CN1890515A - 用于高密度热负荷的冷却系统 - Google Patents

用于高密度热负荷的冷却系统 Download PDF

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CN1890515A
CN1890515A CNA2004800360798A CN200480036079A CN1890515A CN 1890515 A CN1890515 A CN 1890515A CN A2004800360798 A CNA2004800360798 A CN A2004800360798A CN 200480036079 A CN200480036079 A CN 200480036079A CN 1890515 A CN1890515 A CN 1890515A
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fluid
heat exchanger
cooling system
pump
heat
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CN100529594C (zh
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S·A·博罗尔
F·E·迪保罗
T·E·哈维
S·M·马达拉
R·J·马姆
S·C·西拉托
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Dimension Corp.
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/04Preventing the formation of frost or condensate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20827Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B7/00Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
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  • Chemical & Material Sciences (AREA)
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Abstract

本发明涉及一种具有挥发性工作流体的用于将热负荷的热量传递给环境的冷却系统(10)。该冷却系统包括第一冷却循环(12)和与该第一冷却循环热连接的第二冷却循环(14)。所述第一冷却循环不是蒸气压缩循环,并包括泵(20)、空气-流体热交换器(30)以及流体-流体热交换器(40)。第二冷却循环可包括用于将热量从流体-流体热交换器传递给环境的冷水系统。或者,第二冷却循环可包括用于将热量从流体-流体热交换器传递给环境的蒸气压缩系统。

Description

用于高密度热负荷的冷却系统
技术领域
本发明一般地涉及冷却系统,更具体地,涉及一种用于高密度热负荷的冷却系统。
背景技术
处于关键位置例如计算机室或通信室的电子设备需要精确、可靠地控制室内温度、湿度和气流。过热或过潮都会损害或削弱计算机系统以及其它元件的操作。为此,操作精确冷却系统以在这些位置进行冷却。但是,当使用直接蒸发(DX)冷却系统冷却这种高密度热负荷时会产生问题。现有的用于高密度负荷的DX系统监控空气温度和其它变量,以响应于负荷改变而控制系统的冷却能力。因此,现有DX系统需要相当复杂的控制、温度传感器以及其它控制元件。因此,需要一种可对密度变化的热负荷敏感并且需要较少地控制阀以及其它系统元件的冷却系统。此外,传统的计算机室空调系统需要过大的地板面积以便管理高密度热负荷。本公开旨在克服或至少减小上文提到的一个或多个问题的影响。
发明内容
本发明公开了一种用于将热负荷的热量传递到环境的冷却系统。该冷却系统具有工作流体,该工作流体在示例性实施例中为挥发性工作流体。该冷却系统包括相互热连接的第一冷却循环和第二冷却循环。第一冷却循环包括泵、第一热交换器以及第二热交换器。
第一热交换器通过管道与泵流体连通,并与热负荷热连通,该热负荷可以是计算机室、电子器件封装件或其它空间。第一热交换器可以是例如空气-流体热交换器。另外,可在泵和第一热交换器之间安置流量调节器。
第二热交换器包括相互热连通的第一流体通路和第二流体通路。第二热交换器可以是例如流体-流体热交换器。该冷却系统的用于工作流体的第一流体通路使第一热交换器与泵连接。第二流体通路形成第二冷却循环的一部分。
在所公开的冷却系统的一个实施例中,第二冷却循环包括与环境热连通的冷水系统。在所公开的冷却系统的另一个实施例中,第二冷却循环包括与环境热连通的制冷系统。该制冷系统可包括压缩机、冷凝器和膨胀设备。压缩机与第二热交换器的第二流体通路的一端流体连通。冷凝器与环境流体连通,该冷凝器可以是空气-流体热交换器。冷凝器具有连接到压缩机的入口,并具有通过第二热交换器连接到第二流体通路的另一端的出口。膨胀设备设置在冷凝器的出口和第二流体通路的另一端之间。
前文的概要并不是意图总结本公开的每个潜在的实施例或每个方面。
附图说明
参照下文结合附图对特定实施例的详细说明最好地理解本发明的主题的前述概要、优选实施例以及其它方面,在附图中:
图1示意性地示出根据本公开的某些教导的冷却系统的一个实施例;
图2示意性地示出根据本公开的某些教导的冷却系统的另一个实施例;
图3示出所公开的冷却系统的循环图;
图4示出典型的蒸气压缩制冷系统的循环图。
尽管所公开的冷却系统存在许多变型和可选择的形式,但是该系统的特定实施例已作为示例在附图内示出并在文中被详细说明。附图以及书面说明并不意图以任何方式限制发明概念的范围。相反,附图以及书面说明将通过参照特定实施例向本领域内的普通技术人员说明发明概念。
具体实施方式
参照图1和图2,所公开的冷却系统10包括与第二循环14热连通的第一冷却循环12。所公开的冷却系统10还包括控制系统100。第一循环12和第二循环14都包含独立的工作流体。第一循环内的工作流体是任何适于用作传统制冷剂的挥发性流体,包括但不局限于氯氟烃(CFC)、氢氟烃(HFC)或氢氯氟烃(HCFC)。使用挥发性流体可避免使用位于敏感设备上方的水,而在用于冷却计算机室的传统系统内有时会使用水。第一循环12包括泵20、一个或多个第一热交换器(蒸发器)30、第二热交换器40和使第一循环12的各个元件互连的管道。第一循环12并不是蒸气压缩制冷系统。相反,第一循环12使用泵20而不是压缩机来使挥发性工作流体循环以除去热负荷的热量。泵20优选地能够将挥发性工作流体泵送到整个第一冷却循环12内,并且优选地被控制系统100控制。
第一热交换器30是空气-流体热交换器,当第一工作流体通过第一热交换器30内的第一流体通路时,该热交换器将热量从热负荷(未示出)转移到第一工作流体。例如,空气-流体热交换器30可包括多个设置成允许热空气从其间通过的用于工作流体的管。应理解,现有技术内已知的许多空气-流体热交换器都可用于所公开的冷却系统10。可在管道22和蒸发器30的入口之间连接流量调节器32,以调节流入蒸发器30的工作液体的流量。流量调节器32可以是用来调节冷却系统10内的流量的电磁阀或其他类型的装置。流量调节器32优选地维持在与系统的工作压力范围内的入口压力无关的恒定的输出流量。在图1和图2的实施例中,第一循环12包括连接到管道22的多个蒸发器30和流量调节器32。但是,所公开的系统可具有一个或多个连接到管道22的蒸发器30和流量调节器32。
第二热交换器40是将第一工作流体的热量传递给第二循环14的流体-流体热交换器。应理解,现有技术内已知的许多流体-流体热交换器可用于所公开的冷却系统10。例如,流体-流体热交换器40可包括多个用于一种流体的管,所述管安置在容纳第二流体的室或壳体内。同轴(“套管式”)交换器也适用。在一些实施例中,优选地使用板式热交换器。第一循环12还包括通过旁通管路52连接到第二热交换器40的出口管道46的接收器50。接收器50可存储并积聚第一循环12内的工作流体,以应对温度和热负荷改变。
在一个实施例中,空气-流体热交换器30可用于冷却存放计算机设备的房间。例如,风扇34可通过热交换器30从房间(热负荷)抽出空气,在该热交换器内第一工作流体吸收空气的热量。在另一个实施例中,通过将空气-流体热交换器30安装在发热的电子设备(热负荷)之上或附近,可使用热交换器30直接除去该电子设备的热量。例如,电子设备通常被容纳在封装件(未示出)内。热交换器30可安装在该封装件上,并且风扇34可通过热交换器30从该封装件抽出空气。可选择地,第一交换器30可与热源(例如冷却板)直接热接触。本领域内的技术人员应理解,所公开的冷却系统10的元件的传热速率、尺寸以及其它设计变量依赖于所公开的冷却系统10的大小、将被管理的热负荷的量以及具体实施的其它细节。
在图1所示的所公开的冷却系统10的实施例中,第二循环14包括连接到第一循环12的流体-流体热交换器40的冷水循环60。具体地,第二热交换器40具有相互热连通的第一部分或流体通路42和第二部分或流体通路44。用于挥发性工作流体的第一流体通路42连接在第一热交换器30和泵之间。第二流体通路44连接到冷水循环60。冷水循环60可类似于本领域内已知的那些。冷水系统60包括第二工作流体,该第二工作流体吸收通过流体-流体热交换器40的第一工作流体的热量。第二工作流体通过本领域内已知的用于传统的冷水循环的技术而冷却。通常,第二工作流体可以是挥发性的或非挥发性的。例如,在图1的实施例中,第二工作流体可以是水、乙二醇或它们的混合物。因此,图1内的第一循环12的实施例可构造成独立的单元,该独立的单元容纳泵20、空气-流体热交换器30和流体-流体热交换器40,并且可连接到例如在容纳将被冷却的设备的建筑物内可得到的现有的冷水供应。
在图2所示的所公开的冷却系统10的实施例中,第一循环12与以上所述基本相同。但是,第二循环14包括蒸气压缩制冷系统70,该系统连接到第一循环12的热交换器40的第二部分或流体通路44。图2内的制冷系统70直接连接到流体-流体热交换器40或者是该热交换器的“另一半”,而不是如图1内的实施例使用冷水除去来自第一循环12的热量。蒸气压缩制冷系统70可与本领域内已知的那些基本相同。示例性蒸气压缩制冷系统70包括压缩机74、冷凝器76和膨胀设备78。管道72使这些元件相互连接并连接到热交换器40的第二流体通路44。
蒸气压缩制冷系统70通过使用第二工作流体吸收来自第二热交换器40的热量并将此热量排放到环境(未示出)中而除去来自流过该热交换器40的第一工作流体的热量。第二工作流体可以是挥发性的或非挥发性的。例如,在图2的实施例中,第二工作流体可以是任何传统的化学制冷剂,包括但不局限于氯氟烃(CFC)、氢氟烃(HFC)或氢氯氟烃(HCFC)。膨胀设备78可以是在从中通过的工作流体内产生压降的阀、节流孔或本领域内的技术人员已知的其它装置。压缩机74可以是适用于提供制冷服务的本领域内已知的任何类型的压缩机,如往复式压缩机、涡卷式(scroll)压缩机等。在图2所示的实施例中,冷却系统10为独立的。例如,蒸气压缩制冷系统70可以是还容纳泵20和流体-流体热交换器30的单个单元的一部分。
在所公开系统的操作期间,泵20使工作流体经由管道22移动到空气-流体热交换器30内。泵送增加了工作流体的压力,而工作流体的焓基本保持不变。(见图3内的循环图的线段80)。泵送的工作流体然后进入第一循环12的空气-流体热交换器或蒸发器30。风扇34可通过热交换器30从热负荷抽出空气。当来自热负荷(未示出)的热空气进入空气-流体热交换器30时,挥发性工作流体吸收热量。当流体通过热交换器变热时,一部分挥发性工作流体将蒸发。(见图3内的循环图的线段82)。在满负荷的系统10内,离开第一热交换器30的流体将是饱和蒸气。蒸气从热交换器30通过管道36流到流体-流体热交换器40。在管道或回流管36内,工作流体处于蒸气状态,并且流体的压力降低而焓基本保持不变。(见图3内的循环图的线段84)。在流体-流体热交换器40内,第一流体通路42内的蒸气通过向第二流体通路44内的第二循环12的较冷的第二流体传热而冷凝。(见图3内的循环图的线段86)。冷凝的工作流体经由管道44离开热交换器40并进入泵20,由此可重复第一循环12。
第二冷却循环14与第一循环12联合操作以通过将热量从第一工作流体吸收到第二工作流体内并将热量排放到环境(未示出)内而除去来自第一循环12的热量。如上所述,第二循环14可包括如图1所示的冷水系统60,或如图2所示的蒸气压缩制冷系统70。例如,在图1内的冷水系统60的操作期间,第二工作流体可流过热交换器40的第二流体通路44,并且可在水塔(未示出)内被冷却。例如,在图2内的制冷系统70的操作期间,第二工作流体通过流体-流体热交换器40的第二部分44,并吸收来自第一循环12内的挥发性流体的热量。工作流体在该过程内蒸发。(见图4内的典型蒸气压缩制冷循环的线段92)。蒸气行进到压缩机74,在该压缩机内工作流体被压缩。(见图4内的制冷循环的线段90)。蒸发器74可以是往复式、螺旋式或本领域内已知的其它类型的压缩机。在压缩之后,工作流体通过排出管路行进到冷凝器76,在该冷凝器工作流体的热量消散到外部散热器例如室外环境。(见图4内的制冷循环的线段96)。在离开冷凝器76时,制冷剂通过液体管路流到膨胀设备75。当制冷剂通过膨胀设备75时,第二工作流体产生压降。(见图4内的制冷循环的线段94)。在离开膨胀设备75时,工作流体流过流体-流体热交换器40的第二流体通路,该热交换器用作制冷循环70的蒸发器。
传统的用于计算机室等的冷却系统占用宝贵的地板面积。但是,本发明的冷却系统10可冷却高密度热负荷而不会消耗宝贵的地板面积。此外,与传统类型的用于高密度负荷例如计算机室的冷却方案相比,由于与泵送非挥发性流体例如水相比泵送挥发性流体需要较少的能量,所以冷却系统10节约能源。另外,泵送挥发性流体可减小所需的泵的尺寸以及使系统元件互连的管道的总尺寸和成本。
所公开的系统10有利地使用挥发性流体的相变以增加空间或房间的每平方英尺的冷却能力。另外,所公开的系统10还使得安装在计算设备上方的冷却设备内不需要水,水会存在万一泄漏时损害计算设备的危险。此外,由于该系统设计成仅除去显热(sensible heat),所以不需要除去冷凝物。如本领域内已知,将空气冷却到低温会增加相对湿度,这意味着可能出现冷凝。例如,如果蒸发器安装在电子器件封装件上,可能会在该封装件内出现冷凝,这会给电子设备带来很大危险。在本系统内,设备周围的环境的温度保持高于露点以确保不会发生冷凝。由于所公开的冷却系统没有执行潜在的冷却,所以该系统的全部冷却能力均可用于冷却计算设备。
所公开的冷却系统10可处理变化的热负荷而不需要传统的直接蒸发系统所需的复杂控制。由于泵20向系统提供恒定的挥发性流体流,所以该系统是自动调节的。流量调节器32操作以限制到每个热交换器30的最大流量。此操作平衡了到每个热交换器30的流量从而使每个热交换器得到基本相同的流体流量。如果某个热交换器处于“高”负荷,则挥发性流体将以比处于较低负荷的热交换器高的速率闪蒸(flash off)。如果没有流量调节器32,则由于“较低”负荷的热交换器是较冷的位置并具有较低的流体压降,所以更多的流体将流到该热交换器。此行为将使处于高负荷的热交换器“挨饿”,并且该热交换器将不能适当地冷却负荷。
用于维持所有显冷却的关键系统控制参数是将被控制的空间内的露点。所公开的冷却系统10控制冷水或蒸气压缩系统,以使流到上述热交换器30的流体将总是高于将被控制的空间内的露点。保持高于露点可确保不会发生潜在的冷却。
前文的对优选的以及其它实施例的说明并不是限制或约束申请人的发明概念的范围或适用性。申请人要求用所附权利要求提供的所有专利权来替换公开文中包含的发明概念。因此,所附权利要求将最大程度地包括位于所附权利要求或其等同物的范围内的所有变型和改变。

Claims (9)

1.一种用于将热负荷的热量传递给热交换系统的冷却系统,该冷却系统包括:
挥发性工作流体;
泵;
与所述泵流体连通并与所述热负荷热连通的第一热交换器;以及
第二热交换器,该第二热交换器具有与所述第一热交换器和泵流体连通的第一流体通路以及连接到所述热交换系统的第二流体通路,所述第一流体通路和所述第二流体通路相互热连通。
2.根据权利要求1的冷却系统,其特征在于,所述第一热交换器包括空气-流体热交换器。
3.根据权利要求1的冷却系统,其特征在于,所述第一热交换器与热源直接热接触。
4.根据权利要求1的冷却系统,其特征在于,所述第二热交换器包括流体-流体热交换器。
5.根据权利要求1的冷却系统,其特征在于,该冷却系统还包括位于所述泵与所述第一热交换器之间的流量调节器。
6.一种用于将热负荷的热量传递给环境的冷却系统,该冷却系统包括包含挥发性工作流体的第一冷却循环和与所述第一冷却循环热连接的第二冷却循环,
其中,所述第一冷却循环包括泵、第一热交换器以及第二热交换器,所述第一热交换器与所述泵流体连通并与所述热负荷热连通,所述第二热交换器具有使所述第一热交换器连接到所述泵的用于所述工作流体的第一流体通路和连接到所述第二冷却循环的第二流体通路,所述第一流体通路和所述第二流体通路相互热连通;
所述第二冷却循环包括与环境热连通的制冷系统。
7.根据权利要求6的冷却系统,其特征在于,所述制冷系统包括:
连接到所述第二流体通路的一端的压缩机;
与环境热连通的冷凝器,该冷凝器具有连接到所述压缩机的入口和连接到所述第二流体通路的另一端的出口;以及
设置在所述冷凝器的出口与所述第二流体通路的所述另一端之间的膨胀设备。
8.一种用于将热负荷的热量传递给环境的冷却系统,该冷却系统包括:
包含挥发性工作流体的第一冷却循环;和
与该第一冷却循环热连接的第二冷却循环;
其中,所述第一冷却循环包括:
泵;
与所述泵流体连通并与所述热负荷热连通的第一热交换器;以及
第二热交换器,该第二热交换器具有与所述第一热交换器和所述泵连通的用于工作流体的第一流体通路,和包括所述第二冷却循环的一部分的第二流体通路,所述第一流体通路和所述第二流体通路相互热连通,
所述第二冷却循环包括与环境热连通的冷水系统。
9.一种用于将热负荷的热量传递给环境的冷却系统,该冷却系统包括:
用于泵送挥发性工作流体使其通过该系统的泵;
连接到所述泵并具有与所述热负荷热连通的流体通路的第一热交换器;以及
具有相互热连通的第一流体通路和第二流体通路的第二热交换器,其中,所述第一流体通路提供从所述第一热交换器到所述泵的流体连通,所述第二流体通路适于使所述第一热交换器连接到与环境热连通的另一冷却系统。
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103063068A (zh) * 2011-10-18 2013-04-24 株式会社日立工业设备技术 冷却系统及其控制方法
CN103185409A (zh) * 2011-12-28 2013-07-03 力博特公司 具有1+1到n+1的泵送制冷剂冷却系统和内置冗余
CN103185410A (zh) * 2011-12-28 2013-07-03 力博特公司 用于高密度热负载的改进的冷却系统
CN103631349A (zh) * 2012-08-22 2014-03-12 国际商业机器公司 用于高效的数据中心冷却的系统和方法
CN105202632A (zh) * 2015-09-28 2015-12-30 南京佳力图空调机电有限公司 一种新型精确制冷空调机组
US9494371B2 (en) 2011-12-28 2016-11-15 Liebert Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
US10292314B2 (en) 2011-12-28 2019-05-14 Vertiv Corporation Cooling system for high density heat loads

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001249286A1 (en) * 2000-03-21 2001-10-03 Liebert Corporation Method and apparatus for cooling electronic enclosures
WO2005057097A2 (en) 2003-12-05 2005-06-23 Liebert Corporation Cooling system for high density heat load
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
US7305847B2 (en) * 2004-04-03 2007-12-11 Wolski Peter F Cold carbonation system for beverage dispenser with remote tower
US7330350B2 (en) * 2004-06-04 2008-02-12 Cray Inc. Systems and methods for cooling computer modules in computer cabinets
US7304842B2 (en) * 2004-06-14 2007-12-04 Cray Inc. Apparatuses and methods for cooling electronic devices in computer systems
US7120027B2 (en) * 2004-07-08 2006-10-10 Cray Inc. Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
US7177156B2 (en) * 2004-07-08 2007-02-13 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7362571B2 (en) * 2004-09-16 2008-04-22 Cray Inc. Inlet flow conditioners for computer cabinet air conditioning systems
JP4922943B2 (ja) * 2004-11-14 2012-04-25 リーバート・コーポレイシヨン 電子部品筐体冷却システムおよび方法
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US9142844B2 (en) 2005-05-18 2015-09-22 Sprint Communications Company L.P. Power system for a telecommunications network
CN101238766B (zh) 2005-08-04 2011-04-13 力博特公司 具有整体高性能的冷却系统和备用通风系统的电子设备机柜
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US8118084B2 (en) * 2007-05-01 2012-02-21 Liebert Corporation Heat exchanger and method for use in precision cooling systems
US7900468B2 (en) * 2007-07-11 2011-03-08 Liebert Corporation Method and apparatus for equalizing a pumped refrigerant system
US20090031735A1 (en) * 2007-08-01 2009-02-05 Liebert Corporation System and method of controlling fluid flow through a fluid cooled heat exchanger
US20090056348A1 (en) * 2007-08-01 2009-03-05 Liebert Corporation Motorized ball valve control system for fluid cooled heat exchanger
US8411439B1 (en) 2007-09-28 2013-04-02 Exaflop Llc Cooling diversity in data centers
US20090120117A1 (en) * 2007-11-13 2009-05-14 Dover Systems, Inc. Refrigeration system
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
JP4780479B2 (ja) * 2008-02-13 2011-09-28 株式会社日立プラントテクノロジー 電子機器の冷却システム
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US9989280B2 (en) * 2008-05-02 2018-06-05 Heatcraft Refrigeration Products Llc Cascade cooling system with intercycle cooling or additional vapor condensation cycle
US20090288445A1 (en) * 2008-05-21 2009-11-26 Sanjay Anikhindi Modular household refrigeration system and method
US20100071881A1 (en) * 2008-08-21 2010-03-25 Airbus Operations Cooling system for aircraft electric or electronic devices
US9238398B2 (en) * 2008-09-25 2016-01-19 B/E Aerospace, Inc. Refrigeration systems and methods for connection with a vehicle's liquid cooling system
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
CN101603709A (zh) * 2009-07-13 2009-12-16 苏州昆拓冷机有限公司 智能节能型空调器
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US20120174612A1 (en) * 2010-05-21 2012-07-12 Liebert Corporation Computer Room Air Conditioner With Pre-Cooler
CN103282734A (zh) * 2010-05-27 2013-09-04 江森自控科技公司 用于具有冷却塔的冷却系统的热虹吸冷却器
US9844277B2 (en) * 2010-05-28 2017-12-19 Marlow Industries, Inc. System and method for thermoelectric personal comfort controlled bedding
US20120227429A1 (en) * 2011-03-10 2012-09-13 Timothy Louvar Cooling system
DE102011014955A1 (de) * 2011-03-24 2012-09-27 Airbus Operations Gmbh Kühlsystem und Verfahren zum Betreiben eines Kühlsystems
US20140034275A1 (en) * 2011-04-21 2014-02-06 Carrier Corporation Condenser/Accumulator and Systems and Operation Methods
WO2013034170A1 (en) * 2011-09-09 2013-03-14 Cern - European Organization For Nuclear Research Compact cooling system and method for accurate temperature control
EP2766675B1 (en) * 2011-09-30 2022-08-24 Carrier Corporation High efficiency refrigeration system
EP3168551A1 (en) * 2011-10-07 2017-05-17 Danfoss A/S Method of coordinating operation of compressors
CN202561927U (zh) * 2011-11-15 2012-11-28 开利公司 混合式制冷剂循环冷却系统和数据处理中心
CN202392894U (zh) * 2011-11-15 2012-08-22 开利公司 空调末端装置、空调设备及数据中心
CN202392893U (zh) * 2011-11-15 2012-08-22 开利公司 空调末端装置、空调设备及数据中心
WO2013109535A1 (en) * 2012-01-16 2013-07-25 Parker-Hannifin Corporation Parallel evaporator circuit with balanced flow
WO2013151526A1 (en) * 2012-04-02 2013-10-10 Parker-Hannifin Corporation Cooling system and method
CN102607146B (zh) * 2012-04-06 2014-09-10 谭仲禧 一种中央空调系统及其控制方法
US20130283829A1 (en) * 2012-04-25 2013-10-31 Basf Se Method for providing a refrigerant medium in a secondary cycle
US9016352B2 (en) 2012-05-21 2015-04-28 Calvary Applied Technologies, LLC Apparatus and methods for cooling rejected heat from server racks
WO2014011706A1 (en) 2012-07-09 2014-01-16 Inertech Ip Llc Transformerless multi-level medium-voltage uninterruptible power supply (ups) systems and methods
CN103542469B (zh) * 2012-07-12 2018-06-15 开利公司 温湿独立控制空调系统与方法
EP4177543A1 (en) 2012-10-09 2023-05-10 Inertech IP LLC Cooling systems and methods incorporating a plural in-series pumped liquid refrigerant trim evaporator cycle
US8436246B1 (en) 2012-10-19 2013-05-07 Calvary Applied Technologies, LLC Refrigerant line electrical ground isolation device for data center cooling applications
CN103075847A (zh) * 2013-01-17 2013-05-01 深圳睿立方智能科技有限公司 带有制冷剂泵的终端制冷系统和数据中心终端制冷系统
US20140209288A1 (en) * 2013-01-28 2014-07-31 Alcatel-Lucent Usa, Inc. Cooling technique
US9774190B2 (en) 2013-09-09 2017-09-26 Inertech Ip Llc Multi-level medium voltage data center static synchronous compensator (DCSTATCOM) for active and reactive power control of data centers connected with grid energy storage and smart green distributed energy sources
EP3058288A1 (en) * 2013-10-17 2016-08-24 Carrier Corporation Two-phase refrigeration system
CN105829810B (zh) * 2013-10-17 2019-05-03 开利公司 具有两相回路的级联空调系统的操作
US10254021B2 (en) 2013-10-21 2019-04-09 Inertech Ip Llc Cooling systems and methods using two cooling circuits
US11306959B2 (en) 2013-11-06 2022-04-19 Inertech Ip Llc Cooling systems and methods using two circuits with water flow in series and counter flow arrangement
US9537686B2 (en) 2014-04-03 2017-01-03 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
CA2952828C (en) * 2014-07-01 2023-05-16 Evapco, Inc. Evaporator liquid preheater for reducing refrigerant charge
WO2016057854A1 (en) 2014-10-08 2016-04-14 Inertech Ip Llc Systems and methods for cooling electrical equipment
EP3210297B1 (en) 2014-10-21 2021-03-10 Inertech IP LLC Systems and methods for controlling multi-level diode-clamped inverters using space vector pulse width modulation (svpwm)
US10193380B2 (en) 2015-01-13 2019-01-29 Inertech Ip Llc Power sources and systems utilizing a common ultra-capacitor and battery hybrid energy storage system for both uninterruptible power supply and generator start-up functions
CN104764291A (zh) * 2015-03-19 2015-07-08 西安理华节能技术有限公司 一种两相液冷式的冷却系统
US10931190B2 (en) 2015-10-22 2021-02-23 Inertech Ip Llc Systems and methods for mitigating harmonics in electrical systems by using active and passive filtering techniques
JP6710938B2 (ja) * 2015-11-05 2020-06-17 富士通株式会社 データセンタシステム、データセンタシステムの制御方法及びプログラム
US10557643B2 (en) * 2016-01-15 2020-02-11 Addison Hvac Llc Demand ventilation HVAC system comprising independently variable refrigerant flow (VRF) and variable air flow (VAF)
WO2017160346A1 (en) 2016-03-16 2017-09-21 Inertech Ip Llc System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
CN107560027A (zh) * 2016-06-30 2018-01-09 浙江盾安人工环境股份有限公司 制冷热管复合空调系统
CN107588490A (zh) * 2016-07-08 2018-01-16 浙江盾安人工环境股份有限公司 制冷热管复合空调系统及其控制方法
US11255611B2 (en) 2016-08-02 2022-02-22 Munters Corporation Active/passive cooling system
US11839062B2 (en) 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
US10653042B2 (en) 2016-11-11 2020-05-12 Stulz Air Technology Systems, Inc. Dual mass cooling precision system
CN110057134B (zh) * 2018-01-18 2021-07-20 盾安汽车热管理科技有限公司 热管背板制冷系统及其控制方法
US11805337B2 (en) * 2018-09-14 2023-10-31 Telefonaktiebolaget Lm Ericsson (Publ) Method and system for automatically protecting radio network equipment in extreme environmental conditions
US10578342B1 (en) * 2018-10-25 2020-03-03 Ricardo Hiyagon Moromisato Enhanced compression refrigeration cycle with turbo-compressor
US20210368656A1 (en) * 2020-05-20 2021-11-25 Nvidia Corporation Intelligent control and distribution of a liquid in a data center
US20240090186A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Stable pumped two-phase cooling

Family Cites Families (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2244312A (en) 1938-03-31 1941-06-03 Honeywell Regulator Co Refrigeration system
US3005321A (en) 1959-08-25 1961-10-24 Philco Corp Multiple temperature refrigerator
US3253646A (en) 1964-04-08 1966-05-31 Udylite Corp Cooling system for power supply apparatus
US3334684A (en) 1964-07-08 1967-08-08 Control Data Corp Cooling system for data processing equipment
US3317798A (en) 1966-04-13 1967-05-02 Ibm Cooling electrical apparatus
DE2102254B2 (de) 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart Kuehlvorrichtung fuer leistungshalbleiterbauelemente
US3774677A (en) 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
US3749981A (en) 1971-08-23 1973-07-31 Controlled Power Corp Modular power supply with indirect water cooling
US3754596A (en) 1971-12-03 1973-08-28 Us Navy Cooling system for multiple electrical equipments
US5333677A (en) * 1974-04-02 1994-08-02 Stephen Molivadas Evacuated two-phase head-transfer systems
AT335671B (de) * 1974-12-20 1977-03-25 Interliz Anstalt Regeleinrichtung fur eine warmepumpe
US4238933A (en) * 1978-03-03 1980-12-16 Murray Coombs Energy conserving vapor compression air conditioning system
US4344296A (en) 1978-07-21 1982-08-17 Staples Jack W Efficient second stage cooling system
US4240499A (en) 1978-08-04 1980-12-23 Niagara Blower Company Balanced waste heat recovery and dissipation system
US4314601A (en) 1978-10-04 1982-02-09 Giuffre Anthony A Heat exchange system for recycling waste heat
US4315300A (en) 1979-01-29 1982-02-09 The United States Of America As Represented By The Secretary Of The Navy Cooling arrangement for plug-in module assembly
US4308042A (en) * 1980-04-11 1981-12-29 Atlantic Richfield Company Heat pump with freeze-up prevention
NO163590C (no) 1981-12-02 1990-06-20 Flaekt Ab Anordning til aa kjoele teleteknisk utstyr.
JPS5899205A (ja) 1981-12-09 1983-06-13 株式会社日立製作所 密閉型制御盤の冷却装置
US4512161A (en) 1983-03-03 1985-04-23 Control Data Corporation Dew point sensitive computer cooling system
US4514746A (en) 1983-12-01 1985-04-30 Flakt Aktiebolag Apparatus for cooling telecommunications equipment in a rack
EP0281762B1 (en) 1987-03-12 1992-06-17 Takenaka Komuten Co. Ltd. Air conditioning system for buildings
US4756164A (en) 1987-04-03 1988-07-12 James Timothy W Cold plate refrigeration method and apparatus
GB8724263D0 (en) 1987-10-15 1987-11-18 Bicc Plc Electronic enclosure cooling system
US5054542A (en) * 1989-09-11 1991-10-08 Thermotaxis Development, Inc. Heat transfer system
JP2713472B2 (ja) 1989-09-27 1998-02-16 松下冷機株式会社 多室冷暖房装置
JP2937406B2 (ja) 1990-04-26 1999-08-23 甲府日本電気株式会社 冷却装置
US5150277A (en) 1990-05-04 1992-09-22 At&T Bell Laboratories Cooling of electronic equipment cabinets
US5035628A (en) 1990-05-29 1991-07-30 Amp Incorporated Electrical connector for electrically interconnecting two parallel surfaces
CA2053055C (en) * 1990-10-11 1997-02-25 Tsukasa Mizuno Liquid cooling system for lsi packages
US5161087A (en) 1990-10-15 1992-11-03 International Business Machines Corporation Pivotal heat sink assembly
JP2967574B2 (ja) 1990-11-16 1999-10-25 株式会社日立製作所 冷凍装置
IL100806A (en) 1991-02-01 1997-02-18 Commw Scient Ind Res Org Heat transfer device
ES2065606T3 (es) 1991-02-25 1995-02-16 Bell Telephone Mfg Sistema de refrigeracion.
US5414591A (en) 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system
GB2258298B (en) * 1991-07-31 1995-05-17 Star Refrigeration Cooling method and apparatus
US5335508A (en) * 1991-08-19 1994-08-09 Tippmann Edward J Refrigeration system
US5220809A (en) 1991-10-11 1993-06-22 Nartron Corporation Apparatus for cooling an air conditioning system electrical controller
US5261251A (en) * 1992-02-11 1993-11-16 United States Power Corporation Hydronic building cooling/heating system
US5410448A (en) 1992-03-02 1995-04-25 Digital Equipment Corporation Adaptive cooling system
US5406807A (en) 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
US5273438A (en) 1992-08-19 1993-12-28 The Whitaker Corporation Canted coil spring array and method for producing the same
US5402313A (en) 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
US5471850A (en) 1993-07-09 1995-12-05 Acurex Corporation Refrigeration system and method for very large scale integrated circuits
US5395251A (en) 1993-10-21 1995-03-07 The Whitaker Corporation Board retainer system for active electrical connector assembly
US5376008A (en) 1993-10-21 1994-12-27 The Whitaker Corporation Retainer for elastomeric contact element
US5467607A (en) 1994-02-22 1995-11-21 At&T Corp. Air conditioning control system
JP3487382B2 (ja) 1994-12-28 2004-01-19 株式会社デンソー 沸騰冷却装置
US5570740A (en) 1995-03-03 1996-11-05 Dsc Communications Corporation Built-in cooling system for an enclosure
JP3113793B2 (ja) 1995-05-02 2000-12-04 株式会社エヌ・ティ・ティ ファシリティーズ 空気調和方式
US5657641A (en) 1995-09-13 1997-08-19 Kooltronic, Inc. Panel mounted cooling system
US5737923A (en) 1995-10-17 1998-04-14 Marlow Industries, Inc. Thermoelectric device with evaporating/condensing heat exchanger
US5673029A (en) 1996-02-15 1997-09-30 Orbitron Computer System, Inc. Apparatus for cooling a memory storage device
US6305463B1 (en) 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US5740018A (en) 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
US6205803B1 (en) * 1996-04-26 2001-03-27 Mainstream Engineering Corporation Compact avionics-pod-cooling unit thermal control method and apparatus
DE19723955A1 (de) 1996-06-12 1998-03-26 Denso Corp Kühlvorrichtung mit Kühlmittel-Verdampfung und -Kondensierung
US5709100A (en) * 1996-08-29 1998-01-20 Liebert Corporation Air conditioning for communications stations
US5826436A (en) 1996-09-03 1998-10-27 Mainstream Engineering Corporation Additive for improving performance and cooling capacity of vapor compression systems
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5847927A (en) 1997-01-27 1998-12-08 Raytheon Company Electronic assembly with porous heat exchanger and orifice plate
JP3405653B2 (ja) 1997-04-03 2003-05-12 三菱電機株式会社 密閉型電動圧縮機およびその製法、ならびにそれを用いてなる冷凍・空調装置
US6115242A (en) 1997-10-24 2000-09-05 Advanced Micro Devices, Inc. Chip chassis including a micro-backplane for receiving and connecting a plurality of computer chips
JP3095377B2 (ja) 1997-12-24 2000-10-03 イノテック株式会社 チラー装置
DE19804901C2 (de) 1998-02-07 2003-04-17 Rittal Gmbh & Co Kg Schaltschrank
DE19921674A1 (de) 1998-05-13 1999-11-18 Bader Engineering Gmbh Vorrichtung und Verfahren zum Kühlen eines Schalt- oder Steuerschrankes
US6024165A (en) 1998-08-26 2000-02-15 Dsc Telecom L.P. Thermal management device and system for an electronic component enclosure
US6046908A (en) 1998-09-04 2000-04-04 Long Well Electronics Corp. Heat-radiating structure of power adapter
US6205796B1 (en) 1999-03-29 2001-03-27 International Business Machines Corporation Sub-dew point cooling of electronic systems
US6105387A (en) * 1999-05-05 2000-08-22 Daimlerchrysler Corporation Two pass evaporator
US6208510B1 (en) 1999-07-23 2001-03-27 Teradyne, Inc. Integrated test cell cooling system
US6539736B1 (en) 1999-08-03 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Method for controlling to cool a communication station
FI108962B (fi) 1999-08-20 2002-04-30 Nokia Corp Laitekaapin jäähdytysjärjestelmä
US6460355B1 (en) * 1999-08-31 2002-10-08 Guy T. Trieskey Environmental test chamber fast cool down and heat up system
GB2354062A (en) 1999-09-13 2001-03-14 British Broadcasting Corp Cooling system for use in cooling electronic equipment
JP3541149B2 (ja) 1999-09-27 2004-07-07 株式会社東芝 冷蔵庫
US6299526B1 (en) 1999-10-14 2001-10-09 Avaya Technology Corp. Temperature system for enclosure
US6310773B1 (en) 1999-12-21 2001-10-30 Intel Corporation Heat sink system
US6298677B1 (en) * 1999-12-27 2001-10-09 Carrier Corporation Reversible heat pump system
US6992889B1 (en) 2000-01-25 2006-01-31 Fujitsu Limited Retention module, heat sink and electronic device
US6185098B1 (en) 2000-01-31 2001-02-06 Chatsworth Products, Inc. Co-location server cabinet
AU2001249286A1 (en) 2000-03-21 2001-10-03 Liebert Corporation Method and apparatus for cooling electronic enclosures
US6515862B1 (en) 2000-03-31 2003-02-04 Intel Corporation Heat sink assembly for an integrated circuit
US6519955B2 (en) 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
EP1148772B1 (en) 2000-04-19 2009-12-23 Thermal Form & Function Inc. Cold plate utilizing fin with evaporating refrigerant
US20020117291A1 (en) 2000-05-25 2002-08-29 Kioan Cheon Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US6564858B1 (en) 2000-07-17 2003-05-20 Liebert Corporation Overhead cooling system with selectively positioned paths of airflow
US6416330B1 (en) 2000-07-17 2002-07-09 Cray Inc. Canted coil spring conductor electrical circuit connector
US6557624B1 (en) 2000-08-09 2003-05-06 Liebert Corporation Configurable system and method for cooling a room
WO2002028160A2 (en) 2000-09-29 2002-04-04 Nanostream, Inc. Microfluidic devices for heat transfer
JP3995915B2 (ja) * 2000-10-12 2007-10-24 株式会社マック 流体温度の制御方法及びその装置
US6631624B1 (en) * 2000-11-10 2003-10-14 Rocky Research Phase-change heat transfer coupling for aqua-ammonia absorption systems
JP3504608B2 (ja) 2000-12-06 2004-03-08 イノテック株式会社 冷却システム
US6751479B1 (en) 2000-12-14 2004-06-15 Bellsouth Intellectual Property Corporation Radio base station
JP4843849B2 (ja) 2001-02-07 2011-12-21 井関農機株式会社 苗植機
JP2002243218A (ja) * 2001-02-14 2002-08-28 Daikin Ind Ltd 冷凍装置
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
US6435266B1 (en) 2001-05-01 2002-08-20 Aavid Taiwan Inc. Heat-pipe type radiator and method for producing the same
DE10128164A1 (de) 2001-06-09 2002-12-12 Behr Gmbh & Co Fahrzeug-Kühlsystem für eine temperaturerhöhende Einrichtung sowie Verfahren zur Kühlung der temperaturerhöhenden Einrichtung
CA2391077A1 (en) * 2001-06-28 2002-12-28 York International Corporation High-v plate fin for a heat exchanger and a method of manufacturing
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
JP2003065618A (ja) * 2001-08-27 2003-03-05 Sanyo Electric Co Ltd 熱搬送装置
US6981543B2 (en) 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6644384B2 (en) 2001-09-21 2003-11-11 Liebert Corporation Modular low profile cooling system
JP3594583B2 (ja) * 2002-01-10 2004-12-02 Necエレクトロニクス株式会社 エッチング装置及びその温度制御方法
US7024573B2 (en) * 2002-02-05 2006-04-04 Hewlett-Packard Development Company, L.P. Method and apparatus for cooling heat generating components
US6628520B2 (en) * 2002-02-06 2003-09-30 Hewlett-Packard Development Company, L.P. Method, apparatus, and system for cooling electronic components
US6742345B2 (en) 2002-03-27 2004-06-01 The Penray Companies, Inc. Temperature control system using aqueous 1,3-propanediol solution
US6550530B1 (en) 2002-04-19 2003-04-22 Thermal Corp. Two phase vacuum pumped loop
JP3680043B2 (ja) 2002-06-27 2005-08-10 東邦瓦斯株式会社 多階層建築物の冷暖房設備
US20040025516A1 (en) * 2002-08-09 2004-02-12 John Van Winkle Double closed loop thermoelectric heat exchanger
US6775997B2 (en) 2002-10-03 2004-08-17 Hewlett-Packard Development Company, L.P. Cooling of data centers
US6775137B2 (en) 2002-11-25 2004-08-10 International Business Machines Corporation Method and apparatus for combined air and liquid cooling of stacked electronics components
JP4012091B2 (ja) 2003-02-20 2007-11-21 富士通株式会社 電子装置の冷却構造及び情報処理装置
US6827135B1 (en) * 2003-06-12 2004-12-07 Gary W. Kramer High flux heat removal system using jet impingement of water at subatmospheric pressure
US6999316B2 (en) 2003-09-10 2006-02-14 Qnx Cooling Systems Inc. Liquid cooling system
WO2005057097A2 (en) 2003-12-05 2005-06-23 Liebert Corporation Cooling system for high density heat load
US7508663B2 (en) 2003-12-29 2009-03-24 Rackable Systems, Inc. Computer rack cooling system with variable airflow impedance
US7236359B2 (en) 2004-04-01 2007-06-26 Strobel Larry A Environmental control system for personal computers
US7469555B2 (en) 2004-11-01 2008-12-30 Carrier Corporation Multiple condenser reheat system with tandem compressors
US7617696B2 (en) 2004-11-12 2009-11-17 Tecumseh Products Company Compact refrigeration system and power supply unit including dynamic insulation
JP4922943B2 (ja) 2004-11-14 2012-04-25 リーバート・コーポレイシヨン 電子部品筐体冷却システムおよび方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959938B2 (en) 2011-10-18 2015-02-24 Hitachi Ltd. Cooling system and method for controlling cooling system
CN103063068A (zh) * 2011-10-18 2013-04-24 株式会社日立工业设备技术 冷却系统及其控制方法
CN103063068B (zh) * 2011-10-18 2015-12-09 株式会社日立制作所 冷却系统及其控制方法
CN110160281A (zh) * 2011-12-28 2019-08-23 维谛公司 具有l+1到N+1的泵送制冷剂冷却系统和内置冗余
CN103185410A (zh) * 2011-12-28 2013-07-03 力博特公司 用于高密度热负载的改进的冷却系统
US9494371B2 (en) 2011-12-28 2016-11-15 Liebert Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
US10292314B2 (en) 2011-12-28 2019-05-14 Vertiv Corporation Cooling system for high density heat loads
US10288324B2 (en) 2011-12-28 2019-05-14 Vertiv Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
CN103185409A (zh) * 2011-12-28 2013-07-03 力博特公司 具有1+1到n+1的泵送制冷剂冷却系统和内置冗余
CN110375451A (zh) * 2011-12-28 2019-10-25 维谛公司 用于高密度热负载的改进的冷却系统
US10897838B2 (en) 2011-12-28 2021-01-19 Vertiv Corporation Cooling system for high density heat loads
CN103631349A (zh) * 2012-08-22 2014-03-12 国际商业机器公司 用于高效的数据中心冷却的系统和方法
CN103631349B (zh) * 2012-08-22 2018-01-02 国际商业机器公司 用于高效的数据中心冷却的系统和方法
US9999163B2 (en) 2012-08-22 2018-06-12 International Business Machines Corporation High-efficiency data center cooling
US11523545B2 (en) 2012-08-22 2022-12-06 Kyndryl, Inc. High-efficiency data center cooling
CN105202632A (zh) * 2015-09-28 2015-12-30 南京佳力图空调机电有限公司 一种新型精确制冷空调机组

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US20120324930A1 (en) 2012-12-27
EP1723371A2 (en) 2006-11-22
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