JP2005501420A5 - - Google Patents
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- Publication number
- JP2005501420A5 JP2005501420A5 JP2003523013A JP2003523013A JP2005501420A5 JP 2005501420 A5 JP2005501420 A5 JP 2005501420A5 JP 2003523013 A JP2003523013 A JP 2003523013A JP 2003523013 A JP2003523013 A JP 2003523013A JP 2005501420 A5 JP2005501420 A5 JP 2005501420A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- color filter
- layer
- semiconductor wafer
- temporary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 239000002178 crystalline material Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0111335A FR2829290B1 (fr) | 2001-08-31 | 2001-08-31 | Capteur d'image couleur sur substrat transparent et procede de fabrication |
| PCT/FR2002/002977 WO2003019667A1 (fr) | 2001-08-31 | 2002-08-30 | Capteur d'image couleur sur substrat transparent et procede de fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005501420A JP2005501420A (ja) | 2005-01-13 |
| JP2005501420A5 true JP2005501420A5 (enExample) | 2007-12-06 |
| JP4147187B2 JP4147187B2 (ja) | 2008-09-10 |
Family
ID=8866878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003523013A Expired - Fee Related JP4147187B2 (ja) | 2001-08-31 | 2002-08-30 | 透過性基板上のカラー画像センサの製造方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6933585B2 (enExample) |
| EP (1) | EP1421622B1 (enExample) |
| JP (1) | JP4147187B2 (enExample) |
| KR (1) | KR100919964B1 (enExample) |
| CN (1) | CN100487899C (enExample) |
| CA (1) | CA2457899C (enExample) |
| DE (1) | DE60223263T2 (enExample) |
| FR (1) | FR2829290B1 (enExample) |
| IL (2) | IL160113A0 (enExample) |
| WO (1) | WO2003019667A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2863773B1 (fr) * | 2003-12-12 | 2006-05-19 | Atmel Grenoble Sa | Procede de fabrication de puces electroniques en silicium aminci |
| JP4486043B2 (ja) * | 2004-12-30 | 2010-06-23 | 東部エレクトロニクス株式会社 | Ｃｍｏｓイメージセンサー及びその製造方法 |
| KR100741920B1 (ko) * | 2004-12-30 | 2007-07-24 | 동부일렉트로닉스 주식회사 | 씨모스(ｃｍｏｓ) 이미지 센서의 제조 방법 |
| US8409970B2 (en) * | 2005-10-29 | 2013-04-02 | Stats Chippac, Ltd. | Semiconductor device and method of making integrated passive devices |
| US8158510B2 (en) | 2009-11-19 | 2012-04-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming IPD on molded substrate |
| US8791006B2 (en) | 2005-10-29 | 2014-07-29 | Stats Chippac, Ltd. | Semiconductor device and method of forming an inductor on polymer matrix composite substrate |
| DE102006014247B4 (de) * | 2006-03-28 | 2019-10-24 | Robert Bosch Gmbh | Bildaufnahmesystem und Verfahren zu dessen Herstellung |
| US20090174018A1 (en) * | 2008-01-09 | 2009-07-09 | Micron Technology, Inc. | Construction methods for backside illuminated image sensors |
| JP5347520B2 (ja) | 2009-01-20 | 2013-11-20 | ソニー株式会社 | 固体撮像装置の製造方法 |
| US8310021B2 (en) * | 2010-07-13 | 2012-11-13 | Honeywell International Inc. | Neutron detector with wafer-to-wafer bonding |
| KR20180114927A (ko) * | 2016-02-16 | 2018-10-19 | 쥐-레이 스위츨란드 에스에이 | 접합된 경계면들에 걸친 전하 운반을 위한 구조물, 시스템 및 방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4758734A (en) * | 1984-03-13 | 1988-07-19 | Nec Corporation | High resolution image sensor array using amorphous photo-diodes |
| US4976802A (en) * | 1989-10-16 | 1990-12-11 | Xerox Corporation | Process for assembling smaller scanning or printing arrays together to form a longer array |
| JPH05183141A (ja) * | 1991-07-12 | 1993-07-23 | Fuji Xerox Co Ltd | カラーイメージセンサ |
| US5244817A (en) * | 1992-08-03 | 1993-09-14 | Eastman Kodak Company | Method of making backside illuminated image sensors |
| US6059188A (en) * | 1993-10-25 | 2000-05-09 | Symbol Technologies | Packaged mirror including mirror travel stops |
| JPH0945886A (ja) * | 1995-08-01 | 1997-02-14 | Sharp Corp | 増幅型半導体撮像装置 |
| US6204087B1 (en) * | 1997-02-07 | 2001-03-20 | University Of Hawai'i | Fabrication of three-dimensional architecture for solid state radiation detectors |
-
2001
- 2001-08-31 FR FR0111335A patent/FR2829290B1/fr not_active Expired - Fee Related
-
2002
- 2002-08-30 EP EP02796331A patent/EP1421622B1/fr not_active Expired - Lifetime
- 2002-08-30 KR KR1020047001560A patent/KR100919964B1/ko not_active Expired - Fee Related
- 2002-08-30 WO PCT/FR2002/002977 patent/WO2003019667A1/fr not_active Ceased
- 2002-08-30 DE DE60223263T patent/DE60223263T2/de not_active Expired - Lifetime
- 2002-08-30 CN CNB028170423A patent/CN100487899C/zh not_active Expired - Fee Related
- 2002-08-30 CA CA2457899A patent/CA2457899C/fr not_active Expired - Fee Related
- 2002-08-30 IL IL16011302A patent/IL160113A0/xx unknown
- 2002-08-30 JP JP2003523013A patent/JP4147187B2/ja not_active Expired - Fee Related
- 2002-08-30 US US10/485,694 patent/US6933585B2/en not_active Expired - Fee Related
-
2004
- 2004-01-29 IL IL160113A patent/IL160113A/en not_active IP Right Cessation
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