SG11201400917VA - Method for wafer-level manufacturing of objects and corresponding semi-finished products - Google Patents
Method for wafer-level manufacturing of objects and corresponding semi-finished productsInfo
- Publication number
- SG11201400917VA SG11201400917VA SG11201400917VA SG11201400917VA SG11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA SG 11201400917V A SG11201400917V A SG 11201400917VA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- objects
- finished products
- corresponding semi
- level manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000011265 semifinished product Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/04—Networks or arrays of similar microstructural devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00663—Production of light guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00904—Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14696—The active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/18—Longitudinally sectional layer of three or more sections
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161544005P | 2011-10-06 | 2011-10-06 | |
PCT/CH2012/000230 WO2013049948A1 (en) | 2011-10-06 | 2012-10-01 | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201400917VA true SG11201400917VA (en) | 2014-07-30 |
Family
ID=47002453
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201602612PA SG10201602612PA (en) | 2011-10-06 | 2012-10-01 | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
SG11201400917VA SG11201400917VA (en) | 2011-10-06 | 2012-10-01 | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
SG10201913007VA SG10201913007VA (en) | 2011-10-06 | 2012-10-01 | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201602612PA SG10201602612PA (en) | 2011-10-06 | 2012-10-01 | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201913007VA SG10201913007VA (en) | 2011-10-06 | 2012-10-01 | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
Country Status (5)
Country | Link |
---|---|
US (1) | US10343899B2 (en) |
CN (1) | CN103959465B (en) |
SG (3) | SG10201602612PA (en) |
TW (1) | TWI557791B (en) |
WO (1) | WO2013049948A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103975436B (en) * | 2011-07-19 | 2019-05-10 | 新加坡恒立私人有限公司 | The method for manufacturing passive optical device and the device comprising the passive optical device |
SG10201602612PA (en) * | 2011-10-06 | 2016-05-30 | Heptagon Micro Optics Pte Ltd | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
NL2013094B1 (en) | 2014-06-30 | 2016-07-11 | Anteryon Wafer Optics B V | Method for manufacturing optical modules. |
NL2013524B1 (en) * | 2014-09-25 | 2016-09-07 | Anteryon Wafer Optics B V | An optical light guide element and a method for manufacturing. |
KR102603829B1 (en) * | 2014-11-13 | 2023-11-17 | 에이엠에스-오스람 아시아 퍼시픽 피티이. 리미티드 | Manufacture of optical light guides |
US10007052B2 (en) | 2015-02-04 | 2018-06-26 | Heptagon Micro Optics Pte. Ltd. | Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures |
WO2017039535A1 (en) * | 2015-08-28 | 2017-03-09 | Heptagon Micro Optics Pte. Ltd. | Wafer-level optical device having light guide properties |
CN108780141B (en) * | 2016-02-22 | 2023-04-18 | 新加坡恒立私人有限公司 | Thin photovoltaic modules with holes and their manufacture |
US11009660B2 (en) | 2017-02-10 | 2021-05-18 | Heptagon Micro Optics Pte. Ltd. | Light guides and manufacture of light guides |
WO2020060485A2 (en) * | 2018-09-17 | 2020-03-26 | Ams Sensors Singapore Pte. Ltd. | Optical light guides and methods of manufacturing the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6635941B2 (en) * | 2001-03-21 | 2003-10-21 | Canon Kabushiki Kaisha | Structure of semiconductor device with improved reliability |
EP1569276A1 (en) * | 2004-02-27 | 2005-08-31 | Heptagon OY | Micro-optics on optoelectronics |
US7202141B2 (en) * | 2004-03-29 | 2007-04-10 | J.P. Sercel Associates, Inc. | Method of separating layers of material |
FR2880194B1 (en) * | 2004-12-24 | 2007-06-01 | Atmel Grenoble Soc Par Actions | IMAGE SENSOR WITH GLOBALLY SEPARATE COLORED ZONES |
KR20060087273A (en) * | 2005-01-28 | 2006-08-02 | 삼성전기주식회사 | Semiconductor package and method of fabricating the same |
JP2006216788A (en) * | 2005-02-03 | 2006-08-17 | Hitachi Cable Ltd | Single crystalline wafer for semiconductor laser |
JP2008227233A (en) * | 2007-03-14 | 2008-09-25 | Matsushita Electric Ind Co Ltd | Semiconductor device and manufacturing method thereof, and optical pickup module |
CN101419952B (en) * | 2008-12-03 | 2010-09-15 | 晶方半导体科技(苏州)有限公司 | Wafer stage chip encapsulation method and encapsulation construction |
JP5395446B2 (en) * | 2009-01-22 | 2014-01-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method of semiconductor device |
KR20140051108A (en) * | 2010-11-30 | 2014-04-30 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | Optical light guide element for an electronic device |
SG11201400761UA (en) * | 2011-10-05 | 2014-08-28 | Heptagon Micro Optics Pte Ltd | Micro-optical system and method of manufacture thereof |
SG10201602612PA (en) * | 2011-10-06 | 2016-05-30 | Heptagon Micro Optics Pte Ltd | Method for wafer-level manufacturing of objects and corresponding semi-finished products |
NL2013094B1 (en) * | 2014-06-30 | 2016-07-11 | Anteryon Wafer Optics B V | Method for manufacturing optical modules. |
-
2012
- 2012-10-01 SG SG10201602612PA patent/SG10201602612PA/en unknown
- 2012-10-01 US US14/346,804 patent/US10343899B2/en active Active
- 2012-10-01 SG SG11201400917VA patent/SG11201400917VA/en unknown
- 2012-10-01 CN CN201280049008.6A patent/CN103959465B/en active Active
- 2012-10-01 WO PCT/CH2012/000230 patent/WO2013049948A1/en active Application Filing
- 2012-10-01 SG SG10201913007VA patent/SG10201913007VA/en unknown
- 2012-10-05 TW TW101136874A patent/TWI557791B/en active
Also Published As
Publication number | Publication date |
---|---|
CN103959465B (en) | 2019-06-07 |
TWI557791B (en) | 2016-11-11 |
SG10201602612PA (en) | 2016-05-30 |
WO2013049948A1 (en) | 2013-04-11 |
US20140295122A1 (en) | 2014-10-02 |
CN103959465A (en) | 2014-07-30 |
SG10201913007VA (en) | 2020-02-27 |
TW201334050A (en) | 2013-08-16 |
US10343899B2 (en) | 2019-07-09 |
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