ES2065606T3 - Sistema de refrigeracion. - Google Patents

Sistema de refrigeracion.

Info

Publication number
ES2065606T3
ES2065606T3 ES91200392T ES91200392T ES2065606T3 ES 2065606 T3 ES2065606 T3 ES 2065606T3 ES 91200392 T ES91200392 T ES 91200392T ES 91200392 T ES91200392 T ES 91200392T ES 2065606 T3 ES2065606 T3 ES 2065606T3
Authority
ES
Spain
Prior art keywords
plates
horizontal portions
slotted guide
guide plates
refrigeration system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91200392T
Other languages
English (en)
Inventor
Francois Jeanne Charl Leyssens
Hendrikus Martinus Jo Rombouts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Bell NV
Original Assignee
Bell Telephone Manufacturing Co NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Manufacturing Co NV filed Critical Bell Telephone Manufacturing Co NV
Application granted granted Critical
Publication of ES2065606T3 publication Critical patent/ES2065606T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

ESTE SISTEMA INCLUYE PLACAS GUIAS RANURADAS (11, 12, 18, 19) QUE FORMAN PARTE DE SUB-ESTANTES (9, 10) Y QUE HACEN CONTACTO TERMICO CON PORCIONES HORIZONTALES DE TUBOS RADIADORES PLANOS CON FORMA DE CAJA (25, 26, 27) QUE TIENEN LA FORMA DE UNA L. LAS PLACAS GUIAS RANURADAS TIENEN MIEMBROS EXCENTRICOS ASOCIADOS (15, 16, 22, 23) PARA FIJAR EL DRENAJE TERMICO DE PLACAS CIRCUITO (17, 24) EN SUS RANURAS (11, 12, 20, 21). LAS PORCIONES HORIZONTALES DE CADA TUBO GUIA RECOGE EL CALOR DE LAS PLACAS DE CIRCUITO Y LO TRANSPORTA POR MEDIO DE SUS PORCIONES VERTICALES A UN INTERCAMBIADOR DE CALOR (31).
ES91200392T 1991-02-25 1991-02-25 Sistema de refrigeracion. Expired - Lifetime ES2065606T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP91200392A EP0501044B1 (en) 1991-02-25 1991-02-25 Cooling system

Publications (1)

Publication Number Publication Date
ES2065606T3 true ES2065606T3 (es) 1995-02-16

Family

ID=8207526

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91200392T Expired - Lifetime ES2065606T3 (es) 1991-02-25 1991-02-25 Sistema de refrigeracion.

Country Status (5)

Country Link
US (1) US5329425A (es)
EP (1) EP0501044B1 (es)
JP (1) JPH05106956A (es)
DE (1) DE69104603T2 (es)
ES (1) ES2065606T3 (es)

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JP3942248B2 (ja) 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
CA2199239A1 (en) * 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
US6292556B1 (en) 1997-11-06 2001-09-18 Anacapa Technology, Inc. Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
US5953930A (en) * 1998-03-31 1999-09-21 International Business Machines Corporation Evaporator for use in an extended air cooling system for electronic components
US6044899A (en) * 1998-04-27 2000-04-04 Hewlett-Packard Company Low EMI emissions heat sink device
US6169247B1 (en) * 1998-06-11 2001-01-02 Lucent Technologies Inc. Enclosure for electronic components
US6310772B1 (en) * 1999-09-02 2001-10-30 Special Product Company Enclosure for telecommunications equipment
US6169660B1 (en) 1999-11-01 2001-01-02 Thermal Corp. Stress relieved integrated circuit cooler
US7630198B2 (en) 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US6430044B2 (en) 2000-02-10 2002-08-06 Special Product Company Telecommunications enclosure with individual, separated card holders
US6404637B2 (en) 2000-02-14 2002-06-11 Special Product Company Concentrical slot telecommunications equipment enclosure
WO2001072099A2 (en) * 2000-03-21 2001-09-27 Liebert Corporation Method and apparatus for cooling electronic enclosures
US6516954B2 (en) 2000-06-29 2003-02-11 Servervault Corp. Equipment rack with integral HVAC and power distribution features
US6940014B1 (en) 2000-07-27 2005-09-06 Special Product Company Modular electronic equipment enclosure comprising sealed cable interface module
US6514095B1 (en) 2000-07-27 2003-02-04 Special Product Company Cable interface for electronic equipment enclosure
US6507494B1 (en) 2000-07-27 2003-01-14 Adc Telecommunications, Inc. Electronic equipment enclosure
US6691766B1 (en) * 2000-09-15 2004-02-17 Lucent Technologies Inc. Cabinet cooling with heat pipe
US6628521B2 (en) * 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
US6625017B1 (en) 2001-02-12 2003-09-23 Special Products Company Telecommunications enclosure with individual, separated card holders
US6506111B2 (en) 2001-05-16 2003-01-14 Sanmina-Sci Corporation Cooling airflow distribution device
US6657121B2 (en) 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6536510B2 (en) 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US6894907B2 (en) * 2001-07-31 2005-05-17 Adc Telecommunications, Inc. Clamping case
US6897377B2 (en) * 2001-07-31 2005-05-24 Adc Telecommunications, Inc. Clamping receptacle
US6856037B2 (en) * 2001-11-26 2005-02-15 Sony Corporation Method and apparatus for converting dissipated heat to work energy
GB0207382D0 (en) * 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US7031158B2 (en) * 2002-10-30 2006-04-18 Charles Industries, Ltd. Heat pipe cooled electronics enclosure
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
US6865085B1 (en) 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
WO2005057097A2 (en) 2003-12-05 2005-06-23 Liebert Corporation Cooling system for high density heat load
US20050207116A1 (en) * 2004-03-22 2005-09-22 Yatskov Alexander I Systems and methods for inter-cooling computer cabinets
WO2005125297A2 (en) * 2004-06-14 2005-12-29 Cray Inc. Cooling electronic devices in computer systems
US7177156B2 (en) * 2004-07-08 2007-02-13 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7120027B2 (en) * 2004-07-08 2006-10-10 Cray Inc. Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
US7362571B2 (en) * 2004-09-16 2008-04-22 Cray Inc. Inlet flow conditioners for computer cabinet air conditioning systems
EP1810558B1 (en) * 2004-11-14 2013-04-24 Liebert Corporation Integrated heat exchanger(s) in a rack for vertical board style computer systems
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
US7788940B2 (en) * 2005-08-04 2010-09-07 Liebert Corporation Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US7450384B2 (en) * 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US20100085708A1 (en) * 2008-10-07 2010-04-08 Liebert Corporation High-efficiency, fluid-cooled ups converter
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US8154116B2 (en) * 2008-11-03 2012-04-10 HeadwayTechnologies, Inc. Layered chip package with heat sink
JP2013509709A (ja) * 2009-11-02 2013-03-14 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 受動的キャビネット冷却
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8542489B2 (en) * 2011-05-05 2013-09-24 Alcatel Lucent Mechanically-reattachable liquid-cooled cooling apparatus
US10209003B2 (en) 2012-02-21 2019-02-19 Thermal Corp. Electronics cabinet and rack cooling system and method
CN105491863A (zh) * 2016-01-20 2016-04-13 北京百度网讯科技有限公司 用于数据中心机柜的冷却装置、机柜和冷却系统
CN105555106B (zh) * 2016-02-29 2018-05-22 北京百度网讯科技有限公司 用于机柜的冷却装置和机柜
US10694641B2 (en) 2016-04-29 2020-06-23 Intel Corporation Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
EP4142442B1 (en) * 2021-08-30 2024-04-17 Ovh Cooling assembly for a data center rack and method for assembling a rack system

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US3613778A (en) * 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3700028A (en) * 1970-12-10 1972-10-24 Noren Products Inc Heat pipes
US3971435A (en) * 1971-07-13 1976-07-27 Ncr Corporation Heat transfer device
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
US4315300A (en) * 1979-01-29 1982-02-09 The United States Of America As Represented By The Secretary Of The Navy Cooling arrangement for plug-in module assembly
US4366526A (en) * 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS6057956A (ja) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ放熱器
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
FR2580433B1 (fr) * 1985-04-16 1987-08-14 Socapex Connecteur thermique pour carte de circuit imprime revetue de composants electroniques
EP0231456B1 (de) * 1985-12-13 1991-06-26 Ascom Hasler AG Verfahren und Vorrichtung zum Abführen der Verlustwärme wenigstens einer Baugruppe elektrischer Elemente
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US4958257A (en) * 1989-03-29 1990-09-18 Hughes Aircraft Company Heat conducting interface for electronic module
US5019939A (en) * 1989-10-24 1991-05-28 Ag Communication Systems Corp. Thermal management plate
EP0461114A1 (en) * 1989-12-28 1991-12-18 Bell Telephone Manufacturing Company Naamloze Vennootschap Cooling system

Also Published As

Publication number Publication date
EP0501044A1 (en) 1992-09-02
JPH05106956A (ja) 1993-04-27
EP0501044B1 (en) 1994-10-12
US5329425A (en) 1994-07-12
DE69104603D1 (de) 1994-11-17
DE69104603T2 (de) 1995-05-04

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