JP2007514121A - 高密度熱負荷のための冷却システム - Google Patents
高密度熱負荷のための冷却システム Download PDFInfo
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- JP2007514121A JP2007514121A JP2006542755A JP2006542755A JP2007514121A JP 2007514121 A JP2007514121 A JP 2007514121A JP 2006542755 A JP2006542755 A JP 2006542755A JP 2006542755 A JP2006542755 A JP 2006542755A JP 2007514121 A JP2007514121 A JP 2007514121A
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- Prior art keywords
- heat exchanger
- fluid
- heat
- cooling
- cooling system
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- 238000001816 cooling Methods 0.000 title claims abstract description 89
- 239000012530 fluid Substances 0.000 claims abstract description 125
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000004891 communication Methods 0.000 claims description 27
- 238000005057 refrigeration Methods 0.000 claims description 19
- 238000005086 pumping Methods 0.000 claims description 6
- 230000006835 compression Effects 0.000 abstract description 13
- 238000007906 compression Methods 0.000 abstract description 13
- 230000001105 regulatory effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000003507 refrigerant Substances 0.000 description 5
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 description 4
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
- F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/04—Preventing the formation of frost or condensate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B7/00—Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
Description
Claims (9)
- 熱負荷から熱交換システムに伝熱するための冷却システムであって、
揮発性作動流体と、
ポンプと、
ポンプと流体連通し熱負荷と熱連通している第1の熱交換器と、
第1の熱交換器およびポンプと流体連通している第1の流路、並びに熱交換システムに連結された第2の流路を有する第2の熱交換器とを備え、第1および第2の流路が互いに熱連通している冷却システム。 - 第1の熱交換器が空気/流体熱交換器を含む請求項1に記載の冷却システム。
- 第1の熱交換器が熱源と直接熱的に接触している請求項1に記載の冷却システム。
- 第2の熱交換器が流体/流体熱交換器を含む請求項1に記載の冷却システム。
- ポンプと第1の熱交換器の間に配置される流量調整弁をさらに備える請求項1に記載の冷却システム。
- 熱負荷から環境に放熱するための冷却システムであって、冷却システムの第1の冷却サイクルが揮発性作動流体を含み、第2の冷却サイクルが第1の冷却サイクルに熱的に連結され、
第1の冷却サイクルが、ポンプ、ポンプと流体連通し熱負荷と熱連通している第1の熱交換器、並びに第1の熱交換器をポンプに連結する作動流体用の第1の経路および第2の冷却サイクルに連結された第2の経路を有する第2の熱交換器を備え、前記第1および第2の流路が互いに熱連通しており、
第2の冷却サイクルが環境と熱連通している冷凍システムを備える冷却システム。 - 冷凍システムが、
第2の流路の一端に連結された圧縮機と、
圧縮機に連結された入口および第2の経路の他方の端部に連結された出口を有する、環境と熱連通している凝縮器と、
凝縮器の出口と第2の経路の他方の端部の間に配置された膨張デバイスとを備える請求項6に記載の冷却システム。 - 熱負荷から環境に放熱するための冷却システムであって、
揮発性作動流体を含む第1の冷却サイクルと、
第1の冷却サイクルに熱的に連結された第2の冷却サイクルとを備え、
第1の冷却サイクルが、
ポンプと、
ポンプと流体連通し熱負荷と熱連通している第1の熱交換器と、
第1の熱交換器およびポンプと流体連通している作動流体用の第1の流路、並びに第2の冷却サイクルの一部を含む第2の流路を有する第2の熱交換器とを備え、第1および第2の流路が互いに熱連通しており、
第2の冷却サイクルが環境と熱連通している冷水システムを含む冷却システム。 - 熱負荷から環境に放熱するための冷却システムであって、
揮発性作動流体をシステムを通してポンピングするためのポンプと、
熱負荷と熱連通している流路を有し、ポンプに連結された第1の熱交換器と、
互いに熱連通している第1および第2の流路を有する第2の熱交換器とを備え、第1の流路が第1の熱交換器からポンプまでの流体連通を提供し、第2の流路が第1の熱交換器を環境と熱連通している他の冷却システムに連結するように構成された冷却システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52752703P | 2003-12-05 | 2003-12-05 | |
PCT/US2004/040407 WO2005057097A2 (en) | 2003-12-05 | 2004-12-02 | Cooling system for high density heat load |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007514121A true JP2007514121A (ja) | 2007-05-31 |
Family
ID=34676760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006542755A Pending JP2007514121A (ja) | 2003-12-05 | 2004-12-02 | 高密度熱負荷のための冷却システム |
Country Status (6)
Country | Link |
---|---|
US (4) | US8261565B2 (ja) |
EP (2) | EP2314956A1 (ja) |
JP (1) | JP2007514121A (ja) |
CN (1) | CN100529594C (ja) |
HK (1) | HK1095624A1 (ja) |
WO (1) | WO2005057097A2 (ja) |
Cited By (3)
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JP2010533280A (ja) * | 2007-07-11 | 2010-10-21 | リーバート・コーポレイシヨン | ポンピング冷媒システムを均等化する方法および装置 |
EP2584880A2 (en) | 2011-10-18 | 2013-04-24 | Hitachi Plant Technologies, Ltd. | Cooling system and method for controlling cooling system |
JP2014526667A (ja) * | 2011-09-09 | 2014-10-06 | ヨーロピアン オーガナイゼーション フォー ニュークリア リサーチ | 正確な温度制御のための小型冷却システムおよび方法 |
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Also Published As
Publication number | Publication date |
---|---|
HK1095624A1 (en) | 2007-05-11 |
CN100529594C (zh) | 2009-08-19 |
WO2005057097A2 (en) | 2005-06-23 |
US9243823B2 (en) | 2016-01-26 |
US9772126B2 (en) | 2017-09-26 |
WO2005057097A3 (en) | 2005-08-18 |
CN1890515A (zh) | 2007-01-03 |
US20120324930A1 (en) | 2012-12-27 |
US9243822B2 (en) | 2016-01-26 |
US20050120737A1 (en) | 2005-06-09 |
US8261565B2 (en) | 2012-09-11 |
US20160138840A1 (en) | 2016-05-19 |
US20130000335A1 (en) | 2013-01-03 |
EP2314956A1 (en) | 2011-04-27 |
EP1723371A2 (en) | 2006-11-22 |
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