JP2007520064A5 - - Google Patents

Download PDF

Info

Publication number
JP2007520064A5
JP2007520064A5 JP2006549513A JP2006549513A JP2007520064A5 JP 2007520064 A5 JP2007520064 A5 JP 2007520064A5 JP 2006549513 A JP2006549513 A JP 2006549513A JP 2006549513 A JP2006549513 A JP 2006549513A JP 2007520064 A5 JP2007520064 A5 JP 2007520064A5
Authority
JP
Japan
Prior art keywords
group
substrate
polymer
protective layer
independently selected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006549513A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007520064A (ja
JP5165247B2 (ja
Filing date
Publication date
Priority claimed from US10/759,448 external-priority patent/US7316844B2/en
Application filed filed Critical
Publication of JP2007520064A publication Critical patent/JP2007520064A/ja
Publication of JP2007520064A5 publication Critical patent/JP2007520064A5/ja
Application granted granted Critical
Publication of JP5165247B2 publication Critical patent/JP5165247B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006549513A 2004-01-16 2005-01-07 マイクロエレクトロニクスデバイスのパターンを腐食から保護する構造およびそれを形成する方法 Expired - Fee Related JP5165247B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/759,448 2004-01-16
US10/759,448 US7316844B2 (en) 2004-01-16 2004-01-16 Spin-on protective coatings for wet-etch processing of microelectronic substrates
PCT/US2005/000786 WO2005072489A2 (en) 2004-01-16 2005-01-07 Spin-on protective coatings for wet-etch processing of microelectronic substrates

Publications (3)

Publication Number Publication Date
JP2007520064A JP2007520064A (ja) 2007-07-19
JP2007520064A5 true JP2007520064A5 (enExample) 2012-02-09
JP5165247B2 JP5165247B2 (ja) 2013-03-21

Family

ID=34749694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006549513A Expired - Fee Related JP5165247B2 (ja) 2004-01-16 2005-01-07 マイクロエレクトロニクスデバイスのパターンを腐食から保護する構造およびそれを形成する方法

Country Status (9)

Country Link
US (3) US7316844B2 (enExample)
EP (1) EP1715961B1 (enExample)
JP (1) JP5165247B2 (enExample)
KR (1) KR101189394B1 (enExample)
CN (1) CN100566852C (enExample)
AT (1) ATE523263T1 (enExample)
SG (1) SG152244A1 (enExample)
TW (1) TWI405263B (enExample)
WO (1) WO2005072489A2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7316844B2 (en) 2004-01-16 2008-01-08 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
US7695890B2 (en) 2005-09-09 2010-04-13 Brewer Science Inc. Negative photoresist for silicon KOH etch without silicon nitride
US7709178B2 (en) * 2007-04-17 2010-05-04 Brewer Science Inc. Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride
US8192642B2 (en) * 2007-09-13 2012-06-05 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
TW200934865A (en) * 2007-11-30 2009-08-16 Advanced Tech Materials Formulations for cleaning memory device structures
US8092628B2 (en) * 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
US8771927B2 (en) 2009-04-15 2014-07-08 Brewer Science Inc. Acid-etch resistant, protective coatings
EP2289843A1 (en) 2009-08-31 2011-03-02 University College Cork-National University of Ireland, Cork A microneedle device and method for the fabrication thereof
JP5800370B2 (ja) * 2009-09-16 2015-10-28 ブルーワー サイエンス アイ エヌシー． 背面処理中に前面側電気回路を保護するための耐傷性コーティング
KR101125427B1 (ko) * 2010-04-02 2012-03-26 에스케이텔레시스 주식회사 이동통신 단말기의 헤어라인 형성 방법 및 헤어라인이 형성된 이동통신 단말기
DE102010044133B4 (de) 2010-11-18 2016-03-03 Schott Ag Ätzverfahren zur Oberflächenstrukturierung und Ätzmaske
US8802482B2 (en) 2011-11-04 2014-08-12 International Business Machines Corporation Method to fabricate multicrystal solar cell with light trapping surface using nanopore copolymer
TWI502031B (zh) 2012-03-01 2015-10-01 Eternal Materials Co Ltd 抗蝕刻組成物及其應用
US9531820B2 (en) * 2012-07-02 2016-12-27 Kt Corporation Contents providing scheme using identification code
US9557841B2 (en) 2015-01-22 2017-01-31 Eastman Kodak Company Devices with protected electrically-conductive metal grids
US9650716B2 (en) 2015-01-22 2017-05-16 Eastman Kodak Company Patterning continuous webs with protected electrically-conductive grids
US9516760B2 (en) * 2015-01-22 2016-12-06 Eastman Kodak Company Methods for providing electrically-conductive articles
US9545025B2 (en) 2015-01-22 2017-01-10 Eastman Kodak Company Electrically-conductive articles with protective polymeric coatings
US10410883B2 (en) * 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN109096430A (zh) * 2018-07-25 2018-12-28 嘉兴华雯化工有限公司 一种新型的反应性四元共聚物及其制备方法
EP4041845A4 (en) * 2019-10-09 2023-11-22 Entegris, Inc. WET ETCH COMPOSITION AND METHOD
WO2023028019A1 (en) 2021-08-25 2023-03-02 Corning Incorporated Textured glass-based articles
WO2023027932A1 (en) * 2021-08-25 2023-03-02 Corning Incorporated Textured glass-based articles
WO2023055653A1 (en) * 2021-09-30 2023-04-06 Entegris, Inc. Articles having removable coatings and related methods
KR102361960B1 (ko) * 2021-10-28 2022-02-14 제일씨앤피주식회사 인쇄판의 제조방법 및 이에 의해 제조된 인쇄판

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3398044A (en) * 1965-02-01 1968-08-20 Dow Corning Bonding of organic resins or rubbers to inorganic substances
NL130670C (enExample) * 1965-02-15
US3461027A (en) * 1966-02-01 1969-08-12 Dow Corning Bonding of thermoplastic polymer resins to silane-primed siliceous or metallic materials
US3585103A (en) * 1968-09-23 1971-06-15 Hercules Inc Priming composition comprising a coupling agent and a polyfunctional azide for bonding polymers to glass,metal and metal oxide substrates
US3826709A (en) * 1969-09-02 1974-07-30 Bethlehem Steel Corp Process for laminating phosphate coated steel with abs resin
US3843557A (en) * 1971-10-05 1974-10-22 Mennen Co Inc Microcapsules and method of making same
US3766189A (en) * 1972-10-05 1973-10-16 Sinclair Koppers Co Fire retardant latex containing chlorinated paraffin wax
JPS544070A (en) * 1977-06-13 1979-01-12 Hitachi Ltd Manufacture for semiconductor device
JPS5434769A (en) * 1977-08-24 1979-03-14 Fuji Electric Co Ltd Photoetching method for silicon semiconductor wafer
US4882245A (en) 1985-10-28 1989-11-21 International Business Machines Corporation Photoresist composition and printed circuit boards and packages made therewith
US4800125A (en) * 1986-10-07 1989-01-24 Dow Corning Corporation Coupling agent compositions
US4826564A (en) 1987-10-30 1989-05-02 International Business Machines Corporation Method of selective reactive ion etching of substrates
US4853095A (en) * 1988-03-09 1989-08-01 Macdermid, Incorporated Conversion of manganese dioxide to permanganate
GB8924142D0 (en) * 1989-10-26 1989-12-13 Ciba Geigy Methods for making metallic patterns
US5077174A (en) 1990-04-10 1991-12-31 E. I. Du Pont De Nemours And Company Positive working dry film element having a layer of resist composition
TW230830B (enExample) 1991-11-01 1994-09-21 Furukawa Electric Co Ltd
DE69232419T2 (de) * 1991-12-10 2002-09-19 The Dow Chemical Co., Midland Strahlungshärtbare cyclobutaren zusammensetzungen
US5217568A (en) * 1992-02-03 1993-06-08 Motorola, Inc. Silicon etching process using polymeric mask, for example, to form V-groove for an optical fiber coupling
JPH0621499A (ja) * 1992-06-29 1994-01-28 Canon Inc 封止用樹脂組成物及びそれを用いた太陽電池
US5353705A (en) * 1992-07-20 1994-10-11 Presstek, Inc. Lithographic printing members having secondary ablation layers for use with laser-discharge imaging apparatus
JP3417008B2 (ja) * 1993-11-04 2003-06-16 株式会社デンソー 半導体ウエハのエッチング方法
US5591354A (en) * 1994-10-21 1997-01-07 Jp Laboratories, Inc. Etching plastics with nitrosyls
US5753523A (en) 1994-11-21 1998-05-19 Brewer Science, Inc. Method for making airbridge from ion-implanted conductive polymers
US5922410A (en) 1995-01-18 1999-07-13 Rohm And Haas Company Wood coating composition
JP3272188B2 (ja) * 1995-05-17 2002-04-08 三洋電機株式会社 薄膜半導体装置の製造方法
US6162860A (en) 1997-11-12 2000-12-19 S. C. Johnson Commercial Markets, Inc. Solvent based interactive polymeric compositions containing a substantially non-gelled composition
TWI250379B (en) 1998-08-07 2006-03-01 Az Electronic Materials Japan Chemical amplified radiation-sensitive composition which contains onium salt and generator
TW457703B (en) * 1998-08-31 2001-10-01 Siemens Ag Micro-electronic structure, method for its production and its application in a memory-cell
US7375350B2 (en) 1999-11-24 2008-05-20 Neushul Stephen Computed radiography x-ray cassette with rigid embedded CR plate
JP2003531924A (ja) * 2000-02-28 2003-10-28 アドシル・エルシー シランが基になったコーティング組成物、これから得た被覆製品およびこれの使用方法
US6645695B2 (en) 2000-09-11 2003-11-11 Shipley Company, L.L.C. Photoresist composition
US6756459B2 (en) 2000-09-28 2004-06-29 Rohm And Haas Company Binder compositions for direct-to-metal coatings
US6929705B2 (en) * 2001-04-30 2005-08-16 Ak Steel Corporation Antimicrobial coated metal sheet
US6956268B2 (en) 2001-05-18 2005-10-18 Reveo, Inc. MEMS and method of manufacturing MEMS
KR100863984B1 (ko) 2001-07-03 2008-10-16 후지필름 가부시키가이샤 포지티브 레지스트 조성물
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US7723162B2 (en) * 2002-03-22 2010-05-25 White Electronic Designs Corporation Method for producing shock and tamper resistant microelectronic devices
US20040157426A1 (en) 2003-02-07 2004-08-12 Luc Ouellet Fabrication of advanced silicon-based MEMS devices
JP4207604B2 (ja) 2003-03-03 2009-01-14 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの形成方法
JP3960281B2 (ja) 2003-05-28 2007-08-15 Ｊｓｒ株式会社 硬化性樹脂組成物、保護膜および保護膜の形成方法
EP1507171A3 (en) 2003-08-15 2008-03-05 FUJIFILM Corporation Light-Sensitive sheet comprising support, first and second light-sensitive layers and barrier layer
US6920253B2 (en) * 2003-10-02 2005-07-19 Agilent Technologies, Inc Optical modulator based on a microdisk resonator
JP4131864B2 (ja) 2003-11-25 2008-08-13 東京応化工業株式会社 化学増幅型ポジ型感光性熱硬化性樹脂組成物、硬化物の形成方法、及び機能素子の製造方法
US7316844B2 (en) 2004-01-16 2008-01-08 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
EP1617178B1 (en) 2004-07-12 2017-04-12 STMicroelectronics Srl Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof
ATE470887T1 (de) 2004-10-29 2010-06-15 Jsr Corp Positiv lichtempfindliche isolierende harzzusammensetzung und ausgehärtetes produkt davon
KR100692593B1 (ko) 2005-01-24 2007-03-13 삼성전자주식회사 Ｍｅｍｓ 구조체, 외팔보 형태의 ｍｅｍｓ 구조체 및밀봉된 유체채널의 제조 방법.
US7695890B2 (en) 2005-09-09 2010-04-13 Brewer Science Inc. Negative photoresist for silicon KOH etch without silicon nitride

Similar Documents

Publication Publication Date Title
JP2007520064A5 (enExample)
KR101573946B1 (ko) 초소형 전자 기판의 습식-식각 공정을 위한 스핀-온 보호 코팅
EP2159249B1 (en) Hydrosilylated polymer, heat-resistant resin composition, and heat-resistant film
KR102059319B1 (ko) 가스 배리어 필름 적층체, 점착 필름, 및 전자 부재
KR101475307B1 (ko) 절연막
JP5165247B2 (ja) マイクロエレクトロニクスデバイスのパターンを腐食から保護する構造およびそれを形成する方法
JP5937312B2 (ja) ガスバリアフィルム積層体および電子部材
JP2008074963A (ja) 組成物、膜、およびその製造方法
KR102418884B1 (ko) 다공질체 및 다공질체의 제조 방법
CN106132700B (zh) 防污片及其制造方法
JPWO2017159564A1 (ja) 高耐久防曇塗膜およびコーティング組成物
EP2797699A1 (en) Thin film diffusion barrier
JPH11322992A (ja) 多孔質膜
JP2010518247A5 (enExample)
EP1442071B1 (en) Etch-stop resins
JPWO2018143356A1 (ja) 撥水処理剤、撥水構造体及びその製造方法
JP2008527082A5 (enExample)
TW201842094A (zh) 親水性組合物及親水性構造體
JPWO2020012660A1 (ja) 圧電材料および圧電材料用組成物
JP2002317049A (ja) ホウ素含有ポリマー組成物
JP2008266433A (ja) ポリシラン及びその製造方法
JPH07316297A (ja) 高分子量ポリオルガノシリルシリケート及びその製造方法
JP2007284652A (ja) 組成物、膜、およびその製造方法
JP4310208B2 (ja) 無基板液晶ディスプレイ用剥離剤
JPH07242747A (ja) 有機珪素重合体及び半導体装置