WO2013109535A1 - Parallel evaporator circuit with balanced flow - Google Patents
Parallel evaporator circuit with balanced flow Download PDFInfo
- Publication number
- WO2013109535A1 WO2013109535A1 PCT/US2013/021570 US2013021570W WO2013109535A1 WO 2013109535 A1 WO2013109535 A1 WO 2013109535A1 US 2013021570 W US2013021570 W US 2013021570W WO 2013109535 A1 WO2013109535 A1 WO 2013109535A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat
- pump
- valve
- valves
- loop system
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims abstract description 69
- 239000012530 fluid Substances 0.000 claims abstract description 57
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 43
- 230000001276 controlling effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 230000002596 correlated effect Effects 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 230000000875 corresponding effect Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/31—Expansion valves
- F25B41/34—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators
- F25B41/35—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators by rotary motors, e.g. by stepping motors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
- F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
- F24F11/46—Improving electric energy efficiency or saving
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2110/00—Control inputs relating to air properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2140/00—Control inputs relating to system states
- F24F2140/50—Load
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2140/00—Control inputs relating to system states
- F24F2140/60—Energy consumption
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2501—Bypass valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2513—Expansion valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/19—Pressures
- F25B2700/197—Pressures of the evaporator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2117—Temperatures of an evaporator
- F25B2700/21175—Temperatures of an evaporator of the refrigerant at the outlet of the evaporator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
- F28F27/02—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus for controlling the distribution of heat-exchange media between different channels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Definitions
- the present invention relates generally to liquid cooling systems, and more particularly to pumped liquid cooling systems having parallel evaporator circuits.
- Electronic devices such as computer servers, generate heat during operation, and therefore a cooling system is used to cool the electronic devices. For example, air may be blown over the electronic devices or a water-based fluid may be circulated through a heat exchanger coupled to the electronic devices to cool the devices.
- the amount of air or water- based fluid required for heating may vary from rack to rack.
- the varied heat may arise from some racks having a greater density of electronic equipment or electric equipment operating at higher levels.
- the present invention provides a pumped loop system for cooling a heat- generating components without relying on a maximum heat load, the system including first and second evaporators in parallel with one another and first and second valves upstream of the first and second evaporators respectively, wherein the valves are controllable to vary the flow rate of fluid to the respective evaporator based on the amount of flow needed to control the respective heat- generating component.
- a pumped loop system for cooling heat-generating components including a first branch having a first evaporator for absorbing heat from a first heat-generating component having a variable heat load and a first valve upstream of the first evaporator for variably controlling the flow of fluid to the first branch, a second branch parallel to the first branch, the second branch having a second evaporator for absorbing heat from a second heat-generating component having a variable heat load and a second valve upstream of the second evaporator for variably controlling the flow of fluid to the second branch, a pump for pumping fluid to the first and second branches, and a condenser downstream of the first and second circuits and upstream of the pump for rejecting the heat absorbed by the fluid in the first and second branches.
- the first and second valves are electronic stepper valves.
- the system further includes at least one controller configured to control at least one of the first valve and the second valve.
- the at least one controller controls fluid flow through the respective branch based upon an input that is indicative of the amount of flow needed to cool the heat-generating component.
- the input is one or more of (i) the amount of electrical power being consumed by the heat-generating component; (ii) the temperature of the heat- generating component; (iii) the temperature of the heat-generating component as correlated to the amount of electrical power being consumed by the heat- generating component; and/or (iv) the amount of heat being generated by the heat-generating component.
- the system further includes a sensor downstream of the first evaporator and a sensor downstream of the second evaporator, wherein the sensors sense a characteristic of the fluid flow through the first and second branches
- a method for cooling heat- generating components via a pumped loop system including a first branch having a first evaporator coupled to a first heat- generating component and a first valve upstream of the first evaporator, a second branch parallel to the first branch, the second branch having a second evaporator coupled to a second heat-generating component and a second valve upstream of the second evaporator, a pump upstream of the branches, and a condenser downstream of the branches.
- the method includes pumping fluid from the pump to the first and second branches, controlling the first and second valves via a controller to vary the flow of fluid to the first and second branches, and absorbing heat from the first and second heat-generating components via the evaporators.
- a pumped loop system for cooling heat-generating components includes first and second evaporators in parallel with one another, first and second valves upstream of the first and second evaporators respectively, a pump configured to pump fluid to the first and second evaporators, and a condenser downstream of the first and second circuits and upstream of the pump, the condenser configured to reject the heat absorbed by the first and second evaporators, wherein the first and second valves are controllable to vary the flow rate of fluid to the respective evaporator based on the heat load at the respective evaporator.
- Fig. 1 is a schematic view of an exemplary cooling system according to the invention
- Fig. 2 is a control diagram of the cooling system of Fig. 1 ;
- Fig. 3 is a schematic view of another exemplary cooling system according to the invention.
- Fig. 4 is a control diagram of the cooling system of Fig. 3;
- FIG. 5 is a schematic view of yet another exemplary cooling system according to the invention
- Fig. 6 is a control diagram of the cooling system of Fig. 5;
- Fig. 7 is a schematic view of still another exemplary cooling system according to the invention.
- Fig. 8 is a control diagram of the cooling system of Fig. 7;
- Fig. 9 is a schematic view of a further exemplary cooling system according to the invention.
- Fig. 10 is a control diagram of the cooling system of Fig. 9;
- Fig. 1 1 is a schematic view of another exemplary cooling system according to the invention.
- Fig. 12 is a control diagram of the cooling system of Fig. 1 1 ;
- Fig. 13 is a schematic view of yet another exemplary cooling system according to the invention.
- Fig. 14 is a control diagram of the cooling system of Fig. 13; Detailed Description
- a schematic representation of a pumped loop cooling system is illustrated generally at reference numeral 10.
- the pumped loop cooling system is provided to cool heat-generating components using a pumped fluid, such as a two-phase liquid refrigerant.
- the pumped loop cooling system includes at least two branches in parallel, and in the illustrated embodiment a plurality of branches 12a-12n in parallel. Each branch has a respective evaporator 14a-14n for absorbing heat from a respective heat-generating component having a variable heat load.
- the evaporators may be any suitable heat absorbing device, such as a coiled tube surrounding the heat-generating component, a cold plate touching the heat- generating component, a liquid to refrigerant heat exchanger, an air to refrigerant evaporator, etc.
- the liquid refrigerant is pumped to the evaporators'! 4a-14n by a pump 16 upstream of the evaporators. After absorbing heat from the heat-generating components, the refrigerant exits each evaporator 14a-14n, combines with the two-phase refrigerant from the other evaporators, and flows to a condenser 18 downstream of the evaporators'! 4a-14n and upstream of the pump 16 where the heat absorbed by the fluid is rejected and condensed back to a liquid.
- the fluid in the condenser 18 may be cooled in any suitable manner, such as by blowing air across the condenser 18 or flowing chilled water through the condenser 18.
- the fluid is then received in an accumulator 20 that delivers the fluid back to the pump 16.
- the accumulator 20 may act as a storage tank to compensate for varying volumes of the fluid in the system.
- the flow of the liquid refrigerant to the evaporators 14a-14n is varied by respective valves 22a-22n upstream of the evaporators.
- the valves may be any suitable valve, such as electronic stepper valves configured to variably control the flow of fluid to the respective evaporators 14a-14n.
- the valves 22a-22n have a plurality of positions from closed to fully open to adjust the flow rate through each branch 12a-12n to balance flow to the respective evaporators 14a- 14n based on the amount of flow need to cool the respective heat-generating component. Thereby, if one of the branches is not operating at full heat load, the flow to that branch can be reduced.
- the valves 22a-22n are controlled by at least one controller, and in the illustrated embodiment by a respective controller 24a-24n.
- the controllers 24a- 24n control the fluid flow through the respective branch 12a-12n based upon an input that is indicative of the amount of flow needed to cool the heat-generating component.
- the input may be determined based on one or more of the amount of electrical power being consumed by the heat-generating component, the temperature of the heat-generating component, the temperature of the heat- generating component as correlated to the amount of electrical power being consumed by the heat-generating component or to its percentage of the full load, the amount of heat being generated by the heat-generating component, etc.
- Factors other than the above described inputs may also affect the flow through the evaporators and thus can be communicated to the controllers 24a- 24n. These factors may include other valves within the circuit, pluggable rack configurations having varying evaporator design restrictions, etc. Based on the combination of factors, such as heat load and evaporator design, the controllers 24a-24n can determine whether the valves 22a-22n need to be adjusted.
- the pumped loop system 10 also may include a mechanical pressure differential valve 26 downstream of the pump 16 before the valves22a-22n.
- the mechanical pressure differential valve 26 allows the system to maintain a constant pressure upstream of the valves 22a-22n regardless of the varying heat load conditions at the branches 12a-12n.
- the mechanical pressure differential valve 26 includes an inlet that is connected to an outlet of the pump 16 and an outlet that is connected to the accumulator 20.
- the mechanical pressure differential valve 26 is spring biased to a closed position and is movable to an open position when the pressure differential between the pump outlet and pump inlet is a predetermined amount. For example, when the pump outlet is a predetermined amount greater than the pump inlet, such as when the heat load conditions at the branches 12a-12n is low, the pressure of the fluid exiting the pump moves the mechanical pressure differential valve 26 to the opened position. Thereby the flow from the pump that is not required by the branches 12a-12n flows to the accumulator 20.
- a filter 28 which may be any suitable filter, may be provided downstream of the pump to filter the fluid flowing from the pump 16 to the evaporators 14a-14n.
- a control diagram illustrating the control of the pumped loop system 10 is shown generally at reference numeral 50.
- a device exit quality setpoint from the evaporators 14a-14n is set, such as 70% vapor.
- the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating
- a pump pressure differential setpoint is set, which is the desired pressure of the pump of the system.
- the pump pressure differential setpoint is an opening pressure of the valve 26.
- the information from blocks 52-56 is fed into block 58, where the position of the valve is determined. Specifically, the device exit quality setpoint is compared to the device rejected power, and the comparison and the desired pump pressure flowing through the branches 12a- 12n is used to determine the valve position. If the device rejected power is low, to maintain the device exit quality, at block 60 the valve position can be maintained or at least partially closed, and then the valve position from block 60 is fed back into block 58.
- valve position can be maintained or at least partially opened, and then the valve position from block 60 is fed back into block 58. If the pressure in the system is greater than the pump pressure differential setpoint, the excess pressure would be dumped to the accumulator.
- the pumped loop cooling system 1 10 is substantially the same as the above-referenced pumped loop cooling system 10, and consequently the same reference numerals but indexed by 100 are used to denote structures corresponding to similar structures in the system.
- the foregoing description of the pumped loop cooling system 10 is equally applicable to the pumped loop cooling system 1 10 except as noted below.
- the pumped loop system 1 10 may include an electronic variable control valve 126 downstream of the pump 1 16 before the valves 122a-122n for maintaining a constant pressure upstream of the valves 122a-122n.
- the electronic variable control valve 126 allows the system to maintain a constant pressure upstream of the valves 122a- 122n regardless of the varying heat load conditions at the branches 1 12a-1 12n.
- the electronic variable control valve 126 includes an inlet that is connected to an outlet of the pump 1 16 and an outlet that is connected to the accumulator 120.
- the electronic variable control valve 126 is also connected to a suitable controller 130 that controls the valve 126 to increase or decrease the fluid flowing through the valve from the pump 1 16.
- the controller 130 controls the electronic variable control valve 126 based on pressure readings from pressure sensors 132 and 134 operatively coupled to the controller 130.
- the pressure sensors 132 and 134 are upstream and downstream of the pump 1 16, respectively for measuring the pressure at the inlet and outlet of the pump.
- the controller calculates the pressure differential between the inlet and outlet of the pump and opens or closes the electronic variable control valve 126 based upon the differential pressure.
- the controller is also operatively coupled to the pump 1 16 and may optionally vary the speed of the pump based on the differential pressure.
- the controller which is operatively coupled to the pump 1 16, may slow down the pump.
- the controller 130 controls the electronic variable control valve 126 to open for the fluid to flow to the accumulator 120. This may occur, for example, when the pump 1 16 is at a minimum idle speed but flow at the outlet is still higher than flow at the inlet.
- a control diagram illustrating the control of the pumped loop system 1 10 is shown generally at reference numeral 150.
- a device exit quality setpoint from the evaporators 1 14a-1 14n is set, such as 70% vapor.
- the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components.
- a pump pressure differential setpoint is set, which is the desired pressure of the pump of the system.
- the information from blocks 152-156 is fed into block 158, where the position of the valve is determined. Specifically, the device exit quality setpoint is compared to the device rejected power, and the comparison and the desired pump pressure flowing through the branches 12a-12n is used to determine the valve position.
- the valve position is maintained or at least partially closed, and then the valve position from block 160 is fed back into block 158. If the device rejected power is high, to maintain the device exit quality, at block 160 the valve position is maintained or at least partially opened, and then the valve position from block 160 is fed back into block 158.
- the pump inlet pressure and pump outlet pressure are measured, respectively.
- the inlet and outlet pressures are fed into block 166, which calculates the pressure differential.
- the pressure differential information is fed into block 168, along with the pump differential setpoint, and the pump speed is adjusted and/or excess pressure is dumped to the accumulator 120. Information from block 168 is then fed back into block 166.
- the pumped loop cooling system 210 is substantially the same as the above-referenced pumped loop cooling system 10, and consequently the same reference numerals but indexed by 200 are used to denote structures corresponding to similar structures in the system.
- the foregoing description of the pumped loop cooling system 10 is equally applicable to the pumped loop cooling system 210 except as noted below.
- the pumped loop cooling system 210 includes a common controller 240 coupled to the valves 222a-222n and the evaporators 214a-214n.
- the common controller 240 controls the position of each of the valves 222a-222n in a similar manner as the controllers 24a-24n control the valves 22a-22n.
- the common controller 240 may also be coupled to pressure sensors 232 and 234 that are upstream and downstream of the pump 216 respectively for measuring the pressure at the inlet and outlet of the pump.
- the information from the sensors 232 and 234, such as pressure differential, may be used in adjusting the valves 222a-222n.
- a control diagram illustrating the control of the pumped loop system 210 is shown generally at reference numeral 250.
- a device exit quality setpoint from the evaporators 214a-214n is set, such as 70% vapor.
- the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components.
- the pump inlet pressure and pump outlet pressure are measured, respectively.
- the inlet and outlet pressures are fed into block 266, which calculates the pressure differential.
- the information from blocks 252, 254, and 266 is fed into block 258 where the position of the valve is determined. Specifically, the device exit quality setpoint is compared to the device rejected power, and the comparison and the pump pressure differential is used to determine the valve position.
- the valve position is maintained or at least partially closed, and then the valve position from block 260 is fed back into block 258 and 266. If the device rejected power is high, to maintain the device exit quality, at block 260 the valve position is maintained or at least partially opened, and then the valve position from block 260 is fed back into block 258 and 266.
- the pumped loop cooling system 310 is substantially the same as the above-referenced pumped loop cooling system 1 10, and consequently the same reference numerals but indexed by 200 are used to denote structures corresponding to similar structures in the system.
- the foregoing description of the pumped loop cooling system 10 and 1 10 is equally applicable to the pumped loop cooling system 310 except as noted below.
- aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
- the pumped loop cooling system 310 includes a common controller 340 coupled to the valves 322a-322n and the evaporators 314a-314n.
- the common controller 340 controls the position of each of the valves 322a-322n in a similar manner as the controllers 124a-124n control the valves 122a-122n.
- the common controller 340 may also be coupled to the pressure sensors 332 and 334 that are upstream and downstream of the pump 1 16, respectively for measuring the pressure at the inlet and outlet of the pump.
- the information from the sensors 332 and 334, such as pressure differential, may be used in adjusting the valves 222a-222n and the valve 326.
- a control diagram illustrating the control of the pumped loop system 310 is shown generally at reference numeral 350.
- a device exit quality setpoint from the evaporators 314a-314n is set, such as 70% vapor.
- the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components.
- the pump inlet pressure and pump outlet pressure are measured, respectively.
- the inlet and outlet pressures are fed into block 366, which calculates the pressure differential.
- the information from blocks 352, 354, and 366 is fed into block 358 where the position of the valve is determined. Specifically, the pressure differential and a comparison of the device exit quality setpoint and the device rejected power are used to open/close the valves 322a-322n.
- the valve position is maintained or at least partially closed. If the device rejected power is high, to maintain the device exit quality, at block 360 the valve is maintained or at least partially opened.
- the information from block 360 is then fed into block 370 where the pump differential pressure is calculated again, and then the information from block 370 is fed into block 368 along with the pump differential setpoint from block 356.
- the pump speed is adjusted and/or excess pressure is dumped to the accumulator 320, and then information from block 368 is then fed back into block 366.
- the pumped loop cooling system 410 is substantially the same as the above-referenced pumped loop cooling system 310, and consequently the same reference numerals but indexed by 100 are used to denote structures corresponding to similar structures in the system.
- the foregoing description of the pumped loop cooling systems 10 and 310 is equally applicable to the pumped loop cooling system 410 except as noted below.
- aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
- the pumped loop cooling system 410 include a pressure sensor 442 that is upstream of the valves 422a-422n and downstream of the pump 416, and a pressure sensor 444 that is downstream of the evaporators 414a-414n and upstream of the condenser 418.
- the pressure sensors 442 and 444 are coupled to the common controller 440 and are configured to measure the pressure of the fluid at a common manifold before the fluid reaches the valves 422a-422n and at a common manifold after the fluid has absorbed the heat from the heat-generating devices.
- the valves 422a-422n are adjusted as discussed above regarding Fig.
- the pressure from the pump outlet may not remain constant upstream of the valves 422a-422n, for example when components upstream of the valves change the pressure of the fluid.
- the pressure from the pressure sensors 442 and 444 is fed to the common controller 440 and the controller 400 adjusts the valves 422a-422n based on the pressure in addition to the above described inputs.
- a control diagram illustrating the control of the pumped loop system 410 is shown generally at reference numeral 450.
- a device exit quality setpoint from the evaporators 414a-414n is set, such as 70% vapor.
- the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components.
- the inlet and outlet manifold pressure is measured, which is the pressure measured by pressure sensors 442 and 444.
- the inlet and outlet manifold pressures are fed into block 476, which calculates the pressure differential.
- the information from blocks 452, 454, and 476 is fed into block 458 where the position of the valve is determined. Specifically, the pressure differential and a comparison of the device exit quality setpoint and the device rejected power are used to open/close the valves 422a-422n.
- the valve position is maintained or at least partially closed. If the device rejected power is high, to maintain the device exit quality, at block 460 the valve is maintained or at least partially opened.
- the pump inlet pressure and pump outlet pressure are measured, respectively, such as by pressure sensors 432 and 434.
- the inlet and outlet pressures are fed into block 466, which calculates the pressure differential.
- the information from block 466 is then fed into block 470, where the pump differential pressure is calculated again, and then the information from block 470 is fed into block 468 along with the pump differential setpoint from block 456.
- the pump speed is adjusted and/or excess pressure is dumped to the accumulator 420, and then information from block 468 is then fed back into block 476.
- the pumped loop cooling system 510 is substantially the same as the above-referenced pumped loop cooling system 10, and consequently the same reference numerals but indexed by 500 are used to denote structures corresponding to similar structures in the system.
- the foregoing description of the pumped loop cooling systems 10 is equally applicable to the pumped loop cooling system 510 except as noted below.
- the pumped loop cooling system 510 includes respective sensors 546a-546n downstream of the respective evaporators 514a- 514n.
- the sensor may be any suitable sensor, such as a sensor configured to monitor a percent of vapor in the fluid output from the evaporators utilizing, for example, one or more optical, ultrasonic, temperature or pressure sensors.
- the sensors 546a-546n are coupled to the respective controllers 524a-524n and configured to sense a characteristic of the fluid flow through the respective branches 512a-512n, such as an amount of vapor in the fluid flow, and communicate the characteristics to the respective controllers 524a-524n to adjust the valves based on a feedback loop to increase or decrease the fluid flow through the respective branches 512a-512n.
- the respective controller 524a-524n controls the respective valve 522a-522n to open a predetermined amount to allow for more flow through the respective evaporator 514a-514n. If the amount of vapor is less than a predetermined amount, the respective controller 524a-524n controls the respective valve 522a-522n to close a predetermined amount to allow for less flow through the respective evaporator 514a-514n.
- a control diagram illustrating the control of the pumped loop system 510 is shown generally at reference numeral 550.
- a device exit quality setpoint from the evaporators 514a-514n is set, such as 70% vapor.
- the device exit quality from the sensors 546a-546n is provided.
- the information from blocks 552 and 554 is fed into block 558, where the device exit quality setpoint is compared to the device exit quality and the position of the valve is determined. If the device exit quality is higher than the device exit quality setpoint, at block 560 the valve is at least partially opened, and then the valve position from block 560 is fed back into block 558. If the device exit quality is lower than the device exit quality setpoint, at block 560 the valve is at least partially closed, and then the valve position from block 560 is fed back into block 558.
- the pumped loop cooling system 610 is substantially the same as the above-referenced pumped loop cooling system 510, and consequently the same reference numerals but indexed by 100 are used to denote structures corresponding to similar structures in the system.
- the foregoing description of the pumped loop cooling systems 1 10 and 510 are equally applicable to the pumped loop cooling system 610 except as noted below.
- aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
- the pumped loop system 610 includes an electronic variable control valve 626, similar to the electronic control valve 126, downstream of the pump 616 and upstream of the valves 622a-622n for maintaining a constant pressure upstream of the valves 622a-622n.
- a control diagram illustrating the control of the pumped loop system 610 is shown generally at reference numeral 650.
- a device exit quality setpoint from the evaporators 514a-514n is set, such as 70% vapor.
- the device exit quality from the sensors 546a-546n is provided.
- the information from blocks 652 and 654 is fed into block 658, where the device exit quality setpoint is compared to the device exit quality and the position of the valve is determined. If the device exit quality is higher than the device exit quality setpoint, at block 660 the valve is at least partially opened, and then the valve position from block 660 is fed back into block 658. If the device exit quality is lower than the device exit quality setpoint, at block 660 the valve is at least partially closed, and then the valve position from block 660 is fed back into block 658.
- a pump pressure differential setpoint is set, which is the desired pressure of the pump of the system.
- the pump inlet pressure and pump outlet pressure are measured, respectively.
- the inlet and outlet pressures are fed into block 666, which calculates the pressure differential.
- the pressure differential information is fed into block 668, along with the pump differential setpoint, and the pump speed is adjusted and/or excess pressure is dumped to the accumulator 620. Information from block 668 is then fed back into block 666.
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Abstract
Provided is a pumped loop system (10) for cooling a heat-generating components without relying on a maximum heat load, the system including first and second evaporators (14a-14n) in parallel with one another and first and second valves (22a-22n) upstream of the first and second evaporators respectively, wherein the valves (22a-22n) are controllable to vary the flow rate of fluid to the respective evaporator (14a-14n) based on the amount of flow needed to control the respective heat-generating component. By cooling the heat-generating components without relying on the maximum heat load, adequate flow may be provided to an evaporator operating under a high heat low while reduced flow is provided to an evaporator operating under a low head load.
Description
PARALLEL EVAPORATOR CIRCUIT WITH BALANCED FLOW
Related Applications
This application claims the benefit of U.S. Provisional Application No. 61/586,863 filed January 16, 2012, which is hereby incorporated herein by reference.
Field of Invention
The present invention relates generally to liquid cooling systems, and more particularly to pumped liquid cooling systems having parallel evaporator circuits.
Background
Electronic devices, such as computer servers, generate heat during operation, and therefore a cooling system is used to cool the electronic devices. For example, air may be blown over the electronic devices or a water-based fluid may be circulated through a heat exchanger coupled to the electronic devices to cool the devices.
In a data center that houses racks of servers, the amount of air or water- based fluid required for heating may vary from rack to rack. The varied heat may arise from some racks having a greater density of electronic equipment or electric equipment operating at higher levels.
Summary of Invention
The present invention provides a pumped loop system for cooling a heat- generating components without relying on a maximum heat load, the system including first and second evaporators in parallel with one another and first and second valves upstream of the first and second evaporators respectively, wherein the valves are controllable to vary the flow rate of fluid to the respective evaporator based on the amount of flow needed to control the respective heat- generating component. By cooling the heat-generating components without relying on the maximum heat load, adequate flow may be provided to an
evaporator operating under a high heat low while reduced flow is provided to an evaporator operating under a low head load.
According to one aspect of the invention, a pumped loop system for cooling heat-generating components is provided including a first branch having a first evaporator for absorbing heat from a first heat-generating component having a variable heat load and a first valve upstream of the first evaporator for variably controlling the flow of fluid to the first branch, a second branch parallel to the first branch, the second branch having a second evaporator for absorbing heat from a second heat-generating component having a variable heat load and a second valve upstream of the second evaporator for variably controlling the flow of fluid to the second branch, a pump for pumping fluid to the first and second branches, and a condenser downstream of the first and second circuits and upstream of the pump for rejecting the heat absorbed by the fluid in the first and second branches.
The first and second valves are electronic stepper valves.
The system further includes at least one controller configured to control at least one of the first valve and the second valve.
The at least one controller controls fluid flow through the respective branch based upon an input that is indicative of the amount of flow needed to cool the heat-generating component.
The input is one or more of (i) the amount of electrical power being consumed by the heat-generating component; (ii) the temperature of the heat- generating component; (iii) the temperature of the heat-generating component as correlated to the amount of electrical power being consumed by the heat- generating component; and/or (iv) the amount of heat being generated by the heat-generating component.
The system further includes a sensor downstream of the first evaporator and a sensor downstream of the second evaporator, wherein the sensors sense a characteristic of the fluid flow through the first and second branches
respectively and communicate the characteristics to the controller to increase or decrease the fluid flow through the respective branches.
The characteristic is an amount of vapor in the fluid flow.
According to another aspect of the invention, a method for cooling heat- generating components via a pumped loop system is provided, the system including a first branch having a first evaporator coupled to a first heat- generating component and a first valve upstream of the first evaporator, a second branch parallel to the first branch, the second branch having a second evaporator coupled to a second heat-generating component and a second valve upstream of the second evaporator, a pump upstream of the branches, and a condenser downstream of the branches. The method includes pumping fluid from the pump to the first and second branches, controlling the first and second valves via a controller to vary the flow of fluid to the first and second branches, and absorbing heat from the first and second heat-generating components via the evaporators.
According to still another aspect of the invention, a pumped loop system for cooling heat-generating components includes first and second evaporators in parallel with one another, first and second valves upstream of the first and second evaporators respectively, a pump configured to pump fluid to the first and second evaporators, and a condenser downstream of the first and second circuits and upstream of the pump, the condenser configured to reject the heat absorbed by the first and second evaporators, wherein the first and second valves are controllable to vary the flow rate of fluid to the respective evaporator based on the heat load at the respective evaporator.
The foregoing and other features of the invention are hereinafter described in greater detail with reference to the accompanying drawings. Brief Description of the Drawings
Fig. 1 is a schematic view of an exemplary cooling system according to the invention;
Fig. 2 is a control diagram of the cooling system of Fig. 1 ;
Fig. 3 is a schematic view of another exemplary cooling system according to the invention;
Fig. 4 is a control diagram of the cooling system of Fig. 3;
Fig. 5 is a schematic view of yet another exemplary cooling system according to the invention;
Fig. 6 is a control diagram of the cooling system of Fig. 5;
Fig. 7 is a schematic view of still another exemplary cooling system according to the invention;
Fig. 8 is a control diagram of the cooling system of Fig. 7;
Fig. 9 is a schematic view of a further exemplary cooling system according to the invention;
Fig. 10 is a control diagram of the cooling system of Fig. 9;
Fig. 1 1 is a schematic view of another exemplary cooling system according to the invention;
Fig. 12 is a control diagram of the cooling system of Fig. 1 1 ;
Fig. 13 is a schematic view of yet another exemplary cooling system according to the invention; and
Fig. 14 is a control diagram of the cooling system of Fig. 13; Detailed Description
The principles of the present application have particular application to systems and methods for cooling heat-generating components such as racks of servers in data centers, and thus will be described below chiefly in this context. It will of course be appreciated, and also understood, that the principles of the invention may be useful in other cooling applications, such as cooling industrial equipment having a plurality of parallel drives.
Turning now in detail to the drawings and initially to Fig. 1 , a schematic representation of a pumped loop cooling system is illustrated generally at reference numeral 10. The pumped loop cooling system is provided to cool heat-generating components using a pumped fluid, such as a two-phase liquid refrigerant. When more than one heat-generating component is provided to be cooled, the pumped loop cooling system includes at least two branches in parallel, and in the illustrated embodiment a plurality of branches 12a-12n in parallel. Each branch has a respective evaporator 14a-14n for absorbing heat from a respective heat-generating component having a variable heat load. The evaporators may be any suitable heat absorbing device, such as a coiled tube surrounding the heat-generating component, a cold plate touching the heat-
generating component, a liquid to refrigerant heat exchanger, an air to refrigerant evaporator, etc.
The liquid refrigerant is pumped to the evaporators'! 4a-14n by a pump 16 upstream of the evaporators. After absorbing heat from the heat-generating components, the refrigerant exits each evaporator 14a-14n, combines with the two-phase refrigerant from the other evaporators, and flows to a condenser 18 downstream of the evaporators'! 4a-14n and upstream of the pump 16 where the heat absorbed by the fluid is rejected and condensed back to a liquid. The fluid in the condenser 18 may be cooled in any suitable manner, such as by blowing air across the condenser 18 or flowing chilled water through the condenser 18. The fluid is then received in an accumulator 20 that delivers the fluid back to the pump 16. The accumulator 20 may act as a storage tank to compensate for varying volumes of the fluid in the system.
The flow of the liquid refrigerant to the evaporators 14a-14n is varied by respective valves 22a-22n upstream of the evaporators. The valves may be any suitable valve, such as electronic stepper valves configured to variably control the flow of fluid to the respective evaporators 14a-14n. The valves 22a-22n have a plurality of positions from closed to fully open to adjust the flow rate through each branch 12a-12n to balance flow to the respective evaporators 14a- 14n based on the amount of flow need to cool the respective heat-generating component. Thereby, if one of the branches is not operating at full heat load, the flow to that branch can be reduced.
The valves 22a-22n are controlled by at least one controller, and in the illustrated embodiment by a respective controller 24a-24n. The controllers 24a- 24n control the fluid flow through the respective branch 12a-12n based upon an input that is indicative of the amount of flow needed to cool the heat-generating component. The input may be determined based on one or more of the amount of electrical power being consumed by the heat-generating component, the temperature of the heat-generating component, the temperature of the heat- generating component as correlated to the amount of electrical power being consumed by the heat-generating component or to its percentage of the full load, the amount of heat being generated by the heat-generating component, etc.
By cooling the heat-generating components without relying on the maximum heat load, adequate flow may be provided to a branch operating under a high heat low while reduced flow is provided to a branch operating under a low head load. During such an operation, the pump does not have to be operated constantly at full flow, thereby reducing energy usage, operating costs, and pump wear.
Factors other than the above described inputs may also affect the flow through the evaporators and thus can be communicated to the controllers 24a- 24n. These factors may include other valves within the circuit, pluggable rack configurations having varying evaporator design restrictions, etc. Based on the combination of factors, such as heat load and evaporator design, the controllers 24a-24n can determine whether the valves 22a-22n need to be adjusted.
To assist in flow balancing, the pumped loop system 10 also may include a mechanical pressure differential valve 26 downstream of the pump 16 before the valves22a-22n. The mechanical pressure differential valve 26 allows the system to maintain a constant pressure upstream of the valves 22a-22n regardless of the varying heat load conditions at the branches 12a-12n.
The mechanical pressure differential valve 26 includes an inlet that is connected to an outlet of the pump 16 and an outlet that is connected to the accumulator 20. The mechanical pressure differential valve 26 is spring biased to a closed position and is movable to an open position when the pressure differential between the pump outlet and pump inlet is a predetermined amount. For example, when the pump outlet is a predetermined amount greater than the pump inlet, such as when the heat load conditions at the branches 12a-12n is low, the pressure of the fluid exiting the pump moves the mechanical pressure differential valve 26 to the opened position. Thereby the flow from the pump that is not required by the branches 12a-12n flows to the accumulator 20. A filter 28, which may be any suitable filter, may be provided downstream of the pump to filter the fluid flowing from the pump 16 to the evaporators 14a-14n.
Turning now to Fig. 2, a control diagram illustrating the control of the pumped loop system 10 is shown generally at reference numeral 50. At block 52, a device exit quality setpoint from the evaporators 14a-14n is set, such as 70% vapor. At block 54, the device rejected power is provided, which is for
example, the amount of power being rejected from the heat-generating
components. At block 56 a pump pressure differential setpoint is set, which is the desired pressure of the pump of the system. In the system 10 having the mechanical pressure differential value 26, the pump pressure differential setpoint is an opening pressure of the valve 26. The information from blocks 52-56 is fed into block 58, where the position of the valve is determined. Specifically, the device exit quality setpoint is compared to the device rejected power, and the comparison and the desired pump pressure flowing through the branches 12a- 12n is used to determine the valve position. If the device rejected power is low, to maintain the device exit quality, at block 60 the valve position can be maintained or at least partially closed, and then the valve position from block 60 is fed back into block 58. If the device rejected power is high, to maintain the device exit quality, at block 60 the valve position can be maintained or at least partially opened, and then the valve position from block 60 is fed back into block 58. If the pressure in the system is greater than the pump pressure differential setpoint, the excess pressure would be dumped to the accumulator.
Turning now to Figs. 3 and 4, an exemplary embodiment of the pumped loop cooling system is shown at 1 10. The pumped loop cooling system 1 10 is substantially the same as the above-referenced pumped loop cooling system 10, and consequently the same reference numerals but indexed by 100 are used to denote structures corresponding to similar structures in the system. In addition, the foregoing description of the pumped loop cooling system 10 is equally applicable to the pumped loop cooling system 1 10 except as noted below.
Moreover, it will be appreciated upon reading and understanding the
specification that aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
Referring now to Fig. 3, to assist in flow balancing, the pumped loop system 1 10 may include an electronic variable control valve 126 downstream of the pump 1 16 before the valves 122a-122n for maintaining a constant pressure upstream of the valves 122a-122n. The electronic variable control valve 126 allows the system to maintain a constant pressure upstream of the valves 122a- 122n regardless of the varying heat load conditions at the branches 1 12a-1 12n.
The electronic variable control valve 126 includes an inlet that is connected to an outlet of the pump 1 16 and an outlet that is connected to the accumulator 120. The electronic variable control valve 126 is also connected to a suitable controller 130 that controls the valve 126 to increase or decrease the fluid flowing through the valve from the pump 1 16. The controller 130 controls the electronic variable control valve 126 based on pressure readings from pressure sensors 132 and 134 operatively coupled to the controller 130. The pressure sensors 132 and 134 are upstream and downstream of the pump 1 16, respectively for measuring the pressure at the inlet and outlet of the pump. The controller calculates the pressure differential between the inlet and outlet of the pump and opens or closes the electronic variable control valve 126 based upon the differential pressure. The controller is also operatively coupled to the pump 1 16 and may optionally vary the speed of the pump based on the differential pressure.
If the difference in pressure reading measured by the pressure sensors
134 and 132 respectively is greater than the required setpoint, the controller, which is operatively coupled to the pump 1 16, may slow down the pump.
Additionally or alternatively, if the difference in pressure measured by the pressure sensors 134 and 132 respectively is greater than the required setpoint, the controller 130 controls the electronic variable control valve 126 to open for the fluid to flow to the accumulator 120. This may occur, for example, when the pump 1 16 is at a minimum idle speed but flow at the outlet is still higher than flow at the inlet.
Turning now to Fig. 4, a control diagram illustrating the control of the pumped loop system 1 10 is shown generally at reference numeral 150. At block 152, a device exit quality setpoint from the evaporators 1 14a-1 14n is set, such as 70% vapor. At block 154, the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components. At block 156 a pump pressure differential setpoint is set, which is the desired pressure of the pump of the system. The information from blocks 152-156 is fed into block 158, where the position of the valve is determined. Specifically, the device exit quality setpoint is compared to the device rejected
power, and the comparison and the desired pump pressure flowing through the branches 12a-12n is used to determine the valve position.
If the device rejected power is low, to maintain the device exit quality, at block 160 the valve position is maintained or at least partially closed, and then the valve position from block 160 is fed back into block 158. If the device rejected power is high, to maintain the device exit quality, at block 160 the valve position is maintained or at least partially opened, and then the valve position from block 160 is fed back into block 158. At blocks 162 and 164, the pump inlet pressure and pump outlet pressure are measured, respectively. The inlet and outlet pressures are fed into block 166, which calculates the pressure differential. The pressure differential information is fed into block 168, along with the pump differential setpoint, and the pump speed is adjusted and/or excess pressure is dumped to the accumulator 120. Information from block 168 is then fed back into block 166.
Turning now to Figs. 5 and 6, an exemplary embodiment of the pumped loop cooling system is shown at 210. The pumped loop cooling system 210 is substantially the same as the above-referenced pumped loop cooling system 10, and consequently the same reference numerals but indexed by 200 are used to denote structures corresponding to similar structures in the system. In addition, the foregoing description of the pumped loop cooling system 10 is equally applicable to the pumped loop cooling system 210 except as noted below.
Moreover, it will be appreciated upon reading and understanding the
specification that aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
Referring now to Fig. 5, the pumped loop cooling system 210 includes a common controller 240 coupled to the valves 222a-222n and the evaporators 214a-214n. The common controller 240 controls the position of each of the valves 222a-222n in a similar manner as the controllers 24a-24n control the valves 22a-22n. The common controller 240 may also be coupled to pressure sensors 232 and 234 that are upstream and downstream of the pump 216 respectively for measuring the pressure at the inlet and outlet of the pump. The information from the sensors 232 and 234, such as pressure differential, may be used in adjusting the valves 222a-222n.
Turning now to Fig. 6, a control diagram illustrating the control of the pumped loop system 210 is shown generally at reference numeral 250. At block 252, a device exit quality setpoint from the evaporators 214a-214n is set, such as 70% vapor. At block 254, the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components. At blocks 262 and 264, the pump inlet pressure and pump outlet pressure are measured, respectively. The inlet and outlet pressures are fed into block 266, which calculates the pressure differential. The information from blocks 252, 254, and 266 is fed into block 258 where the position of the valve is determined. Specifically, the device exit quality setpoint is compared to the device rejected power, and the comparison and the pump pressure differential is used to determine the valve position.
If the device rejected power is low, to maintain the device exit quality, at block 260 the valve position is maintained or at least partially closed, and then the valve position from block 260 is fed back into block 258 and 266. If the device rejected power is high, to maintain the device exit quality, at block 260 the valve position is maintained or at least partially opened, and then the valve position from block 260 is fed back into block 258 and 266.
Turning now to Figs. 7 and 8, an exemplary embodiment of the pumped loop cooling system is shown at 310. The pumped loop cooling system 310 is substantially the same as the above-referenced pumped loop cooling system 1 10, and consequently the same reference numerals but indexed by 200 are used to denote structures corresponding to similar structures in the system. In addition, the foregoing description of the pumped loop cooling system 10 and 1 10 is equally applicable to the pumped loop cooling system 310 except as noted below. Moreover, it will be appreciated upon reading and understanding the specification that aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
Referring now to Fig. 7, the pumped loop cooling system 310 includes a common controller 340 coupled to the valves 322a-322n and the evaporators 314a-314n. The common controller 340 controls the position of each of the valves 322a-322n in a similar manner as the controllers 124a-124n control the valves 122a-122n. The common controller 340 may also be coupled to the
pressure sensors 332 and 334 that are upstream and downstream of the pump 1 16, respectively for measuring the pressure at the inlet and outlet of the pump. The information from the sensors 332 and 334, such as pressure differential, may be used in adjusting the valves 222a-222n and the valve 326.
Turning now to Fig. 8, a control diagram illustrating the control of the pumped loop system 310 is shown generally at reference numeral 350. At block 352, a device exit quality setpoint from the evaporators 314a-314n is set, such as 70% vapor. At block 354, the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components. At blocks 362 and 364, the pump inlet pressure and pump outlet pressure are measured, respectively. The inlet and outlet pressures are fed into block 366, which calculates the pressure differential. The information from blocks 352, 354, and 366 is fed into block 358 where the position of the valve is determined. Specifically, the pressure differential and a comparison of the device exit quality setpoint and the device rejected power are used to open/close the valves 322a-322n.
If the device rejected power is low, to maintain the device exit quality, at block 360 the valve position is maintained or at least partially closed. If the device rejected power is high, to maintain the device exit quality, at block 360 the valve is maintained or at least partially opened. The information from block 360 is then fed into block 370 where the pump differential pressure is calculated again, and then the information from block 370 is fed into block 368 along with the pump differential setpoint from block 356. At block 368 the pump speed is adjusted and/or excess pressure is dumped to the accumulator 320, and then information from block 368 is then fed back into block 366.
Turning now to Figs. 9 and 10, an exemplary embodiment of the pumped loop cooling system is shown at 410. The pumped loop cooling system 410 is substantially the same as the above-referenced pumped loop cooling system 310, and consequently the same reference numerals but indexed by 100 are used to denote structures corresponding to similar structures in the system. In addition, the foregoing description of the pumped loop cooling systems 10 and 310 is equally applicable to the pumped loop cooling system 410 except as noted below. Moreover, it will be appreciated upon reading and understanding
the specification that aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
Referring now to Fig. 9, the pumped loop cooling system 410 include a pressure sensor 442 that is upstream of the valves 422a-422n and downstream of the pump 416, and a pressure sensor 444 that is downstream of the evaporators 414a-414n and upstream of the condenser 418. The pressure sensors 442 and 444 are coupled to the common controller 440 and are configured to measure the pressure of the fluid at a common manifold before the fluid reaches the valves 422a-422n and at a common manifold after the fluid has absorbed the heat from the heat-generating devices. The valves 422a-422n are adjusted as discussed above regarding Fig. 1 , and may be further adjusted based on an available pressure differential from the manifolds calculated by the controller 240. For example, the pressure from the pump outlet may not remain constant upstream of the valves 422a-422n, for example when components upstream of the valves change the pressure of the fluid. To ensure that the valves are open/closed sufficient amounts to maintain cooling, the pressure from the pressure sensors 442 and 444 is fed to the common controller 440 and the controller 400 adjusts the valves 422a-422n based on the pressure in addition to the above described inputs.
Turning now to Fig. 10, a control diagram illustrating the control of the pumped loop system 410 is shown generally at reference numeral 450. At block 452, a device exit quality setpoint from the evaporators 414a-414n is set, such as 70% vapor. At block 454, the device rejected power is provided, which is for example, the amount of power being rejected from the heat-generating components. At blocks 472 and 474, the inlet and outlet manifold pressure is measured, which is the pressure measured by pressure sensors 442 and 444. The inlet and outlet manifold pressures are fed into block 476, which calculates the pressure differential. The information from blocks 452, 454, and 476 is fed into block 458 where the position of the valve is determined. Specifically, the pressure differential and a comparison of the device exit quality setpoint and the device rejected power are used to open/close the valves 422a-422n.
If the device rejected power is low, to maintain the device exit quality, at block 460 the valve position is maintained or at least partially closed. If the
device rejected power is high, to maintain the device exit quality, at block 460 the valve is maintained or at least partially opened. At blocks 462 and 464, the pump inlet pressure and pump outlet pressure are measured, respectively, such as by pressure sensors 432 and 434. The inlet and outlet pressures are fed into block 466, which calculates the pressure differential. The information from block 466 is then fed into block 470, where the pump differential pressure is calculated again, and then the information from block 470 is fed into block 468 along with the pump differential setpoint from block 456. At block 468 the pump speed is adjusted and/or excess pressure is dumped to the accumulator 420, and then information from block 468 is then fed back into block 476.
Turning now to Figs. 1 1 and 12, an exemplary embodiment of the pumped loop cooling system is shown at 510. The pumped loop cooling system 510 is substantially the same as the above-referenced pumped loop cooling system 10, and consequently the same reference numerals but indexed by 500 are used to denote structures corresponding to similar structures in the system. In addition, the foregoing description of the pumped loop cooling systems 10 is equally applicable to the pumped loop cooling system 510 except as noted below.
Moreover, it will be appreciated upon reading and understanding the
specification that aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
Referring now to Fig. 1 1 , the pumped loop cooling system 510 includes respective sensors 546a-546n downstream of the respective evaporators 514a- 514n. The sensor may be any suitable sensor, such as a sensor configured to monitor a percent of vapor in the fluid output from the evaporators utilizing, for example, one or more optical, ultrasonic, temperature or pressure sensors. The sensors 546a-546n are coupled to the respective controllers 524a-524n and configured to sense a characteristic of the fluid flow through the respective branches 512a-512n, such as an amount of vapor in the fluid flow, and communicate the characteristics to the respective controllers 524a-524n to adjust the valves based on a feedback loop to increase or decrease the fluid flow through the respective branches 512a-512n.
If the amount of vapor in a branch 512a-512n is greater than a
predetermined amount, the respective controller 524a-524n controls the
respective valve 522a-522n to open a predetermined amount to allow for more flow through the respective evaporator 514a-514n. If the amount of vapor is less than a predetermined amount, the respective controller 524a-524n controls the respective valve 522a-522n to close a predetermined amount to allow for less flow through the respective evaporator 514a-514n.
Turning now to Fig. 12, a control diagram illustrating the control of the pumped loop system 510 is shown generally at reference numeral 550. At block 552, a device exit quality setpoint from the evaporators 514a-514n is set, such as 70% vapor. At block 554, the device exit quality from the sensors 546a-546n is provided. The information from blocks 552 and 554 is fed into block 558, where the device exit quality setpoint is compared to the device exit quality and the position of the valve is determined. If the device exit quality is higher than the device exit quality setpoint, at block 560 the valve is at least partially opened, and then the valve position from block 560 is fed back into block 558. If the device exit quality is lower than the device exit quality setpoint, at block 560 the valve is at least partially closed, and then the valve position from block 560 is fed back into block 558.
Turning now to Figs. 13 and 14, an exemplary embodiment of the pumped loop cooling system is shown at 610. The pumped loop cooling system 610 is substantially the same as the above-referenced pumped loop cooling system 510, and consequently the same reference numerals but indexed by 100 are used to denote structures corresponding to similar structures in the system. In addition, the foregoing description of the pumped loop cooling systems 1 10 and 510 are equally applicable to the pumped loop cooling system 610 except as noted below. Moreover, it will be appreciated upon reading and understanding the specification that aspects of the systems may be substituted for one another or used in conjunction with one another where applicable.
Referring now to Fig. 13, to assist in flow balancing, the pumped loop system 610 includes an electronic variable control valve 626, similar to the electronic control valve 126, downstream of the pump 616 and upstream of the valves 622a-622n for maintaining a constant pressure upstream of the valves 622a-622n.
Turning now to Fig. 14, a control diagram illustrating the control of the pumped loop system 610 is shown generally at reference numeral 650. At block 652, a device exit quality setpoint from the evaporators 514a-514n is set, such as 70% vapor. At block 654, the device exit quality from the sensors 546a-546n is provided. The information from blocks 652 and 654 is fed into block 658, where the device exit quality setpoint is compared to the device exit quality and the position of the valve is determined. If the device exit quality is higher than the device exit quality setpoint, at block 660 the valve is at least partially opened, and then the valve position from block 660 is fed back into block 658. If the device exit quality is lower than the device exit quality setpoint, at block 660 the valve is at least partially closed, and then the valve position from block 660 is fed back into block 658.
At block 656 a pump pressure differential setpoint is set, which is the desired pressure of the pump of the system. At blocks 662 and 664, the pump inlet pressure and pump outlet pressure are measured, respectively. The inlet and outlet pressures are fed into block 666, which calculates the pressure differential. The pressure differential information is fed into block 668, along with the pump differential setpoint, and the pump speed is adjusted and/or excess pressure is dumped to the accumulator 620. Information from block 668 is then fed back into block 666.
Although the invention has been shown and described with respect to a certain embodiment or embodiments, it is obvious that equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In particular regard to the various functions performed by the above described elements (components, assemblies, devices, compositions, etc.), the terms (including a reference to a "means") used to describe such elements are intended to correspond, unless otherwise indicated, to any element which performs the specified function of the described element (i.e., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary embodiment or embodiments of the invention. In addition, while a particular feature of the invention may have been described above with respect to only one or more of several illustrated
embodiments, such feature may be combined with one or more other features of the other embodiments, as may be desired and advantageous for any given or particular application.
Claims
What is claimed is: 1 . A pumped loop system for cooling heat-generating components including:
a first branch having a first evaporator for absorbing heat from a first heat-generating component having a variable heat load and a first valve upstream of the first evaporator for variably controlling the flow of fluid to the first branch;
a second branch parallel to the first branch, the second branch having a second evaporator for absorbing heat from a second heat-generating component having a variable heat load and a second valve upstream of the second evaporator for variably controlling the flow of fluid to the second branch;
a pump for pumping fluid to the first and second branches; and a condenser downstream of the first and second circuits and upstream of the pump for rejecting the heat absorbed by the fluid in the first and second branches.
2. The pumped loop system according to claim 1 , wherein the first and second valves are electronic stepper valves.
3. The pumped loop system according to claim 1 or 2, further including at least one controller configured to control at least one of the first valve and the second valve.
4. The pumped loop system according to claim 3, wherein the at least one controller comprises a first and second controller for controlling the first and second valves, respectively.
5. The pumped loop system according to claim 3, wherein the at least one controller comprises a single controller for controlling the first and second valves.
6. The pumped loop system according to any one of claims 3-5, wherein the at least one controller controls fluid flow through the respective branch based upon an input that is indicative of the amount of flow needed to cool the heat-generating component.
7. The pumped loop system of claim 6, wherein the input is one or more of the following:
(i) the amount of electrical power being consumed by the heat- generating component;
(ii) the temperature of the heat-generating component;
(iii) the temperature of the heat-generating component as correlated to the amount of electrical power being consumed by the heat-generating component; and/or
(iv) the amount of heat being generated by the heat-generating component.
8. The pumped loop system according to any one of claims 3-5, further including a sensor downstream of the first evaporator and a sensor downstream of the second evaporator, wherein the sensors sense a characteristic of the fluid flow through the first and second branches respectively and communicate the characteristics to the controller to increase or decrease the fluid flow through the respective branches.
9. The pumped loop system according to claim 8, wherein the characteristic is an amount of vapor in the fluid flow.
10. The pumped loop system according to claim 9, wherein if the amount of vapor is greater than a predetermined amount, the controller controls the valve to open a predetermined amount to allow for more flow through the evaporator and if the amount of vapor is less than a
predetermined amount, the controller controls the valve to close a
predetermined amount to allow for less flow through the evaporator.
1 1 . The pumped loop system according to any preceding claim, further including a mechanical pressure differential valve downstream of the pump and upstream of the first and second valves for maintaining a constant pressure upstream of the first valve and the second valve.
12. The pumped loop system according to any preceding claim, further including an electronic variable control valve downstream of the pump and upstream of the first and second valves for maintaining a constant pressure upstream of the first valve and the second valve.
13. The pumped loop system according to claim 12, further including a pressure sensor upstream of the pump and a pressure sensor downstream of the pump for measuring pressure at an inlet and outlet of the pump respectively, wherein the pressure sensors are operatively coupled to a controller configured to calculate a differential pressure and configured to control the electronic variable control valve to open or close based upon the differential pressure.
14. The pumped loop system according to any preceding claim, further including an accumulator that receives fluid from the condenser and delivers the fluid to the pump.
15 The pumped loop system according to any preceding claim in combination with the first and second heat-generating components.
16. The combination according to claim 15, wherein the heat- generating component are in contact with the respective evaporators.
17. A method for cooling heat-generating components via a pumped loop system including a first branch having a first evaporator coupled to a first heat-generating component and a first valve upstream of the first evaporator, a second branch parallel to the first branch, the second branch having a second evaporator coupled to a second heat-generating component and a second valve upstream of the second evaporator, a pump upstream of the branches, and a condenser downstream of the branches, the method including:
pumping fluid from the pump to the first and second branches;
controlling the first and second valves via a controller to vary the flow of fluid to the first and second branches;
absorbing heat from the first and second heat-generating components via the evaporators.
18. The method according to claim 17, wherein controlling the first and second valves further includes:
controlling fluid flow through the first and second valves based upon an input that is indicative of the amount of flow needed to cool the heat- generating component.
19. The method according to claim 18, wherein the input is one or more of the following:
(i) the amount of electrical power being consumed by the heat- generating component;
(ii) the temperature of the heat-generating component;
(iii) the temperature of the heat-generating component as correlated to the amount of electrical power being consumed by the heat-generating component; and/or
(iv) the amount of heat being generated by the heat-generating component;
(v) an indication of an amount of vapor in the fluid flow.
20. The method according to claim 19, wherein controlling the first and second valves further includes: sensing via respective sensors downstream of the first and second valves a characteristic of the fluid flow through the first and second branches; and
communicating the characteristics to the controller to increase or decrease the fluid flow through the respective branches.
21 . The method according to claim 20, wherein the characteristic is an amount of vapor in the fluid flow.
22. A pumped loop system for cooling heat-generating components including:
first and second evaporators in parallel with one another;
first and second valves upstream of the first and second evaporators respectively;
a pump configured to pump fluid to the first and second evaporators; and a condenser downstream of the first and second circuits and upstream of the pump, the condenser configured to reject the heat absorbed by the first and second evaporators;
wherein the first and second valves are controllable to vary the flow rate of fluid to the respective evaporator based on the heat load at the respective evaporator.
23. The pumped loop system according to claim 22, wherein the first and second valves are electronic stepper valves.
24. The pumped loop system according to claim 22 or 23, further including at least one controller configured to control the first valve and the second valve.
25. The pumped loop system according to claim 24, wherein the at least one controller comprises a first and second controller for controlling the first and second valves, respectively.
26. The pumped loop system according to claim 24, wherein the at least one controller comprises a single controller for controlling the first and second valves.
27. The pumped loop system according to any one of claims 22-26, further including a mechanical pressure differential valve downstream of the pump and upstream of the first and second valves for maintaining a constant pressure upstream of the first valve and the second valve.
28. The pumped loop system according to any one of claims 22-27, further including an electronic variable control valve downstream of the pump and upstream of the first and second valves for maintaining a constant pressure upstream of the first valve and the second valve.
29. The pumped loop system of claim 28, further including a pressure sensor upstream of the pump and a pressure sensor downstream of the pump for measuring pressure at an inlet and outlet of the pump respectively, wherein the pressure sensors are operatively coupled to a controller configured to calculate a differential pressure and configured to control the electronic variable control valve to open or close based upon the differential pressure.
30. The pumped loop system according to any one of claims 22-29, further including an accumulator that receives fluid from the condenser and delivers the fluid to the pump.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13702301.6A EP2805120A1 (en) | 2012-01-16 | 2013-01-15 | Parallel evaporator circuit with balanced flow |
US14/369,867 US20150135746A1 (en) | 2012-01-16 | 2013-01-15 | Parallel evaporator circuit with balanced flow |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261586863P | 2012-01-16 | 2012-01-16 | |
US61/586,863 | 2012-01-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013109535A1 true WO2013109535A1 (en) | 2013-07-25 |
Family
ID=47631737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2013/021570 WO2013109535A1 (en) | 2012-01-16 | 2013-01-15 | Parallel evaporator circuit with balanced flow |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150135746A1 (en) |
EP (1) | EP2805120A1 (en) |
WO (1) | WO2013109535A1 (en) |
Cited By (3)
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WO2014116803A1 (en) * | 2013-01-28 | 2014-07-31 | Alcatel Lucent | Cooling technique |
WO2015073122A1 (en) * | 2013-11-14 | 2015-05-21 | Parker-Hannifin Corporation | System and method for controlling fluid flow and temperature within a pumped two-phase cooling distribution unit |
EP3435004A4 (en) * | 2016-03-23 | 2019-12-25 | Hangzhou Sanhua Research Institute Co., Ltd. | Heat exchange system, air conditioning control system, and air conditioning system control method |
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US9854715B2 (en) | 2011-06-27 | 2017-12-26 | Ebullient, Inc. | Flexible two-phase cooling system |
US9901013B2 (en) | 2011-06-27 | 2018-02-20 | Ebullient, Inc. | Method of cooling series-connected heat sink modules |
US9852963B2 (en) | 2014-10-27 | 2017-12-26 | Ebullient, Inc. | Microprocessor assembly adapted for fluid cooling |
US20160120059A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Two-phase cooling system |
US10184699B2 (en) | 2014-10-27 | 2019-01-22 | Ebullient, Inc. | Fluid distribution unit for two-phase cooling system |
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JP2018125497A (en) * | 2017-02-03 | 2018-08-09 | 富士通株式会社 | Electronic apparatus, cooling controller for electronic apparatus and cooling control method |
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US10775110B2 (en) * | 2018-04-12 | 2020-09-15 | Rolls-Royce North American Technologies, Inc. | Tight temperature control at a thermal load with a two phase pumped loop, optionally augmented with a vapor compression cycle |
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US20220228760A1 (en) * | 2018-12-14 | 2022-07-21 | Exotherm, Inc. | Pump-Assisted, Ground Source, Heat Pipe System for Heating and Cooling Water, Greenhouses and Buildings |
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Also Published As
Publication number | Publication date |
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EP2805120A1 (en) | 2014-11-26 |
US20150135746A1 (en) | 2015-05-21 |
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