en) 2007-12-19 2015-10-21 Heptagon Micro Optics Pte Ltd Optical module, wafer scale package, and method for manufacturing those
TWI478808B (en) * 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd Manufacturing optical elements
US7920328B2 (en) * 2008-02-28 2011-04-05 Visera Technologies Company Limited Lens module and a method for fabricating the same
JP5030828B2 (en) * 2008-03-18 2012-09-19 株式会社沖データ Lens array and LED head, exposure apparatus, image forming apparatus and reading apparatus having the same
CN103323893B (en) * 2008-04-28 2015-07-29 柯尼卡美能达精密光学株式会社 The manufacture method of wafer lens polymerization body and wafer lens polymerization body
JP4906798B2 (en) * 2008-07-01 2012-03-28 株式会社沖データ Lens array, LED head, exposure apparatus, image forming apparatus, and reading apparatus
JP4966931B2 (en) * 2008-08-26 2012-07-04 シャープ株式会社 Electronic element wafer module and manufacturing method thereof, electronic element module and manufacturing method thereof, electronic information device
WO2010055801A1 (en) 2008-11-17 2010-05-20 コニカミノルタオプト株式会社 Optical element manufacturing method and optical element
JP2010204632A (en) 2009-02-06 2010-09-16 Fujifilm Corp Method of manufacturing wafer level lens array, wafer lens array, lens module and imaging unit
JP2010204635A (en) * 2009-02-06 2010-09-16 Fujifilm Corp Lens array
EP3081369B1 (en) * 2009-06-02 2021-05-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for manufacturing a lens
CN102023330A (en) * 2009-09-15 2011-04-20 鸿富锦精密工业(深圳)有限公司 Shading element array, method for manufacturing shading element array and lens module array
JP2011097294A (en) 2009-10-28 2011-05-12 Olympus Corp Imaging apparatus and method for manufacturing the same
CN102667568A (en) * 2009-11-05 2012-09-12 柯尼卡美能达先进多层薄膜株式会社 Image pickup device and method for manufacturing the image pickup device
JP2011104811A (en) 2009-11-13 2011-06-02 Fujifilm Corp Master die, method of preparing master and the master
SG181620A1 (en) * 2009-12-11 2012-07-30 Fujifilm Corp Black curable composition, light-shielding color filter, light-shielding film and method for manufacturing the same, wafer level lens, and solid-state imaging device
CN102130138B (en) * 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 Image sensor and forming method thereof
US7974023B1 (en) * 2010-03-11 2011-07-05 Himax Semiconductor, Inc. Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof
TWM399313U (en) * 2010-07-30 2011-03-01 Sigurd Microelectronics Corp Proximity sensor package structure
SG11201400917VA (en) * 2011-10-06 2014-07-30 Heptagon Micro Optics Pte Ltd Method for wafer-level manufacturing of objects and corresponding semi-finished products
JP2014190988A (en) * 2013-03-26 2014-10-06 Fuji Xerox Co Ltd Lens array and lens array manufacturing method

Also Published As

Publication number Publication date
KR101966478B1 (en) 2019-04-05
TWI635601B (en) 2018-09-11
TW201742238A (en) 2017-12-01
US20170235026A1 (en) 2017-08-17
EP2735029A1 (en) 2014-05-28
JP6763807B2 (en) 2020-09-30
US9193120B2 (en) 2015-11-24
US20140347747A1 (en) 2014-11-27
US10527762B2 (en) 2020-01-07
TWI647824B (en) 2019-01-11
CN103975436A (en) 2014-08-06
US20160031169A1 (en) 2016-02-04
US20130033767A1 (en) 2013-02-07
TWI647825B (en) 2019-01-11
TW201820597A (en) 2018-06-01
US8767303B2 (en) 2014-07-01
US9610743B2 (en) 2017-04-04
TW201310626A (en) 2013-03-01
CN103975436B (en) 2019-05-10
WO2013010285A1 (en) 2013-01-24
EP2735029B1 (en) 2022-12-21
JP2014521992A (en) 2014-08-28
JP2017167533A (en) 2017-09-21
KR20140054081A (en) 2014-05-08

Similar Documents

Publication Publication Date Title
SG10201605834YA (en) Method for manufacturing passive optical components, and devices comprising the same
SG10201606075XA (en) Opto-electronic module and method for manufacturing the same
TWI561871B (en) Optical bench on substrate and method for forming the same
EP2712491A4 (en) Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
TWI562424B (en) Light-emitting panel, light-emitting device, and method for manufacturing the light-emitting panel
EP2622737A4 (en) Systems and methods for manufacturing passive waveguide components
TWI562351B (en) Light-emitting module, light-emitting device, and method for manufacturing the light-emitting module
HK1156116A1 (en) Optical element and method for manufacturing the same
TWI561148B (en) Housing and method for manufacturing the same
EP2699959A4 (en) Optical member, display device including the same and manufacturing method thereof
TWI563539B (en) Composite substrate, manufacturing method thereof and light emitting device having the same
EP2786404A4 (en) Semiconductor device and method for manufacturing the same
SG11201504734VA (en) Semiconductor device and method for manufacturing the same
EP2940181A4 (en) Surface coated member, and manufacturing method for same
EP2732316A4 (en) Optical member, display device having the same and method for fabricating the same
EP2862212A4 (en) Layered structure for oled device, method for manufacturing the same, and oled device having the same
SG11201504825RA (en) Semiconductor device and method for manufacturing the same
EP2805803A4 (en) Method for producing optical element, and optical element
EP2668678A4 (en) Thermoelectric device and thermoelectric module having the same, and method of manufacturing the same
EP2540467A4 (en) Preform and method for manufacturing the same
EP2862711A4 (en) Multilayer structure, device using same, and manufacturing method therefor
EP2697675A4 (en) Interposer for optical module, optical module using the same, method for manufacturing the same
EP2682797A4 (en) Method for manufacturing lens module, and lens module
GB201315869D0 (en) Opto-electronic device module and method for manufacturing the same
PT2361752E (en) Fibre compound component and method for manufacturing the same