SG135043A1 - Wafer processing method - Google Patents

Wafer processing method

Info

Publication number
SG135043A1
SG135043A1 SG200407215-3A SG2004072153A SG135043A1 SG 135043 A1 SG135043 A1 SG 135043A1 SG 2004072153 A SG2004072153 A SG 2004072153A SG 135043 A1 SG135043 A1 SG 135043A1
Authority
SG
Singapore
Prior art keywords
laser beam
processing method
wafer processing
wafer
resin film
Prior art date
Application number
SG200407215-3A
Inventor
Satoshi Genda
Toshiyuki Yoshikawa
Ryugo Oba
Kenji Furuta
Nobuyasu Kitahara
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG135043A1 publication Critical patent/SG135043A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Abstract

A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.
SG200407215-3A 2003-11-18 2004-11-16 Wafer processing method SG135043A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003388104A JP4471632B2 (en) 2003-11-18 2003-11-18 Wafer processing method

Publications (1)

Publication Number Publication Date
SG135043A1 true SG135043A1 (en) 2007-09-28

Family

ID=34567465

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407215-3A SG135043A1 (en) 2003-11-18 2004-11-16 Wafer processing method

Country Status (5)

Country Link
US (1) US7179723B2 (en)
JP (1) JP4471632B2 (en)
CN (1) CN100431107C (en)
DE (1) DE102004055443B4 (en)
SG (1) SG135043A1 (en)

Families Citing this family (179)

* Cited by examiner, † Cited by third party
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