SG11201400917VA - Method for wafer-level manufacturing of objects and corresponding semi-finished products - Google Patents

Method for wafer-level manufacturing of objects and corresponding semi-finished products

Info

Publication number
SG11201400917VA
SG11201400917VA SG11201400917VA SG11201400917VA SG11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA
Authority
SG
Singapore
Prior art keywords
wafer
objects
finished products
corresponding semi
level manufacturing
Prior art date
Application number
SG11201400917VA
Inventor
Peter Riel
Hartmut Rudmann
Markus Rossi
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201400917VA publication Critical patent/SG11201400917VA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04Networks or arrays of similar microstructural devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00009Production of simple or compound lenses
    • B29D11/00278Lenticular sheets
    • B29D11/00307Producing lens wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/00663Production of light guides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865Multistep processes for the separation of wafers into individual elements
    • B81C1/00904Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14618Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14696The active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/18Longitudinally sectional layer of three or more sections

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201400917VA 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products SG11201400917VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161544005P 2011-10-06 2011-10-06
PCT/CH2012/000230 WO2013049948A1 (en) 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products

Publications (1)

Publication Number Publication Date
SG11201400917VA true SG11201400917VA (en) 2014-07-30

Family

ID=47002453

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10201602612PA SG10201602612PA (en) 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products
SG11201400917VA SG11201400917VA (en) 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products
SG10201913007VA SG10201913007VA (en) 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201602612PA SG10201602612PA (en) 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201913007VA SG10201913007VA (en) 2011-10-06 2012-10-01 Method for wafer-level manufacturing of objects and corresponding semi-finished products

Country Status (5)

Country Link
US (1) US10343899B2 (en)
CN (1) CN103959465B (en)
SG (3) SG10201602612PA (en)
TW (1) TWI557791B (en)
WO (1) WO2013049948A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103975436B (en) * 2011-07-19 2019-05-10 新加坡恒立私人有限公司 The method for manufacturing passive optical device and the device comprising the passive optical device
SG10201602612PA (en) * 2011-10-06 2016-05-30 Heptagon Micro Optics Pte Ltd Method for wafer-level manufacturing of objects and corresponding semi-finished products
NL2013094B1 (en) 2014-06-30 2016-07-11 Anteryon Wafer Optics B V Method for manufacturing optical modules.
NL2013524B1 (en) * 2014-09-25 2016-09-07 Anteryon Wafer Optics B V An optical light guide element and a method for manufacturing.
KR102603829B1 (en) * 2014-11-13 2023-11-17 에이엠에스-오스람 아시아 퍼시픽 피티이. 리미티드 Manufacture of optical light guides
US10007052B2 (en) 2015-02-04 2018-06-26 Heptagon Micro Optics Pte. Ltd. Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures
WO2017039535A1 (en) * 2015-08-28 2017-03-09 Heptagon Micro Optics Pte. Ltd. Wafer-level optical device having light guide properties
CN108780141B (en) * 2016-02-22 2023-04-18 新加坡恒立私人有限公司 Thin photovoltaic modules with holes and their manufacture
US11009660B2 (en) 2017-02-10 2021-05-18 Heptagon Micro Optics Pte. Ltd. Light guides and manufacture of light guides
WO2020060485A2 (en) * 2018-09-17 2020-03-26 Ams Sensors Singapore Pte. Ltd. Optical light guides and methods of manufacturing the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
EP1569276A1 (en) * 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
US7202141B2 (en) * 2004-03-29 2007-04-10 J.P. Sercel Associates, Inc. Method of separating layers of material
FR2880194B1 (en) * 2004-12-24 2007-06-01 Atmel Grenoble Soc Par Actions IMAGE SENSOR WITH GLOBALLY SEPARATE COLORED ZONES
KR20060087273A (en) * 2005-01-28 2006-08-02 삼성전기주식회사 Semiconductor package and method of fabricating the same
JP2006216788A (en) * 2005-02-03 2006-08-17 Hitachi Cable Ltd Single crystalline wafer for semiconductor laser
JP2008227233A (en) * 2007-03-14 2008-09-25 Matsushita Electric Ind Co Ltd Semiconductor device and manufacturing method thereof, and optical pickup module
CN101419952B (en) * 2008-12-03 2010-09-15 晶方半导体科技(苏州)有限公司 Wafer stage chip encapsulation method and encapsulation construction
JP5395446B2 (en) * 2009-01-22 2014-01-22 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method of semiconductor device
KR20140051108A (en) * 2010-11-30 2014-04-30 헵타곤 마이크로 옵틱스 피티이. 리미티드 Optical light guide element for an electronic device
SG11201400761UA (en) * 2011-10-05 2014-08-28 Heptagon Micro Optics Pte Ltd Micro-optical system and method of manufacture thereof
SG10201602612PA (en) * 2011-10-06 2016-05-30 Heptagon Micro Optics Pte Ltd Method for wafer-level manufacturing of objects and corresponding semi-finished products
NL2013094B1 (en) * 2014-06-30 2016-07-11 Anteryon Wafer Optics B V Method for manufacturing optical modules.

Also Published As

Publication number Publication date
CN103959465B (en) 2019-06-07
TWI557791B (en) 2016-11-11
SG10201602612PA (en) 2016-05-30
WO2013049948A1 (en) 2013-04-11
US20140295122A1 (en) 2014-10-02
CN103959465A (en) 2014-07-30
SG10201913007VA (en) 2020-02-27
TW201334050A (en) 2013-08-16
US10343899B2 (en) 2019-07-09

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