ES2065606T3 - Sistema de refrigeracion. - Google Patents
Sistema de refrigeracion.Info
- Publication number
- ES2065606T3 ES2065606T3 ES91200392T ES91200392T ES2065606T3 ES 2065606 T3 ES2065606 T3 ES 2065606T3 ES 91200392 T ES91200392 T ES 91200392T ES 91200392 T ES91200392 T ES 91200392T ES 2065606 T3 ES2065606 T3 ES 2065606T3
- Authority
- ES
- Spain
- Prior art keywords
- plates
- horizontal portions
- slotted guide
- guide plates
- refrigeration system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Other Air-Conditioning Systems (AREA)
- Details Of Measuring And Other Instruments (AREA)
Abstract
ESTE SISTEMA INCLUYE PLACAS GUIAS RANURADAS (11, 12, 18, 19) QUE FORMAN PARTE DE SUB-ESTANTES (9, 10) Y QUE HACEN CONTACTO TERMICO CON PORCIONES HORIZONTALES DE TUBOS RADIADORES PLANOS CON FORMA DE CAJA (25, 26, 27) QUE TIENEN LA FORMA DE UNA L. LAS PLACAS GUIAS RANURADAS TIENEN MIEMBROS EXCENTRICOS ASOCIADOS (15, 16, 22, 23) PARA FIJAR EL DRENAJE TERMICO DE PLACAS CIRCUITO (17, 24) EN SUS RANURAS (11, 12, 20, 21). LAS PORCIONES HORIZONTALES DE CADA TUBO GUIA RECOGE EL CALOR DE LAS PLACAS DE CIRCUITO Y LO TRANSPORTA POR MEDIO DE SUS PORCIONES VERTICALES A UN INTERCAMBIADOR DE CALOR (31).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP91200392A EP0501044B1 (en) | 1991-02-25 | 1991-02-25 | Cooling system |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2065606T3 true ES2065606T3 (es) | 1995-02-16 |
Family
ID=8207526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES91200392T Expired - Lifetime ES2065606T3 (es) | 1991-02-25 | 1991-02-25 | Sistema de refrigeracion. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5329425A (es) |
EP (1) | EP0501044B1 (es) |
JP (1) | JPH05106956A (es) |
DE (1) | DE69104603T2 (es) |
ES (1) | ES2065606T3 (es) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5844777A (en) * | 1997-01-27 | 1998-12-01 | At&T Corp. | Apparatus for heat removal from a PC card array |
JP3942248B2 (ja) * | 1997-02-24 | 2007-07-11 | 富士通株式会社 | ヒートシンクおよびそれを搭載した情報処理装置 |
CA2199239A1 (en) * | 1997-03-05 | 1998-09-05 | Trevor Zapach | Electronic unit |
US6292556B1 (en) | 1997-11-06 | 2001-09-18 | Anacapa Technology, Inc. | Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction |
US5953930A (en) * | 1998-03-31 | 1999-09-21 | International Business Machines Corporation | Evaporator for use in an extended air cooling system for electronic components |
US6044899A (en) * | 1998-04-27 | 2000-04-04 | Hewlett-Packard Company | Low EMI emissions heat sink device |
US6169247B1 (en) * | 1998-06-11 | 2001-01-02 | Lucent Technologies Inc. | Enclosure for electronic components |
US6310772B1 (en) * | 1999-09-02 | 2001-10-30 | Special Product Company | Enclosure for telecommunications equipment |
US6169660B1 (en) | 1999-11-01 | 2001-01-02 | Thermal Corp. | Stress relieved integrated circuit cooler |
US7630198B2 (en) | 2006-03-08 | 2009-12-08 | Cray Inc. | Multi-stage air movers for cooling computer systems and for other uses |
US6430044B2 (en) | 2000-02-10 | 2002-08-06 | Special Product Company | Telecommunications enclosure with individual, separated card holders |
US6404637B2 (en) | 2000-02-14 | 2002-06-11 | Special Product Company | Concentrical slot telecommunications equipment enclosure |
WO2001072099A2 (en) * | 2000-03-21 | 2001-09-27 | Liebert Corporation | Method and apparatus for cooling electronic enclosures |
US6516954B2 (en) | 2000-06-29 | 2003-02-11 | Servervault Corp. | Equipment rack with integral HVAC and power distribution features |
US6507494B1 (en) | 2000-07-27 | 2003-01-14 | Adc Telecommunications, Inc. | Electronic equipment enclosure |
US6514095B1 (en) | 2000-07-27 | 2003-02-04 | Special Product Company | Cable interface for electronic equipment enclosure |
US6940014B1 (en) | 2000-07-27 | 2005-09-06 | Special Product Company | Modular electronic equipment enclosure comprising sealed cable interface module |
US6691766B1 (en) * | 2000-09-15 | 2004-02-17 | Lucent Technologies Inc. | Cabinet cooling with heat pipe |
US6628521B2 (en) | 2000-11-06 | 2003-09-30 | Adc Telecommunications, Inc. | Mechanical housing |
US6625017B1 (en) | 2001-02-12 | 2003-09-23 | Special Products Company | Telecommunications enclosure with individual, separated card holders |
US6506111B2 (en) | 2001-05-16 | 2003-01-14 | Sanmina-Sci Corporation | Cooling airflow distribution device |
US6657121B2 (en) * | 2001-06-27 | 2003-12-02 | Thermal Corp. | Thermal management system and method for electronics system |
US6536510B2 (en) | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6388882B1 (en) | 2001-07-19 | 2002-05-14 | Thermal Corp. | Integrated thermal architecture for thermal management of high power electronics |
US6894907B2 (en) * | 2001-07-31 | 2005-05-17 | Adc Telecommunications, Inc. | Clamping case |
US6897377B2 (en) | 2001-07-31 | 2005-05-24 | Adc Telecommunications, Inc. | Clamping receptacle |
US6856037B2 (en) * | 2001-11-26 | 2005-02-15 | Sony Corporation | Method and apparatus for converting dissipated heat to work energy |
GB0207382D0 (en) * | 2002-03-28 | 2002-05-08 | Holland Heating Uk Ltd | Computer cabinet |
US6862180B2 (en) * | 2002-05-24 | 2005-03-01 | Adc Dsl Systems, Inc. | Housings for circuit cards |
US7031158B2 (en) * | 2002-10-30 | 2006-04-18 | Charles Industries, Ltd. | Heat pipe cooled electronics enclosure |
US6781830B2 (en) * | 2002-11-05 | 2004-08-24 | Adc Dsl Systems, Inc. | Methods and systems of heat transfer for electronic enclosures |
US6865085B1 (en) | 2003-09-26 | 2005-03-08 | Adc Dsl Systems, Inc. | Heat dissipation for electronic enclosures |
EP1723371A2 (en) | 2003-12-05 | 2006-11-22 | Liebert Corporation | Cooling system for high density heat load |
US20050207116A1 (en) * | 2004-03-22 | 2005-09-22 | Yatskov Alexander I | Systems and methods for inter-cooling computer cabinets |
US7304842B2 (en) * | 2004-06-14 | 2007-12-04 | Cray Inc. | Apparatuses and methods for cooling electronic devices in computer systems |
US7120027B2 (en) * | 2004-07-08 | 2006-10-10 | Cray Inc. | Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures |
US7177156B2 (en) * | 2004-07-08 | 2007-02-13 | Cray Inc. | Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses |
US7362571B2 (en) * | 2004-09-16 | 2008-04-22 | Cray Inc. | Inlet flow conditioners for computer cabinet air conditioning systems |
JP4922943B2 (ja) * | 2004-11-14 | 2012-04-25 | リーバート・コーポレイシヨン | 電子部品筐体冷却システムおよび方法 |
US7193851B2 (en) * | 2004-12-09 | 2007-03-20 | Cray Inc. | Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses |
US7788940B2 (en) * | 2005-08-04 | 2010-09-07 | Liebert Corporation | Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation |
US7411785B2 (en) * | 2006-06-05 | 2008-08-12 | Cray Inc. | Heat-spreading devices for cooling computer systems and associated methods of use |
US7450384B2 (en) * | 2006-07-06 | 2008-11-11 | Hybricon Corporation | Card cage with parallel flow paths having substantially similar lengths |
US7460367B2 (en) * | 2007-03-05 | 2008-12-02 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
US20090154091A1 (en) | 2007-12-17 | 2009-06-18 | Yatskov Alexander I | Cooling systems and heat exchangers for cooling computer components |
US8170724B2 (en) | 2008-02-11 | 2012-05-01 | Cray Inc. | Systems and associated methods for controllably cooling computer components |
US7898799B2 (en) | 2008-04-01 | 2011-03-01 | Cray Inc. | Airflow management apparatus for computer cabinets and associated methods |
US20100085708A1 (en) * | 2008-10-07 | 2010-04-08 | Liebert Corporation | High-efficiency, fluid-cooled ups converter |
US7903403B2 (en) | 2008-10-17 | 2011-03-08 | Cray Inc. | Airflow intake systems and associated methods for use with computer cabinets |
US8081459B2 (en) | 2008-10-17 | 2011-12-20 | Cray Inc. | Air conditioning systems for computer systems and associated methods |
US8154116B2 (en) * | 2008-11-03 | 2012-04-10 | HeadwayTechnologies, Inc. | Layered chip package with heat sink |
JP2013509709A (ja) * | 2009-11-02 | 2013-03-14 | テレフオンアクチーボラゲット エル エム エリクソン(パブル) | 受動的キャビネット冷却 |
US8472181B2 (en) | 2010-04-20 | 2013-06-25 | Cray Inc. | Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use |
US8542489B2 (en) * | 2011-05-05 | 2013-09-24 | Alcatel Lucent | Mechanically-reattachable liquid-cooled cooling apparatus |
US10209003B2 (en) | 2012-02-21 | 2019-02-19 | Thermal Corp. | Electronics cabinet and rack cooling system and method |
CN105491863A (zh) * | 2016-01-20 | 2016-04-13 | 北京百度网讯科技有限公司 | 用于数据中心机柜的冷却装置、机柜和冷却系统 |
CN105555106B (zh) * | 2016-02-29 | 2018-05-22 | 北京百度网讯科技有限公司 | 用于机柜的冷却装置和机柜 |
US10694641B2 (en) * | 2016-04-29 | 2020-06-23 | Intel Corporation | Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms |
EP4142442B1 (en) * | 2021-08-30 | 2024-04-17 | Ovh | Cooling assembly for a data center rack and method for assembling a rack system |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6508824A (es) * | 1964-07-08 | 1966-01-10 | ||
US3613778A (en) * | 1969-03-03 | 1971-10-19 | Northrop Corp | Flat plate heat pipe with structural wicks |
US3700028A (en) * | 1970-12-10 | 1972-10-24 | Noren Products Inc | Heat pipes |
US3971435A (en) * | 1971-07-13 | 1976-07-27 | Ncr Corporation | Heat transfer device |
US4019098A (en) * | 1974-11-25 | 1977-04-19 | Sundstrand Corporation | Heat pipe cooling system for electronic devices |
US4184539A (en) * | 1978-07-10 | 1980-01-22 | The United States Of America As Represented By The Secretary Of The Navy | Electronic card mount and heat transfer assembly for underwater vehicles |
US4315300A (en) * | 1979-01-29 | 1982-02-09 | The United States Of America As Represented By The Secretary Of The Navy | Cooling arrangement for plug-in module assembly |
US4366526A (en) * | 1980-10-03 | 1982-12-28 | Grumman Aerospace Corporation | Heat-pipe cooled electronic circuit card |
US4503483A (en) * | 1982-05-03 | 1985-03-05 | Hughes Aircraft Company | Heat pipe cooling module for high power circuit boards |
JPS6057956A (ja) * | 1983-09-09 | 1985-04-03 | Furukawa Electric Co Ltd:The | 半導体用ヒ−トパイプ放熱器 |
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
FR2580433B1 (fr) * | 1985-04-16 | 1987-08-14 | Socapex | Connecteur thermique pour carte de circuit imprime revetue de composants electroniques |
EP0231456B1 (de) * | 1985-12-13 | 1991-06-26 | Ascom Hasler AG | Verfahren und Vorrichtung zum Abführen der Verlustwärme wenigstens einer Baugruppe elektrischer Elemente |
US5029389A (en) * | 1987-12-14 | 1991-07-09 | Hughes Aircraft Company | Method of making a heat pipe with improved end cap |
US4958257A (en) * | 1989-03-29 | 1990-09-18 | Hughes Aircraft Company | Heat conducting interface for electronic module |
US5019939A (en) * | 1989-10-24 | 1991-05-28 | Ag Communication Systems Corp. | Thermal management plate |
WO1991010346A1 (en) * | 1989-12-28 | 1991-07-11 | Alcatel N.V. | Cooling system |
-
1991
- 1991-02-25 DE DE69104603T patent/DE69104603T2/de not_active Expired - Fee Related
- 1991-02-25 ES ES91200392T patent/ES2065606T3/es not_active Expired - Lifetime
- 1991-02-25 EP EP91200392A patent/EP0501044B1/en not_active Expired - Lifetime
-
1992
- 1992-01-30 US US07/829,358 patent/US5329425A/en not_active Expired - Fee Related
- 1992-02-24 JP JP4036742A patent/JPH05106956A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69104603T2 (de) | 1995-05-04 |
EP0501044B1 (en) | 1994-10-12 |
US5329425A (en) | 1994-07-12 |
EP0501044A1 (en) | 1992-09-02 |
DE69104603D1 (de) | 1994-11-17 |
JPH05106956A (ja) | 1993-04-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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