SG10201605834YA - Method for manufacturing passive optical components, and devices comprising the same - Google Patents
Method for manufacturing passive optical components, and devices comprising the sameInfo
- Publication number
- SG10201605834YA SG10201605834YA SG10201605834YA SG10201605834YA SG10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA SG 10201605834Y A SG10201605834Y A SG 10201605834YA
- Authority
- SG
- Singapore
- Prior art keywords
- devices
- same
- optical components
- passive optical
- manufacturing passive
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
- B29D11/00375—Production of microlenses by moulding lenses in holes through a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00932—Combined cutting and grinding thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161509357P | 2011-07-19 | 2011-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201605834YA true SG10201605834YA (en) | 2016-09-29 |
Family
ID=46639253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605834YA SG10201605834YA (en) | 2011-07-19 | 2012-07-10 | Method for manufacturing passive optical components, and devices comprising the same |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US8767303B2 (en) |
| EP (1) | EP2735029B1 (en) |
| JP (2) | JP2014521992A (en) |
| KR (1) | KR101966478B1 (en) |
| CN (1) | CN103975436B (en) |
| SG (1) | SG10201605834YA (en) |
| TW (3) | TWI647824B (en) |
| WO (1) | WO2013010285A1 (en) |
Families Citing this family (17)
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| EP2659510B1 (en) * | 2011-07-19 | 2019-01-09 | Heptagon Micro Optics Pte. Ltd. | Method for manufacturing opto-electronic modules |
| EP2742529B1 (en) * | 2011-08-10 | 2020-11-11 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module and method for manufacturing the same |
| EP2885817B1 (en) | 2012-08-20 | 2018-04-18 | Heptagon Micro Optics Pte. Ltd. | Fabrication of optics wafer |
| EP2827368B1 (en) * | 2013-07-19 | 2019-06-05 | ams AG | Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor |
| US11036309B2 (en) | 2013-07-31 | 2021-06-15 | Ams Sensors Singapore Pte. Ltd. | Micro-optical orientation sensor and related methods |
| NL2011843C2 (en) | 2013-11-26 | 2015-05-27 | Anteryon Wafer Optics B V | A method for manufacturing an optical assembly. |
| US9711552B2 (en) * | 2014-08-19 | 2017-07-18 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
| US9829614B2 (en) | 2015-02-02 | 2017-11-28 | Synaptics Incorporated | Optical sensor using collimator |
| US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
| CN107683526A (en) * | 2015-06-23 | 2018-02-09 | 索尼公司 | Imaging sensor and electronic installation |
| JP2017022200A (en) * | 2015-07-08 | 2017-01-26 | ソニーセミコンダクタソリューションズ株式会社 | Image sensor, and electronic apparatus |
| CN108352396B (en) * | 2015-10-07 | 2023-08-01 | 天津极豪科技有限公司 | Image sensor structure for fingerprint sensing |
| KR101738883B1 (en) * | 2016-01-06 | 2017-05-23 | 한국과학기술원 | Ultrathin digital camera and manufacturing method of the same |
| JP6740628B2 (en) * | 2016-02-12 | 2020-08-19 | 凸版印刷株式会社 | Solid-state image sensor and manufacturing method thereof |
| SG11201602031TA (en) * | 2016-03-08 | 2017-10-30 | Tnc Optics & Tech Pte Ltd | A fabrication method of optical sensor cover having a lens |
| DE112020000917T5 (en) * | 2019-02-25 | 2021-11-04 | Ams Sensors Singapore Pte. Ltd. | MANUFACTURE OF OPTICAL DIFFUSERS AND OPTICAL DIFFUSERS |
| US10734184B1 (en) | 2019-06-21 | 2020-08-04 | Elbit Systems Of America, Llc | Wafer scale image intensifier |
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| JPS5590909A (en) * | 1978-12-28 | 1980-07-10 | Canon Inc | Production of compound eye lens device |
| US4952026A (en) * | 1988-10-14 | 1990-08-28 | Corning Incorporated | Integral optical element and method |
| BR9510290A (en) * | 1994-12-23 | 1997-11-11 | Digirad | Semiconductor gamma ray camera and medical imaging system |
| JP2003004909A (en) * | 2001-04-20 | 2003-01-08 | Matsushita Electric Ind Co Ltd | Microlens array and method for manufacturing it |
| US6814901B2 (en) * | 2001-04-20 | 2004-11-09 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing microlens array and microlens array |
| TW200506418A (en) * | 2003-07-01 | 2005-02-16 | Nippon Sheet Glass Co Ltd | Lens plate, its manufacturing method, and image transmitting apparatus |
| JP2005072662A (en) * | 2003-08-25 | 2005-03-17 | Sharp Corp | Light transmitting plate and manufacturing method thereof, image input apparatus using light transmitting plate |
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| US7399421B2 (en) * | 2005-08-02 | 2008-07-15 | International Business Machines Corporation | Injection molded microoptics |
| JP2007148297A (en) | 2005-11-30 | 2007-06-14 | Hitachi Maxell Ltd | Optical sheet for backlight, backlight and display device |
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| EP1870936A1 (en) * | 2006-06-19 | 2007-12-26 | STMicroelectronics (Rousset) SAS | Method to produce lenses, particularly for integrated imager |
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-
2012
- 2012-07-10 EP EP12743875.2A patent/EP2735029B1/en active Active
- 2012-07-10 JP JP2014520486A patent/JP2014521992A/en active Pending
- 2012-07-10 SG SG10201605834YA patent/SG10201605834YA/en unknown
- 2012-07-10 WO PCT/CH2012/000160 patent/WO2013010285A1/en active Application Filing
- 2012-07-10 CN CN201280045590.9A patent/CN103975436B/en active Active
- 2012-07-10 KR KR1020147004151A patent/KR101966478B1/en active IP Right Grant
- 2012-07-17 TW TW106113502A patent/TWI647824B/en active
- 2012-07-17 TW TW106126425A patent/TWI647825B/en active
- 2012-07-17 TW TW101125645A patent/TWI635601B/en active
- 2012-07-19 US US13/553,385 patent/US8767303B2/en active Active
-
2014
- 2014-05-28 US US14/288,755 patent/US9193120B2/en active Active
-
2015
- 2015-10-14 US US14/882,905 patent/US9610743B2/en active Active
-
2017
- 2017-02-24 US US15/441,515 patent/US10527762B2/en active Active
- 2017-03-07 JP JP2017042941A patent/JP6763807B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103975436A (en) | 2014-08-06 |
| US10527762B2 (en) | 2020-01-07 |
| TWI647825B (en) | 2019-01-11 |
| JP2014521992A (en) | 2014-08-28 |
| TW201310626A (en) | 2013-03-01 |
| US20140347747A1 (en) | 2014-11-27 |
| KR20140054081A (en) | 2014-05-08 |
| US8767303B2 (en) | 2014-07-01 |
| TWI647824B (en) | 2019-01-11 |
| KR101966478B1 (en) | 2019-04-05 |
| US20170235026A1 (en) | 2017-08-17 |
| TW201820597A (en) | 2018-06-01 |
| JP6763807B2 (en) | 2020-09-30 |
| WO2013010285A1 (en) | 2013-01-24 |
| US20160031169A1 (en) | 2016-02-04 |
| US9193120B2 (en) | 2015-11-24 |
| TWI635601B (en) | 2018-09-11 |
| US20130033767A1 (en) | 2013-02-07 |
| TW201742238A (en) | 2017-12-01 |
| JP2017167533A (en) | 2017-09-21 |
| US9610743B2 (en) | 2017-04-04 |
| EP2735029A1 (en) | 2014-05-28 |
| CN103975436B (en) | 2019-05-10 |
| EP2735029B1 (en) | 2022-12-21 |
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