CA1204950A - Apparatus for cooling telecommunications equipment in a rack - Google Patents
Apparatus for cooling telecommunications equipment in a rackInfo
- Publication number
- CA1204950A CA1204950A CA000416737A CA416737A CA1204950A CA 1204950 A CA1204950 A CA 1204950A CA 000416737 A CA000416737 A CA 000416737A CA 416737 A CA416737 A CA 416737A CA 1204950 A CA1204950 A CA 1204950A
- Authority
- CA
- Canada
- Prior art keywords
- rack
- shelf
- heat exchanger
- heat
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/2069—Liquid coolant with phase change, e.g. heat pipes within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q2201/00—Constructional details of selecting arrangements
- H04Q2201/06—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Television Systems (AREA)
Abstract
ABSTRACT
A rack contains a number of shelves (109) arranged on top of each other, which carry, among other things, board magazines (110) with printed circuit boards (111). An apparatus for cooling the aforesaid printed circuit boards containing telecommunications or electronic equipment in each rack (102) is based on the principle that one or more shelves in the rack are integrated each with its own heat exchanger, which is equipped with cooling flanges and at least one tubular coil. The heat exchanger is connected to a cooler (117) for a coolant. The heat exchanger (12) covers the greater part of the horizontal plane of the shelf. Extensive heat-conducting contact surfaces are provided between the board magazines and the body of the shelf and between the latter and the heat exchangers. Each heat exchanger and the cooler are arranged to permit a high packing density of the aforesaid telecommunications equipment in the rack and to contribute towards removing heat emitted by the equipment by means of heat conduction via the aforesaid extensive contact surfaces. In a first embodiment, the total shelf cooling function can thereby provide for the aforesaid removal of heat unassisted. This heat removal is also provided for by natural convection at the hot and cold surfaces and by radiation. In a second embodiment, the shelf cooling func-tion is combined with a row cooling function (open or closed), air conditioner or similar installation.
A rack contains a number of shelves (109) arranged on top of each other, which carry, among other things, board magazines (110) with printed circuit boards (111). An apparatus for cooling the aforesaid printed circuit boards containing telecommunications or electronic equipment in each rack (102) is based on the principle that one or more shelves in the rack are integrated each with its own heat exchanger, which is equipped with cooling flanges and at least one tubular coil. The heat exchanger is connected to a cooler (117) for a coolant. The heat exchanger (12) covers the greater part of the horizontal plane of the shelf. Extensive heat-conducting contact surfaces are provided between the board magazines and the body of the shelf and between the latter and the heat exchangers. Each heat exchanger and the cooler are arranged to permit a high packing density of the aforesaid telecommunications equipment in the rack and to contribute towards removing heat emitted by the equipment by means of heat conduction via the aforesaid extensive contact surfaces. In a first embodiment, the total shelf cooling function can thereby provide for the aforesaid removal of heat unassisted. This heat removal is also provided for by natural convection at the hot and cold surfaces and by radiation. In a second embodiment, the shelf cooling func-tion is combined with a row cooling function (open or closed), air conditioner or similar installation.
Description
~o~
TITLE OF THE INVENTION
Apparatus or cooling telecommunications e~uipment in a rack.
TECHNICAL FIELD
The present in~ention relates to an apparatus for cooling telecommunications equipment mounted in a rack with a number of shelves located on top of each other, which equipment consists of component-carrying printed circuit boards housed in board magazines, which are in turn applied to the afore-said shelves. The term "telecc. cations equipment" is also used here to denote general electronic equipment mounted in racks that is used outside of the fleld of telecommunica-tions as well.
DESCRIPTION OF l~E PRIOR ART
A means of achieving cooling of telecc ~i~ations equipmen~
mounted in one or more racks, for example at a telephcne exchange, is already ~nown. Such a rack may contain eight shelves, and two such racks generally form a so-called "double racX". The board magazines that are applied to the aforesaid shelves are ~hereby arranged to store, on end, a num~er of boards with printed circuits and/or components, such as relays, condensers, resistors, inductances etc. A
magazine may contain 50 such boards, which means that a double rack may contain some 1 OOO boards.
Heretofore, it has been proposed to cool such telecommunica~
tions equipment sol~ly witn the aid of so-called "open cooling systems", which comprise a compressed air source, i2~D49S0 for ex~mple i~ the form of a fan, whose initiated air stream is conducted from an air duct at the lower parts of the rack or racks and upwards in each rack so that it can pass ~he boards placed on end in the board magazines and be discharged at the top of the rack or racks out into the premises. The aix is rPcirculated to a cooling unit, where the air can be cooled and dried before it is once again recirculated to the racks, and so on.
DESCRIPTION OF T~E PRESENT INVENTION
TECENIC~L PROBLEM
A fervent desire exists to be able to increase the density of components on each printed circuit board so that a larger number of components can ~e accommodated within the same vol~me. This results in heat output from the boards in the racks that is difficult to handle with present-day cooling equipment for telec~ tcation racks. The heat outputs in question c~n be up to 10 Watts per board or more.
In light o~ ~he above, new ways must be chosen to obtain heat removal from the board ma~azines so that r~xl component temperatures c~n be kept to a reasonable level, a must in order ko ensura good function and long lie of ~he components in question.
SOLUTION
The main purpose of ~he present invention is to create an apparatus that solYes the problem of efficient removal of the heat emitted ~y the printed circuit board components.
What _an theraby be said to be essentlally characteri~-tic for ~he new appara~us is that one or more shelves are ints-~grated each with its own heat exchanger incorporatiny cool-ing flanges and at least one tubular coil, which is con-nected via the heat exchanger to a cooler for a coolant in the tubular coil; ~hat the heat exchanger, viewed in the horizontal plane of the shelf, extends alony the greater part of the shelf; that extensive heat-conducting metallic contact surfaces are arrangQd between the board magazines and the shelf and between the shelf and the heat exchanger;
and that the aforesaid heat exchanger and cooler are arranged so that they ar~ able to remove the aforementioned emit~ed heat even at a high packing density of the aforesaid tele-c. -lnjcations equipment in the rack and a high heat output from the said equipment, inter alia with the aid of heat conduction via the aforesaid extensive contact surfaces.
In further elaborations of the invention concept, speciica-tions are recommended for the more detailed construction of the diferent parts of the apparatus. Thus, in one proposed embodiment the majority of the shelves in the racX are to be equipped each with its own heat exchanger, in addition to which the heat exchangers' tubular coils are interconnected and preferably connected to one and the same cooler. ~he cooler with appurtenant compressor may thereby take the form of a tubular evaporator or fluid cooler that is incorpora~ed in a cooling circuit together with, inter alia, a condenser ~water recooler). The latter, at least, should ~e located outside of the premises in which the rack or racks are set up .
The heat ~C~anger or heat exchangers an~ the appurtenant cooling equipment are ~hereby arranged and ~perated in such a manner that the surface temperatures of the components on ~49S~
the boards assume values that axe acceptable in the context, for example max. about 75C. The heat e~ch~ngers and the cooling equipme~t should preferably ba arranged in such a manner that most of the Gomponents on each board assume relatively low temperatures, e.g. below 65 C. In principle, it is possible to arrange and operate the equipment in such ~ ma~ner that lower component temperatures are achieved. In order to effect the above, each heat e~changer should be provided with a relatively large efective cooling surface area, in one em~odiment preIerably in excess of about 1.5 m2.
As an example, it can be mentioned that the cooling surface area can ~e cno~en within the range 1.5-4 m2. Each heat' exchanger shall be provided with a relatively larg~ cooling capacity, e.g. in excess of 150 Watts, and in ~his context it can be mentioned that ~he invention makes it possible to achieve very high cooling capaci~ies from each heat exchanger, for example 500 Watts or more.
The integration between each heat exchanger and its a~so-ciated shelf is further designed so that there is no undue m~chanical we~k~- ng of the load-bearing capacity of the shelf, but rath~r the shelf can fulfil its board-bearing functions.
According to the invention concept, the new apparatus shall be a`ble to effect the cooling function essentially autono-mously, i.e. without the aid of additional cooling equipment, for example in the form of row coolers, air conditioners and the like. It is, however, possible, if desiredl to use the apparatus in co~bination with other coolinq eguipment, for example a row cooler.
Through the invention, the rack or racXs that maka use of the new apparatus will, in one embodiment, function as a cooling buffex in the premises where the rac~ or racks are set up, while simultaneously cooling the telecommunications equipment in ~he rack or rac~s.
In accordance with the concept of the invention, each shel~
shall contain a horizontally extPn~i ng cavity in which the heat exchanger for that shelf is mounted by means of a holding device. This holding device may taXe the form of a screen or grille runnlng along the outer sides of ~he heat ~ch~nqer and be fastened along at least its long sides to ~he shelf. The shelf thexeby consists of two essentially parallel lQad~bearing parts or beams, held together at their ends by side pieces and brackets, which can be of Xnown type. The aforesaid cavity for the heat ex~h~ng~r extends between the aforesaid parallel load-bearing parts. Canti-lever ~upports also extend between the aforesaid load-bear ing parts, and the middle sections of the ca~tilevar supports extend over ~he aforesaid cavity. The cantilever supports in turn support the board magazines. The boards are placed on end in the board magazines and are enclosed entirely within the aforesaid board magazines. The board magazines are provided with throu~h slots to permit air circulation past ~he sides of the boards and components. The board mag~7ines incorporate a bottom part that supports ~he receptacles into which tha boards can be inserted via match-ing plugs. The bottom part is also provided with through slots ~hat permit air circulation.
Me~allic contact surfaces thereby exist between the shelf and ~he aforesaid holding device for the heat exchan~er and between the shel~ and ~he board magazines. The extended contact surfaces are situated on, inter alia, the aforesaid cantilever supports. In one embodiment, the extended contact surfaces also include long channels by means o~ which the holding de~ice for the heat exchanger is clamped to ~he shelf. The board magazines, the cantilever supports, the holding device for the heat exchanger and/or the shelf itself can, in addition, be in direct contact, e.g. via metallic plates, with th~ cooling system's lines or coils, whereby direct contact is al~o obtained between the cold surfaces on the aforesaid lines and the unit in que~tion.
ADVANTAGES
The above-described arrangement provides an e~ective in-direct cooling function for the board components in the board magazines to complement the cooling function th~t is obtAined through natural convection and radiation from the heat ~xrh~nger.
Through the proposed design principle, relatively large quantities of heat can be dissipated in t~is ccnte2t by means of the heat exchanger and the appurtenant cooling equipment. Even if as large heat outputs as 10-15 Watts should be emitted from one or more boards in the board magazines, the design and operation of the heat e~changers and the appurtenant cooling equipment can be arrangad to provide ~he necessary heat removal. The new arrangement can thereby effect removal of the heat developed in th~ racks without environmental nuisance, either by itself or in combination wi~h supplementary cooling equipment, such as row coolers and air conditioners.
4~3S~
Despite a high packing density, the highest temperatures of the boards need not exceed predet~rmined values, e.g. about 75C. Obviously, the life of the various compon~nts is prolonged by reduced temp2rature, and it can be mentioned in -this context that if desired, it is possible to operate the system so that the temperatures of most of ~he components will be around 65C or lower.
Despite the above-mentioned advantages o~tained with ~he invention, the main advantage is that the shelf construction and the rack system as a whole need not be sub; ect to any modifications, aside from proYision of the cavity for the heat exchanger. The heat exchangers in the rack will ~here-fore not occupy any extra space, but ra~her only such space as was pxeviously not utilized in the racks of known design.
Tke integration can ~e executed in such a m~nner that the load-bearing capacity of the shelf is not unduly affected.
DESCRIPTION OF lH~ DRAWINGS
A currently proposed embodiment of an appratus ~hat exhibits the significant characteristic of the invention will be described below with reference to appended drawings, where figure 1 shows, in ~chematic form premises, for example at a telephone exchange, with racks cont~i ni telecommllnications e~uipme~t that is cooled by the new apparatus, the latter comprising a combina~ion of shelf coolers and row coolers, figure 2 shows, in an end view, parts of a rack accord-in~ to fig. 1, ~495~
figure 3 shows, in a horizontal view, a heat exchanger mounted in a shelf in the rack according to fig. 2, figur~ 4 shows one embodiment of the heat excha~ger and its mounting in a shelf in the rack, figure 5 shows, in an end view, an alternative embodi-ment of the heat exchanger, figure fi shows a detailed view of a tube incorporated in the heat exchanger according to fig. 5 a~d cooling flanges arranged around this tube, with drop-collecting edges and drip tray figure 7 shows, in persp~ctive viewed rom in front and above, certain parts of a second embodi-ment of a rack utilizing the apparat~ls, in which another embodiment the shelf cooler provides ~he cooling function essentially autonomously, i.e. without the aid of e.g.
the row cooler in figures 1-2, figure 8 shows, i~ a side view, shelves in a rack according to fig. 7 with appurtena~t board magazi.nas for printed circuit boards, figure 9 shows, in a horizontal section, the design of the board magazines, ~he shelf and the rack accor`ding to fig. 8 and 495C~
figure 10 shows, in a horizontal section, the extent of the heat exchanger in the shelf according to fig. 8.
DE~CRIPTION OF T~E PRE~ERRED EMBODIMENT
Figures 1-6 illus~rate an embodiment where the indiv1dual cooling function in the rack shelves has been combined with a row cooling function co~mon to all racks. I~ figure 1~ the premises or equivalent room are indicated by 1. The premises are bounded in this case by walls 2, a ceiling 3 and the floor 4. A number of racks 5 of known t~pe with telecom-mu~ications equipment are set up on the premises. The racks ~ shown are arranged in rows and the premises may contain one or more such rows of racks. Each rack consists of a number of compartments arranged on top of one another, desisnated in the figure by 5a, 5b... 5g. The compartments are bounded by shelves, which are indicated by 6a', 6~, 6b... 6f. Tha shelves are designed to support various tele-communication units plus mag~7~ n~S with boaxds with printed wiring and various components ~condensers, relays, resistors etcO). By "shelf" is meant here cantilevers an~ the like.
The aforesaid boaxds are arranged on end in the magazines.
At the end of each row is a refrigeration module 7 that operates by means of, for example, direct e.~pansion and is of known type. The refrigeration module in question here is sold on the market by FIakt AB and carries the code de~igna^
tion KDAX. The refrigeration module comprises a filter 7a, a cooling coil 7b, compressors 7c and a fan 7d. ~he compressors are connecte~ to a condenser 8 or water cooler located outside of th~ premises, and the refrigerant line is in~i-cated by 9. One or more ducts lG pass under the racks.
~Z~5~
The air discharged by the fan 7d is blown into the aforesaid ducts and distri~uted in known ~n~er between the racks, creating upward-directed and preferably dry air streams, indicated in the figure by 1~.
Heat exchangers, described in ~reater detail below, are installed in the different shelves in the different racks~
In the embodiment illus-krated, most of the aforesaid shelves are equipped with a heat exchanger 13, and the new apparatus functions more effective~y the more shelves are eguipped with heat exchangers. 60-100% of the shelves should prefer-ably be equipped with heat exchangers. I~ the middle racks shown in the figure, units 14 (not specified in any greater detail here) are installed in the lower parts. These compart-ments are not equipped with heat exchangars. The same applies to all bottom compartments 5a' in the variou~ racks. Instead, the top compartment is equipped with two heat exchangers, oue of which is mounte~ in the ceiling of the compartment, where it provides good cooling capacity, since ~he air is hottest at the top of the rack. The aoresaid heat exchangers are primarily installed in compar~ments or shelves th~t are intended to carry magazines of known type ~or boar~s wlth printed wiring and various types of components ~reiays, condensers, resistor~ etc.). In the case of the inve~tion, however, most of the shelves in the racks (e.g. more than 75%) shall be equipped with a heat exchanger. The heat exchanger can thereby be integrated with the shelf or don-stitute a separate part in relation to the shelf, whereby in the latter case the heat ~x~h~nger is attached to the rack itself. The rack is equipped with two vertically running pipelines 15 and 16. Tha inlet connections to the heat exchangers' tubular coils are connected to the first pipe~
line 15, while the outlets from the heat exchangers' tubular coils are connected to the second pipeline 16. The pipelines 1~ and lh in the different xacks are connected in parallel to a tubular evaporator or fluid cooler 17 of known type. In the fluid cooler, the tubular evaporator is indi cated by 17a and the compressor by 17b. The compressor.i~
connected to a condensex or water recooler located outside of the premises via a line 17c for the refri~erant. In the case shown here, the tubular evaporator has been connected to the same condenser or water recooler a~ the xe~rigerator module 7, but ca~ o~herwise be connected to a separate condenser or water recooler. The piping system that includes the fir~t and se ond pipelines 15 and 16 to the various racks i~ connected to the tubular evaporator's inlet 17a' and outlet 17a" . The pipelines can also be connected in series, dependi~g on the diameter of the tubing used. ~ pu~p 18 of known type is incorporated on the pressure side of the piping system. The fan's 7d outgoing air flow is kept to a temperatur~ of about +8C i~ order to ~; nl mi 7,e the water content of the supply air to about 6.5 graNmes of water per kg of air. This is done in order to dry the air so that water does not condens~ on the outer surfaces of the heat e~changers. The air e~tering the air duct from the fan outlet can, owing to the ejector effect, entrain room air a~d ther~by assume a temperature of +15-16C.
The coolant in the piping system should preferably consist *
o~ freon in the liquid state, which i~ ~hus cooled i~ ~he fluid cooler 17 and circulated in the piping system by the pump 1~. In the case illustrated here, the fluid has an inlet temperature at 17a' of up to +30C, while lts tempera-ture at the outlet 17a " can be about ~15C. Circulation in ~he system is indicated by arrows 19 and 20.
* Trade mark ~2~4g~
The upward and preferably dry ai.r streams l~a, 12b, 12c and 12d in the differe~t racks thereby pass the heat exchangers' cooling flanges on the shelves equipped with heat exchangers, while absorbing heat from the racks. As shown by arrows 12c and 12f, air eddies are also created in the xack. An example of the velocity of the fluid in the closed piping system is O.2-0.4 m/s~ The piping system and the tubular coils in the heat ~Xch~ngers consist of copper tubi~g wi~h an inside diameter of about 10 mm. The velocity of the upward air streams in the racks is 1-5 m/s. The temperature on the premises can be ~23-24C.
Figure 2 shows three compartments in a rack 5. For each shelf, a side piece 21 is shown, which is fitted at the rear of the rack with hook devices (not shown) by means of which the shelf can be attached to the rack posts 22 on either side of the shelf. The aforesaid rack posts are provided with slots into which the aforesaid hook devices can be i~serted and secured in known manner. A-t its inner and outer ends, the shelf bears the bracket that supports the lower parts 23a and 23b of a board magazine that carries the boards~standing on end. Figure 2 shows a board, indicated ~y ~4. The boards are mounted in the magazine with intervening spaces, and each board carries components (not shown) and printed wiring on one or both sides. Since the constructions of the shelf, the board magazines and the boards are pr~-sumed to be known, they will not be described in any greater detail here~ It can however be stated that the ~helf consists of, besides the aforesaid side pieces 2~, a load-~earing surface which, i~ the view shown in figure 2, is composed of two flat sections 21a and 21b which meet each other at an angle. For the futu~e, a shelf design is being discussed with a single surface that runs essentially perpendicular to g~ ~
the vertical directio.n of ~he rack. This surface can be assumed to coincide with the left-hand flat portion 21a of the shelf's load-beaxing surface. The invention also applies for other shelf planes, however, for example planes that coincide essentially with the section 21b. The upward air stream in the rack is divided as shown in figure 2 into a number of substreams 12a, 12b a~d 12c. The rack can be equipped with a section 25, provided with a number of slots for air that flows upwzrd from the lower parts of the racX
and via the slots into the rack i~ question~ In the embodi-ment show~, a slot section 25a, 25b, 25c is provided at each shelf. At th~ lowest shel, the air flows in from the cool-ing duct via the slots into the adjoining section and then upward bet~een the afoxesaid boards. Air also enters at the overlying shelves via their slot sections. The air flowing upward in the rack passes the shelves with thair heat ex-changers 13 and continues up via the lower parts of the board magazines and up between the boards to the overlying parts, and so on. Except for the aforesaid rack posts 2~, the rack i5 completely open in back, and a chimney ~uct 26 is provided at the rear of the rack, in which some of the air can escape on its passage upward through the rack. The upward and backward sweeping air stream creat~d ~n this fashion provides good cooling, especially at the rear parts of the rack, which are the most critical from the viewpoint of cooling.
Figure 3 shows the shelf 21 in a horizontal view from above.
As is evident from the figure, the flat or slopin~ portion 21a, 21b contains the cavity for the heat ~xchanger, which is of the type that incoxporates a tubular coil 13a with attached cooling flange~ 13b. The heat exchan~er has a large extent in the plane shown in figur~ 3 and occupies a large ~4 g~
part of the plane of the shelf in question. As an example o what is meant by "a large part" in this case, it can be mentioned that the heat exchanger shall occupy 60-90% of the plane of the shelf in question. The heat exchanger exhibits a depth A equal to about 2/3 of the depth B of the shelf.
The heat exchanger e~tends from the rear parts of the rack (the beams 22) towards the front of the rack. Owing to i~s relatively far retracted position in the rac~, the heat e~h~ger provides an effective cooling function at the same time as the shelf retains a reliable load-bearing function.
The heat ~xch~nger can be attached to the shelf and/or the rack. The points of attachment hav~ extansive contact sur-faces that ensure good heat conduction from th~ warmer parts of the heat exch~nger to the colder ~urfaces on th~ shelf and/or the rac~. The tubular coil 13~ is fitted with an inlet connection 13c and an outlet connection 13d which, in accordance with ~he above, shall be connected to the first and second pipellnes. The aoresaid first and second pipe-lin~s ca~ be run in ~he aforesaid chimney duct ~6. Parts of the first pi~eline's 15 ru~ in the aforementioned duct 26 have been indicated in figure 2. The tu~es ln the a~oresaid tu~e coil in the heat exchanger ext2nd primarily in the transverse direction o the shelf along most of the afore-said transverse direction. In the embodiment show~, the afaresaid tubular coils extend alon~ about 90-95% of the shelf's tra~s~erse direction. The cooling flanges on the heat ~xch~nger can be s~uare, circular or of another shape.
Figures 5-6 are i~tended to illustrate an alternative n embodiment o the heat exchang~r and its application -to the shelf, whose sloping portion 21b' is indicated in figure 4.
In this case, the hook devices 27 on ~he shelf, by mqans of which the shelf is attachable to the rack posts 22, are also 1~4~5t:~ ~
shown. The heat exchanger's cooling flanges are of square shape in this case and are rotated 45 around their longi tudinal axis in relation to the embodiment according to figure 4. In addition, the edges of the cooli~g ~langes are upset or bent in order to provide drop collectors, and a drip tray 28 is provided under the heat ~xch~nger~ This n embodiment may be appropriate when water can be expected to condense on the heat exchanger surfaces during the cooling process. This may occur when the air on the premises is relatively humid, for example becaus~ the outdoor humidity is in itself high and corridors and other passageways have stood or are standing open i~to the premises. Co~en~e may also form on the surf~ces when high cooli~g capacities are desired ~rom the cooling apparatus. Any moisture on the outside of the cooling flanges can run down along the edges of the cooling flanges to ~he lowermost corner, under which the drip tray 28 is arranged. The drip tray can lead to on~
or more containers (not shown3.
The heat exchanger is also provided with a pxotective grille or screen 29 so that piping can be run within the rack regardless of the aforesaid heat exchangers. The yrille or screen is thereby designed so that heat is conducted be~ween the heat exchanger and the screen or grille, from which the heat can be conducted to the shelf and/or the rack. The contact surfaces between the grille/screen and the heat exchanger shall thereby be made relatively large in order to facilitate such heat conduction. The heat exchanger is made ~ith an effective cooling surface of up to 2.0 m or more.
The apparatus described above can also be employed to advan-tage in premises that have an air treahnent unit separate :~2~495~
from thP apparatus, intended to brlng about hygie~ically acceptable air conditions on the premises and, in some cases, to humidify and/or dehumidify the air on the premises.
The shelf cooling function can, however, also function completely separately or essentially separately as per the following. Parts of a rack row at a teleco~unications exchange are indicated by 101 in figure 7. The xack construc-tion is of known type a~d has been supplemented with a cooling apparatus according to ~he invention. The rack row contains a nu~ber of racks 102, 103, 104 etc. and may form single or double racks. In addition to its frame with Ioad-bearing beams 105, 106 and end and front sheets 107, 108, each rac~ is provided with a number of shelves 109, arranged on top of each other, whose number in ~he case in gue~tion is eight. Telect-~ cations equipment is arranged on the shelves. The aforesaid telecommunications equipment can there~y co~sist of circuit boards 111 arra~ged on end in board mag~inP~ 110 in known manner. Most of the shelves in a rack may carry such board magazines, while one or more shelves may carry other type~ of equipment, such as trans~
formers, power supply components etc.
Most of the shelves in each rack shall preferably be intP-grated each wi~h its own heat e~changer 112. In the case in question, all shelves in the rack 102 are eguipped with such
TITLE OF THE INVENTION
Apparatus or cooling telecommunications e~uipment in a rack.
TECHNICAL FIELD
The present in~ention relates to an apparatus for cooling telecommunications equipment mounted in a rack with a number of shelves located on top of each other, which equipment consists of component-carrying printed circuit boards housed in board magazines, which are in turn applied to the afore-said shelves. The term "telecc. cations equipment" is also used here to denote general electronic equipment mounted in racks that is used outside of the fleld of telecommunica-tions as well.
DESCRIPTION OF l~E PRIOR ART
A means of achieving cooling of telecc ~i~ations equipmen~
mounted in one or more racks, for example at a telephcne exchange, is already ~nown. Such a rack may contain eight shelves, and two such racks generally form a so-called "double racX". The board magazines that are applied to the aforesaid shelves are ~hereby arranged to store, on end, a num~er of boards with printed circuits and/or components, such as relays, condensers, resistors, inductances etc. A
magazine may contain 50 such boards, which means that a double rack may contain some 1 OOO boards.
Heretofore, it has been proposed to cool such telecommunica~
tions equipment sol~ly witn the aid of so-called "open cooling systems", which comprise a compressed air source, i2~D49S0 for ex~mple i~ the form of a fan, whose initiated air stream is conducted from an air duct at the lower parts of the rack or racks and upwards in each rack so that it can pass ~he boards placed on end in the board magazines and be discharged at the top of the rack or racks out into the premises. The aix is rPcirculated to a cooling unit, where the air can be cooled and dried before it is once again recirculated to the racks, and so on.
DESCRIPTION OF T~E PRESENT INVENTION
TECENIC~L PROBLEM
A fervent desire exists to be able to increase the density of components on each printed circuit board so that a larger number of components can ~e accommodated within the same vol~me. This results in heat output from the boards in the racks that is difficult to handle with present-day cooling equipment for telec~ tcation racks. The heat outputs in question c~n be up to 10 Watts per board or more.
In light o~ ~he above, new ways must be chosen to obtain heat removal from the board ma~azines so that r~xl component temperatures c~n be kept to a reasonable level, a must in order ko ensura good function and long lie of ~he components in question.
SOLUTION
The main purpose of ~he present invention is to create an apparatus that solYes the problem of efficient removal of the heat emitted ~y the printed circuit board components.
What _an theraby be said to be essentlally characteri~-tic for ~he new appara~us is that one or more shelves are ints-~grated each with its own heat exchanger incorporatiny cool-ing flanges and at least one tubular coil, which is con-nected via the heat exchanger to a cooler for a coolant in the tubular coil; ~hat the heat exchanger, viewed in the horizontal plane of the shelf, extends alony the greater part of the shelf; that extensive heat-conducting metallic contact surfaces are arrangQd between the board magazines and the shelf and between the shelf and the heat exchanger;
and that the aforesaid heat exchanger and cooler are arranged so that they ar~ able to remove the aforementioned emit~ed heat even at a high packing density of the aforesaid tele-c. -lnjcations equipment in the rack and a high heat output from the said equipment, inter alia with the aid of heat conduction via the aforesaid extensive contact surfaces.
In further elaborations of the invention concept, speciica-tions are recommended for the more detailed construction of the diferent parts of the apparatus. Thus, in one proposed embodiment the majority of the shelves in the racX are to be equipped each with its own heat exchanger, in addition to which the heat exchangers' tubular coils are interconnected and preferably connected to one and the same cooler. ~he cooler with appurtenant compressor may thereby take the form of a tubular evaporator or fluid cooler that is incorpora~ed in a cooling circuit together with, inter alia, a condenser ~water recooler). The latter, at least, should ~e located outside of the premises in which the rack or racks are set up .
The heat ~C~anger or heat exchangers an~ the appurtenant cooling equipment are ~hereby arranged and ~perated in such a manner that the surface temperatures of the components on ~49S~
the boards assume values that axe acceptable in the context, for example max. about 75C. The heat e~ch~ngers and the cooling equipme~t should preferably ba arranged in such a manner that most of the Gomponents on each board assume relatively low temperatures, e.g. below 65 C. In principle, it is possible to arrange and operate the equipment in such ~ ma~ner that lower component temperatures are achieved. In order to effect the above, each heat e~changer should be provided with a relatively large efective cooling surface area, in one em~odiment preIerably in excess of about 1.5 m2.
As an example, it can be mentioned that the cooling surface area can ~e cno~en within the range 1.5-4 m2. Each heat' exchanger shall be provided with a relatively larg~ cooling capacity, e.g. in excess of 150 Watts, and in ~his context it can be mentioned that ~he invention makes it possible to achieve very high cooling capaci~ies from each heat exchanger, for example 500 Watts or more.
The integration between each heat exchanger and its a~so-ciated shelf is further designed so that there is no undue m~chanical we~k~- ng of the load-bearing capacity of the shelf, but rath~r the shelf can fulfil its board-bearing functions.
According to the invention concept, the new apparatus shall be a`ble to effect the cooling function essentially autono-mously, i.e. without the aid of additional cooling equipment, for example in the form of row coolers, air conditioners and the like. It is, however, possible, if desiredl to use the apparatus in co~bination with other coolinq eguipment, for example a row cooler.
Through the invention, the rack or racXs that maka use of the new apparatus will, in one embodiment, function as a cooling buffex in the premises where the rac~ or racks are set up, while simultaneously cooling the telecommunications equipment in ~he rack or rac~s.
In accordance with the concept of the invention, each shel~
shall contain a horizontally extPn~i ng cavity in which the heat exchanger for that shelf is mounted by means of a holding device. This holding device may taXe the form of a screen or grille runnlng along the outer sides of ~he heat ~ch~nqer and be fastened along at least its long sides to ~he shelf. The shelf thexeby consists of two essentially parallel lQad~bearing parts or beams, held together at their ends by side pieces and brackets, which can be of Xnown type. The aforesaid cavity for the heat ex~h~ng~r extends between the aforesaid parallel load-bearing parts. Canti-lever ~upports also extend between the aforesaid load-bear ing parts, and the middle sections of the ca~tilevar supports extend over ~he aforesaid cavity. The cantilever supports in turn support the board magazines. The boards are placed on end in the board magazines and are enclosed entirely within the aforesaid board magazines. The board magazines are provided with throu~h slots to permit air circulation past ~he sides of the boards and components. The board mag~7ines incorporate a bottom part that supports ~he receptacles into which tha boards can be inserted via match-ing plugs. The bottom part is also provided with through slots ~hat permit air circulation.
Me~allic contact surfaces thereby exist between the shelf and ~he aforesaid holding device for the heat exchan~er and between the shel~ and ~he board magazines. The extended contact surfaces are situated on, inter alia, the aforesaid cantilever supports. In one embodiment, the extended contact surfaces also include long channels by means o~ which the holding de~ice for the heat exchanger is clamped to ~he shelf. The board magazines, the cantilever supports, the holding device for the heat exchanger and/or the shelf itself can, in addition, be in direct contact, e.g. via metallic plates, with th~ cooling system's lines or coils, whereby direct contact is al~o obtained between the cold surfaces on the aforesaid lines and the unit in que~tion.
ADVANTAGES
The above-described arrangement provides an e~ective in-direct cooling function for the board components in the board magazines to complement the cooling function th~t is obtAined through natural convection and radiation from the heat ~xrh~nger.
Through the proposed design principle, relatively large quantities of heat can be dissipated in t~is ccnte2t by means of the heat exchanger and the appurtenant cooling equipment. Even if as large heat outputs as 10-15 Watts should be emitted from one or more boards in the board magazines, the design and operation of the heat e~changers and the appurtenant cooling equipment can be arrangad to provide ~he necessary heat removal. The new arrangement can thereby effect removal of the heat developed in th~ racks without environmental nuisance, either by itself or in combination wi~h supplementary cooling equipment, such as row coolers and air conditioners.
4~3S~
Despite a high packing density, the highest temperatures of the boards need not exceed predet~rmined values, e.g. about 75C. Obviously, the life of the various compon~nts is prolonged by reduced temp2rature, and it can be mentioned in -this context that if desired, it is possible to operate the system so that the temperatures of most of ~he components will be around 65C or lower.
Despite the above-mentioned advantages o~tained with ~he invention, the main advantage is that the shelf construction and the rack system as a whole need not be sub; ect to any modifications, aside from proYision of the cavity for the heat exchanger. The heat exchangers in the rack will ~here-fore not occupy any extra space, but ra~her only such space as was pxeviously not utilized in the racks of known design.
Tke integration can ~e executed in such a m~nner that the load-bearing capacity of the shelf is not unduly affected.
DESCRIPTION OF lH~ DRAWINGS
A currently proposed embodiment of an appratus ~hat exhibits the significant characteristic of the invention will be described below with reference to appended drawings, where figure 1 shows, in ~chematic form premises, for example at a telephone exchange, with racks cont~i ni telecommllnications e~uipme~t that is cooled by the new apparatus, the latter comprising a combina~ion of shelf coolers and row coolers, figure 2 shows, in an end view, parts of a rack accord-in~ to fig. 1, ~495~
figure 3 shows, in a horizontal view, a heat exchanger mounted in a shelf in the rack according to fig. 2, figur~ 4 shows one embodiment of the heat excha~ger and its mounting in a shelf in the rack, figure 5 shows, in an end view, an alternative embodi-ment of the heat exchanger, figure fi shows a detailed view of a tube incorporated in the heat exchanger according to fig. 5 a~d cooling flanges arranged around this tube, with drop-collecting edges and drip tray figure 7 shows, in persp~ctive viewed rom in front and above, certain parts of a second embodi-ment of a rack utilizing the apparat~ls, in which another embodiment the shelf cooler provides ~he cooling function essentially autonomously, i.e. without the aid of e.g.
the row cooler in figures 1-2, figure 8 shows, i~ a side view, shelves in a rack according to fig. 7 with appurtena~t board magazi.nas for printed circuit boards, figure 9 shows, in a horizontal section, the design of the board magazines, ~he shelf and the rack accor`ding to fig. 8 and 495C~
figure 10 shows, in a horizontal section, the extent of the heat exchanger in the shelf according to fig. 8.
DE~CRIPTION OF T~E PRE~ERRED EMBODIMENT
Figures 1-6 illus~rate an embodiment where the indiv1dual cooling function in the rack shelves has been combined with a row cooling function co~mon to all racks. I~ figure 1~ the premises or equivalent room are indicated by 1. The premises are bounded in this case by walls 2, a ceiling 3 and the floor 4. A number of racks 5 of known t~pe with telecom-mu~ications equipment are set up on the premises. The racks ~ shown are arranged in rows and the premises may contain one or more such rows of racks. Each rack consists of a number of compartments arranged on top of one another, desisnated in the figure by 5a, 5b... 5g. The compartments are bounded by shelves, which are indicated by 6a', 6~, 6b... 6f. Tha shelves are designed to support various tele-communication units plus mag~7~ n~S with boaxds with printed wiring and various components ~condensers, relays, resistors etcO). By "shelf" is meant here cantilevers an~ the like.
The aforesaid boaxds are arranged on end in the magazines.
At the end of each row is a refrigeration module 7 that operates by means of, for example, direct e.~pansion and is of known type. The refrigeration module in question here is sold on the market by FIakt AB and carries the code de~igna^
tion KDAX. The refrigeration module comprises a filter 7a, a cooling coil 7b, compressors 7c and a fan 7d. ~he compressors are connecte~ to a condenser 8 or water cooler located outside of th~ premises, and the refrigerant line is in~i-cated by 9. One or more ducts lG pass under the racks.
~Z~5~
The air discharged by the fan 7d is blown into the aforesaid ducts and distri~uted in known ~n~er between the racks, creating upward-directed and preferably dry air streams, indicated in the figure by 1~.
Heat exchangers, described in ~reater detail below, are installed in the different shelves in the different racks~
In the embodiment illus-krated, most of the aforesaid shelves are equipped with a heat exchanger 13, and the new apparatus functions more effective~y the more shelves are eguipped with heat exchangers. 60-100% of the shelves should prefer-ably be equipped with heat exchangers. I~ the middle racks shown in the figure, units 14 (not specified in any greater detail here) are installed in the lower parts. These compart-ments are not equipped with heat exchangars. The same applies to all bottom compartments 5a' in the variou~ racks. Instead, the top compartment is equipped with two heat exchangers, oue of which is mounte~ in the ceiling of the compartment, where it provides good cooling capacity, since ~he air is hottest at the top of the rack. The aoresaid heat exchangers are primarily installed in compar~ments or shelves th~t are intended to carry magazines of known type ~or boar~s wlth printed wiring and various types of components ~reiays, condensers, resistor~ etc.). In the case of the inve~tion, however, most of the shelves in the racks (e.g. more than 75%) shall be equipped with a heat exchanger. The heat exchanger can thereby be integrated with the shelf or don-stitute a separate part in relation to the shelf, whereby in the latter case the heat ~x~h~nger is attached to the rack itself. The rack is equipped with two vertically running pipelines 15 and 16. Tha inlet connections to the heat exchangers' tubular coils are connected to the first pipe~
line 15, while the outlets from the heat exchangers' tubular coils are connected to the second pipeline 16. The pipelines 1~ and lh in the different xacks are connected in parallel to a tubular evaporator or fluid cooler 17 of known type. In the fluid cooler, the tubular evaporator is indi cated by 17a and the compressor by 17b. The compressor.i~
connected to a condensex or water recooler located outside of the premises via a line 17c for the refri~erant. In the case shown here, the tubular evaporator has been connected to the same condenser or water recooler a~ the xe~rigerator module 7, but ca~ o~herwise be connected to a separate condenser or water recooler. The piping system that includes the fir~t and se ond pipelines 15 and 16 to the various racks i~ connected to the tubular evaporator's inlet 17a' and outlet 17a" . The pipelines can also be connected in series, dependi~g on the diameter of the tubing used. ~ pu~p 18 of known type is incorporated on the pressure side of the piping system. The fan's 7d outgoing air flow is kept to a temperatur~ of about +8C i~ order to ~; nl mi 7,e the water content of the supply air to about 6.5 graNmes of water per kg of air. This is done in order to dry the air so that water does not condens~ on the outer surfaces of the heat e~changers. The air e~tering the air duct from the fan outlet can, owing to the ejector effect, entrain room air a~d ther~by assume a temperature of +15-16C.
The coolant in the piping system should preferably consist *
o~ freon in the liquid state, which i~ ~hus cooled i~ ~he fluid cooler 17 and circulated in the piping system by the pump 1~. In the case illustrated here, the fluid has an inlet temperature at 17a' of up to +30C, while lts tempera-ture at the outlet 17a " can be about ~15C. Circulation in ~he system is indicated by arrows 19 and 20.
* Trade mark ~2~4g~
The upward and preferably dry ai.r streams l~a, 12b, 12c and 12d in the differe~t racks thereby pass the heat exchangers' cooling flanges on the shelves equipped with heat exchangers, while absorbing heat from the racks. As shown by arrows 12c and 12f, air eddies are also created in the xack. An example of the velocity of the fluid in the closed piping system is O.2-0.4 m/s~ The piping system and the tubular coils in the heat ~Xch~ngers consist of copper tubi~g wi~h an inside diameter of about 10 mm. The velocity of the upward air streams in the racks is 1-5 m/s. The temperature on the premises can be ~23-24C.
Figure 2 shows three compartments in a rack 5. For each shelf, a side piece 21 is shown, which is fitted at the rear of the rack with hook devices (not shown) by means of which the shelf can be attached to the rack posts 22 on either side of the shelf. The aforesaid rack posts are provided with slots into which the aforesaid hook devices can be i~serted and secured in known manner. A-t its inner and outer ends, the shelf bears the bracket that supports the lower parts 23a and 23b of a board magazine that carries the boards~standing on end. Figure 2 shows a board, indicated ~y ~4. The boards are mounted in the magazine with intervening spaces, and each board carries components (not shown) and printed wiring on one or both sides. Since the constructions of the shelf, the board magazines and the boards are pr~-sumed to be known, they will not be described in any greater detail here~ It can however be stated that the ~helf consists of, besides the aforesaid side pieces 2~, a load-~earing surface which, i~ the view shown in figure 2, is composed of two flat sections 21a and 21b which meet each other at an angle. For the futu~e, a shelf design is being discussed with a single surface that runs essentially perpendicular to g~ ~
the vertical directio.n of ~he rack. This surface can be assumed to coincide with the left-hand flat portion 21a of the shelf's load-beaxing surface. The invention also applies for other shelf planes, however, for example planes that coincide essentially with the section 21b. The upward air stream in the rack is divided as shown in figure 2 into a number of substreams 12a, 12b a~d 12c. The rack can be equipped with a section 25, provided with a number of slots for air that flows upwzrd from the lower parts of the racX
and via the slots into the rack i~ question~ In the embodi-ment show~, a slot section 25a, 25b, 25c is provided at each shelf. At th~ lowest shel, the air flows in from the cool-ing duct via the slots into the adjoining section and then upward bet~een the afoxesaid boards. Air also enters at the overlying shelves via their slot sections. The air flowing upward in the rack passes the shelves with thair heat ex-changers 13 and continues up via the lower parts of the board magazines and up between the boards to the overlying parts, and so on. Except for the aforesaid rack posts 2~, the rack i5 completely open in back, and a chimney ~uct 26 is provided at the rear of the rack, in which some of the air can escape on its passage upward through the rack. The upward and backward sweeping air stream creat~d ~n this fashion provides good cooling, especially at the rear parts of the rack, which are the most critical from the viewpoint of cooling.
Figure 3 shows the shelf 21 in a horizontal view from above.
As is evident from the figure, the flat or slopin~ portion 21a, 21b contains the cavity for the heat ~xchanger, which is of the type that incoxporates a tubular coil 13a with attached cooling flange~ 13b. The heat exchan~er has a large extent in the plane shown in figur~ 3 and occupies a large ~4 g~
part of the plane of the shelf in question. As an example o what is meant by "a large part" in this case, it can be mentioned that the heat exchanger shall occupy 60-90% of the plane of the shelf in question. The heat exchanger exhibits a depth A equal to about 2/3 of the depth B of the shelf.
The heat exchanger e~tends from the rear parts of the rack (the beams 22) towards the front of the rack. Owing to i~s relatively far retracted position in the rac~, the heat e~h~ger provides an effective cooling function at the same time as the shelf retains a reliable load-bearing function.
The heat ~xch~nger can be attached to the shelf and/or the rack. The points of attachment hav~ extansive contact sur-faces that ensure good heat conduction from th~ warmer parts of the heat exch~nger to the colder ~urfaces on th~ shelf and/or the rac~. The tubular coil 13~ is fitted with an inlet connection 13c and an outlet connection 13d which, in accordance with ~he above, shall be connected to the first and second pipellnes. The aoresaid first and second pipe-lin~s ca~ be run in ~he aforesaid chimney duct ~6. Parts of the first pi~eline's 15 ru~ in the aforementioned duct 26 have been indicated in figure 2. The tu~es ln the a~oresaid tu~e coil in the heat exchanger ext2nd primarily in the transverse direction o the shelf along most of the afore-said transverse direction. In the embodiment show~, the afaresaid tubular coils extend alon~ about 90-95% of the shelf's tra~s~erse direction. The cooling flanges on the heat ~xch~nger can be s~uare, circular or of another shape.
Figures 5-6 are i~tended to illustrate an alternative n embodiment o the heat exchang~r and its application -to the shelf, whose sloping portion 21b' is indicated in figure 4.
In this case, the hook devices 27 on ~he shelf, by mqans of which the shelf is attachable to the rack posts 22, are also 1~4~5t:~ ~
shown. The heat exchanger's cooling flanges are of square shape in this case and are rotated 45 around their longi tudinal axis in relation to the embodiment according to figure 4. In addition, the edges of the cooli~g ~langes are upset or bent in order to provide drop collectors, and a drip tray 28 is provided under the heat ~xch~nger~ This n embodiment may be appropriate when water can be expected to condense on the heat exchanger surfaces during the cooling process. This may occur when the air on the premises is relatively humid, for example becaus~ the outdoor humidity is in itself high and corridors and other passageways have stood or are standing open i~to the premises. Co~en~e may also form on the surf~ces when high cooli~g capacities are desired ~rom the cooling apparatus. Any moisture on the outside of the cooling flanges can run down along the edges of the cooling flanges to ~he lowermost corner, under which the drip tray 28 is arranged. The drip tray can lead to on~
or more containers (not shown3.
The heat exchanger is also provided with a pxotective grille or screen 29 so that piping can be run within the rack regardless of the aforesaid heat exchangers. The yrille or screen is thereby designed so that heat is conducted be~ween the heat exchanger and the screen or grille, from which the heat can be conducted to the shelf and/or the rack. The contact surfaces between the grille/screen and the heat exchanger shall thereby be made relatively large in order to facilitate such heat conduction. The heat exchanger is made ~ith an effective cooling surface of up to 2.0 m or more.
The apparatus described above can also be employed to advan-tage in premises that have an air treahnent unit separate :~2~495~
from thP apparatus, intended to brlng about hygie~ically acceptable air conditions on the premises and, in some cases, to humidify and/or dehumidify the air on the premises.
The shelf cooling function can, however, also function completely separately or essentially separately as per the following. Parts of a rack row at a teleco~unications exchange are indicated by 101 in figure 7. The xack construc-tion is of known type a~d has been supplemented with a cooling apparatus according to ~he invention. The rack row contains a nu~ber of racks 102, 103, 104 etc. and may form single or double racks. In addition to its frame with Ioad-bearing beams 105, 106 and end and front sheets 107, 108, each rac~ is provided with a number of shelves 109, arranged on top of each other, whose number in ~he case in gue~tion is eight. Telect-~ cations equipment is arranged on the shelves. The aforesaid telecommunications equipment can there~y co~sist of circuit boards 111 arra~ged on end in board mag~inP~ 110 in known manner. Most of the shelves in a rack may carry such board magazines, while one or more shelves may carry other type~ of equipment, such as trans~
formers, power supply components etc.
Most of the shelves in each rack shall preferably be intP-grated each wi~h its own heat e~changer 112. In the case in question, all shelves in the rack 102 are eguipped with such
2 heat exchanger. Each shelf with appurtenant he~t exchanger is thereby integrated in such a manner th~t the load-bearing capacity of the shelf is not unduly affected. Each heat ~ch~nger is equipped with one or more tubular coils. In the case in question, each heat exchanger has been equipped with one tubular coil, whose inlets and outlets are desig~ated 112a and 112b ln figure 7. The aforesaid tubular coils are conne~ted to lines 113 and 114, to which the corresponding ~2~495~
lnlets and outlets on the tubular coils in the other heat exchangers are also connected in such a ~n~r that a common or continuous piping system is obtained.
The aforesaid piping system thereby comprises vertical fixst lines 113 and 114, which in turn are connected to horizon~al second lines 115 and 116. The vertical lines link the heat ~xch~ngers withi~ the same group together, while ~he hori-zontal li~es conn2ct the heat exch nyers in the different racks. A coolant, which consists in the present case of chlorofluorocarbon in liquid form, circulates in the afoxe-said tubular coils a~d lines 113, 114 and 115, 116. Natu-rally, other coolants may also be used for ~his purpo~e. The lines 115 and 116 are also connected to a fluid cooler 117, which is included in the refrlgeratio~ eguipment employed, tog~ther with a compressor 118 and a condenser 11~. The cooler 117 wl~h compressor 118 may take the form of a tubular evaporator or a fluid cooler. The condenser (or water re-cooler) should preferably be located outside of the premi~es 120 in which the rack or racks in question are set up. The aforesaid refrigeration equipment is of tbe kind that is available on the general market, and an example of such equipment is Stal-VMR (series 100), which is supplied by Stal ~efrigeration AB, Sweden~ The refrigeration equipment does not include circulation devices or the coolant ~not shown here), an~ the directions of circulation are indicated by arrows 121 and 122, whereby direction 121 is the outgoing direction from the fluid cooler 117 and 122 is ~he incoming direction. The flow velocity of the coolant is dependent upon the capacity with which the heat e~changers are to operate in the racks. 0.2-1.5 m/s is a typical velocity of the coolant. The piping system and the tubular coils in the heat exchangers consist of tubi~g o~ e.g. copper with an :~2~ 5~
inside diame~ex of about 10 mm. The aforesaid coils and piping system are arranged in such a r~nn~r that the throughput rate in the different heat exchangers is roughly the same.
The aforesaid board magaæines, which will be described in greater detail below, are applied to their respective shelves via bracket~ or cantilever supports 123, whose detailed design is also described below. Special ar~ang -ments have been made in order to achieve e~te~sive contact surfaces between different parts of the rac~. Thus, there are extensive metallic contact surfaces at each shelf between the rack post 105' and the outgoing coolant line 113. These metallic contact surfaces are situated o~ a metal plate or a metal band or similar device which is ~ttached both to the aforesaid post 105' and the aforesaid line 113.
A metal plat~ or a metal band 125 is also arranged at each shelf be~ween the two lines 113 and 114 for the coolant. The device 125 is equipped wi~h flanges 125a. The de~ice 125 i5 further arranged so that it makes contact ~ith the back sur~a es o the board magazine when the board magazine with boards is placed on ~he shelf in question. A device 126 corresponding to device 124 is con~ected between the post 105 and the line 113 at each shelf.
Figure 8 shows two shelves 110' and 110 " placed on top of each other in a rack according to figure 1, each shelf with.
its own heat P~h~ngar 112' and 112 ", respectively. Each shelf incorporates two parallel load-~earing parts 127 and 12~ (see also figure 9). Between these load-bearing parts, a cavity 129 is provided, as shown in fugure 9. The heat exchanger 112' or 112 " in guestion is mounted in this ca~ity. The heat exchanger is thereby moun~ed in a holding device, which pre~erably takes the form of a screen or 9SC~
grille 130 ext~n~i n~ around the entire circumference of the heat exchanger. Along i~s long sides, the holding device 130 is provided with fastening pieces 130a and 130~, by means of which ~he holding device is fastened to the load-bearing parts 127 and 128. Thus, the fastening piece is fastened to the load-bearing part 127 by means o~ channels 131, which are screwed in placa or otherwise fastened by means of screws 132 or the equivalent to the load-bearing part 127 so that an extensive contact surface is o~tai~ed between the fastening piece 130a and the load-bearing part 127. The aforesaid load-bearing part preferably consists of an ex-truded bea~ of aluminium or other metallic device. The:
faste~ing piece 130b is attached to the load~earing part 128 by means of a long channel, which is attached to the load-bearing part 128 by means of screws 133 or eguivalent fasteners, whereby the piece 130b is wedged between the clamping ch~nnel and the surface of the load-bearins part.
The shelf is provided with bracket-shaped side pieces that incorporate projecting devices 134, 135, which are in~erted in corresponding slots on the concerned rack post 105 and are designed in such a manner that, after being inserted in the slot, they lock to the post to provide appropriate support for the shelf with appurtenant heat ~h~ger, board mag~7i n-os and boards .
The design o the cantilever support ~see also figur~ 7~ is shown in greater det il by figure 8. The cantilever support, has a middle section 123a that reaches across the aforesaid cavity between the load-bearing parts 127 and 128 of the shelf. The cantilever support is anchored at its ends 123b and 123c to the load bearin~ parts 127 and 128. The contact surfaces between the a~oresaid free ends 123b and 123c on the one hand ~n~ the load-bearing parts 127 and 128 on the ~4~S~
other hand are also extensive. The board magaæines 110 are placed on the aforesaid cantilever supports 123a, whose ~op surfaces 123c' have been made extensive in the horizontal plane. The ~oard magazines have a back piece, to which box-shaped or cassette-shaped pieces are applied, in which the circuit boards are placed on end. Receptacles in which the boards can be connected via matching plugs are pxovided on the front side of the back piece. The box-shaped part on the board magazine i5 co~nected via its back suxface llOa to the device 125, ~hich thereby extends along a large part of the height of the board magazine.
The aforesaid back piece and board magazi~e boxes are made with slits and/or cutouts so that free air circulation is obtained between the circuit boards placed on end in the board mag~in~S with their components. The convection that is brought about owing to, inter alia, the cold surfaces o~
the heat exchangers a~d the hot components gives rise to air currents past the components on the boards and removal of the heat ~enerated in ~he components by the air currents.
Such air currents between the boards in the board masazines are indicated in figure 8 by first arrows 136, which sym-bolize the upward air currents. Second arrows 137 symbolize down~ard air currents~ while third arrows 138 symbolize circulating air currents between the boards. In addition, heat dissipation is obt~lned by direct radiation from ~he hot board surfaces onto the heat exchangers 112' and 112 " .
The aforesaid extensive metallic contact surfaces contribute ap~reciably to heat transport rom the boards~ mag~.lnes to the colder surfaces on the heat excha~gers.
The heat exchangers in a rack are thereby designed with such large effective cooling surfaces that cooling capacities in 4~SO
excess of lS0 Watts are obtained from the heat exchangers.
It can hereby be mentioned that cooling capacities of 500 Watts or higher rom each heat exchanger are wi-thin the realm of possibility. Thanks to the speciic integration between each shelf and its heat e~changer, a large effective cooling surface can be obtained in the shelf. 1.5-4 m2 can be mentioned as an example of the size of an ef~ective cooling surface.
The integrated cooling function with heat conduction via the contact sur~ace, radiation and natural convection can be provided with the propos d principle in such a manner that, despite a high packing density of the bo~rds and their components, ~he ~x; ~. component temperature on each board can be limited to about 75C. In one proposed embodiment, however, it is proposed ~hat the heat ~h~ngerS be arrang~d and operated in such a r~nn~r that ~x~ m component tempe-ratures of about 65C or lower are obtained.
Figure 9 shows, inter alia, the connection o the devices 124 and 125 to the coolant lines 113 and 114. The devices 124 are connected via extensive contact surfa~es 124a to the rack posts 105 and lOS'. The side pieces on the shelf are indicated by 139 and 140 and the cavity between the load-bearing parts 127 and 128 is indicated by 141. The rack has a chimney-like duct 142 at the back, which contain~ the aforesaid lines 113 a~d 11~ and the connections 112a, 112b on the heat exchangers (see also fig. 10.). The figure is simplified in that ~he link between the connections 11~, 112a, 112b and the vertical pipes 113 and 114 are sym~olized by thin solid lines 143 and 144. The board maga~ines are shown schem tically, 5i nce they are assumed to be of known ~2~
Figure 10 shows the extent of the heat exchang~r ln the horizontal plane o the s~elf and its mounting in the cavity 141. ~he heat exchanger occupies a large part of the shelf's horizontal plane, for example 60-90%. The heat exchanger runs underneath the boaxd magazines and extends over the greater part of their depth. Thus~ the heat exchanger has a depth which is preferably 70-95% of the depth of the board magazines. In this r~nner, ~he heat exchanger can be made to act indirectly over the entire depth of the board. The temperature of the coolant entexing the fluid cooler 117 can be up to about +30C. The temperature of ~he outgoing coolant ~rom the cooler can be down to ~15C.
The invention is not li.mited to the versions described above as examples, but can be subject to modifications within the framework of the following patent claims and invention concept. Values of temperature, cooling surface etc. can, for e~ample, vary from one ~mbodiment to another.
lnlets and outlets on the tubular coils in the other heat exchangers are also connected in such a ~n~r that a common or continuous piping system is obtained.
The aforesaid piping system thereby comprises vertical fixst lines 113 and 114, which in turn are connected to horizon~al second lines 115 and 116. The vertical lines link the heat ~xch~ngers withi~ the same group together, while ~he hori-zontal li~es conn2ct the heat exch nyers in the different racks. A coolant, which consists in the present case of chlorofluorocarbon in liquid form, circulates in the afoxe-said tubular coils a~d lines 113, 114 and 115, 116. Natu-rally, other coolants may also be used for ~his purpo~e. The lines 115 and 116 are also connected to a fluid cooler 117, which is included in the refrlgeratio~ eguipment employed, tog~ther with a compressor 118 and a condenser 11~. The cooler 117 wl~h compressor 118 may take the form of a tubular evaporator or a fluid cooler. The condenser (or water re-cooler) should preferably be located outside of the premi~es 120 in which the rack or racks in question are set up. The aforesaid refrigeration equipment is of tbe kind that is available on the general market, and an example of such equipment is Stal-VMR (series 100), which is supplied by Stal ~efrigeration AB, Sweden~ The refrigeration equipment does not include circulation devices or the coolant ~not shown here), an~ the directions of circulation are indicated by arrows 121 and 122, whereby direction 121 is the outgoing direction from the fluid cooler 117 and 122 is ~he incoming direction. The flow velocity of the coolant is dependent upon the capacity with which the heat e~changers are to operate in the racks. 0.2-1.5 m/s is a typical velocity of the coolant. The piping system and the tubular coils in the heat exchangers consist of tubi~g o~ e.g. copper with an :~2~ 5~
inside diame~ex of about 10 mm. The aforesaid coils and piping system are arranged in such a r~nn~r that the throughput rate in the different heat exchangers is roughly the same.
The aforesaid board magaæines, which will be described in greater detail below, are applied to their respective shelves via bracket~ or cantilever supports 123, whose detailed design is also described below. Special ar~ang -ments have been made in order to achieve e~te~sive contact surfaces between different parts of the rac~. Thus, there are extensive metallic contact surfaces at each shelf between the rack post 105' and the outgoing coolant line 113. These metallic contact surfaces are situated o~ a metal plate or a metal band or similar device which is ~ttached both to the aforesaid post 105' and the aforesaid line 113.
A metal plat~ or a metal band 125 is also arranged at each shelf be~ween the two lines 113 and 114 for the coolant. The device 125 is equipped wi~h flanges 125a. The de~ice 125 i5 further arranged so that it makes contact ~ith the back sur~a es o the board magazine when the board magazine with boards is placed on ~he shelf in question. A device 126 corresponding to device 124 is con~ected between the post 105 and the line 113 at each shelf.
Figure 8 shows two shelves 110' and 110 " placed on top of each other in a rack according to figure 1, each shelf with.
its own heat P~h~ngar 112' and 112 ", respectively. Each shelf incorporates two parallel load-~earing parts 127 and 12~ (see also figure 9). Between these load-bearing parts, a cavity 129 is provided, as shown in fugure 9. The heat exchanger 112' or 112 " in guestion is mounted in this ca~ity. The heat exchanger is thereby moun~ed in a holding device, which pre~erably takes the form of a screen or 9SC~
grille 130 ext~n~i n~ around the entire circumference of the heat exchanger. Along i~s long sides, the holding device 130 is provided with fastening pieces 130a and 130~, by means of which ~he holding device is fastened to the load-bearing parts 127 and 128. Thus, the fastening piece is fastened to the load-bearing part 127 by means o~ channels 131, which are screwed in placa or otherwise fastened by means of screws 132 or the equivalent to the load-bearing part 127 so that an extensive contact surface is o~tai~ed between the fastening piece 130a and the load-bearing part 127. The aforesaid load-bearing part preferably consists of an ex-truded bea~ of aluminium or other metallic device. The:
faste~ing piece 130b is attached to the load~earing part 128 by means of a long channel, which is attached to the load-bearing part 128 by means of screws 133 or eguivalent fasteners, whereby the piece 130b is wedged between the clamping ch~nnel and the surface of the load-bearins part.
The shelf is provided with bracket-shaped side pieces that incorporate projecting devices 134, 135, which are in~erted in corresponding slots on the concerned rack post 105 and are designed in such a manner that, after being inserted in the slot, they lock to the post to provide appropriate support for the shelf with appurtenant heat ~h~ger, board mag~7i n-os and boards .
The design o the cantilever support ~see also figur~ 7~ is shown in greater det il by figure 8. The cantilever support, has a middle section 123a that reaches across the aforesaid cavity between the load-bearing parts 127 and 128 of the shelf. The cantilever support is anchored at its ends 123b and 123c to the load bearin~ parts 127 and 128. The contact surfaces between the a~oresaid free ends 123b and 123c on the one hand ~n~ the load-bearing parts 127 and 128 on the ~4~S~
other hand are also extensive. The board magaæines 110 are placed on the aforesaid cantilever supports 123a, whose ~op surfaces 123c' have been made extensive in the horizontal plane. The ~oard magazines have a back piece, to which box-shaped or cassette-shaped pieces are applied, in which the circuit boards are placed on end. Receptacles in which the boards can be connected via matching plugs are pxovided on the front side of the back piece. The box-shaped part on the board magazine i5 co~nected via its back suxface llOa to the device 125, ~hich thereby extends along a large part of the height of the board magazine.
The aforesaid back piece and board magazi~e boxes are made with slits and/or cutouts so that free air circulation is obtained between the circuit boards placed on end in the board mag~in~S with their components. The convection that is brought about owing to, inter alia, the cold surfaces o~
the heat exchangers a~d the hot components gives rise to air currents past the components on the boards and removal of the heat ~enerated in ~he components by the air currents.
Such air currents between the boards in the board masazines are indicated in figure 8 by first arrows 136, which sym-bolize the upward air currents. Second arrows 137 symbolize down~ard air currents~ while third arrows 138 symbolize circulating air currents between the boards. In addition, heat dissipation is obt~lned by direct radiation from ~he hot board surfaces onto the heat exchangers 112' and 112 " .
The aforesaid extensive metallic contact surfaces contribute ap~reciably to heat transport rom the boards~ mag~.lnes to the colder surfaces on the heat excha~gers.
The heat exchangers in a rack are thereby designed with such large effective cooling surfaces that cooling capacities in 4~SO
excess of lS0 Watts are obtained from the heat exchangers.
It can hereby be mentioned that cooling capacities of 500 Watts or higher rom each heat exchanger are wi-thin the realm of possibility. Thanks to the speciic integration between each shelf and its heat e~changer, a large effective cooling surface can be obtained in the shelf. 1.5-4 m2 can be mentioned as an example of the size of an ef~ective cooling surface.
The integrated cooling function with heat conduction via the contact sur~ace, radiation and natural convection can be provided with the propos d principle in such a manner that, despite a high packing density of the bo~rds and their components, ~he ~x; ~. component temperature on each board can be limited to about 75C. In one proposed embodiment, however, it is proposed ~hat the heat ~h~ngerS be arrang~d and operated in such a r~nn~r that ~x~ m component tempe-ratures of about 65C or lower are obtained.
Figure 9 shows, inter alia, the connection o the devices 124 and 125 to the coolant lines 113 and 114. The devices 124 are connected via extensive contact surfa~es 124a to the rack posts 105 and lOS'. The side pieces on the shelf are indicated by 139 and 140 and the cavity between the load-bearing parts 127 and 128 is indicated by 141. The rack has a chimney-like duct 142 at the back, which contain~ the aforesaid lines 113 a~d 11~ and the connections 112a, 112b on the heat exchangers (see also fig. 10.). The figure is simplified in that ~he link between the connections 11~, 112a, 112b and the vertical pipes 113 and 114 are sym~olized by thin solid lines 143 and 144. The board maga~ines are shown schem tically, 5i nce they are assumed to be of known ~2~
Figure 10 shows the extent of the heat exchang~r ln the horizontal plane o the s~elf and its mounting in the cavity 141. ~he heat exchanger occupies a large part of the shelf's horizontal plane, for example 60-90%. The heat exchanger runs underneath the boaxd magazines and extends over the greater part of their depth. Thus~ the heat exchanger has a depth which is preferably 70-95% of the depth of the board magazines. In this r~nner, ~he heat exchanger can be made to act indirectly over the entire depth of the board. The temperature of the coolant entexing the fluid cooler 117 can be up to about +30C. The temperature of ~he outgoing coolant ~rom the cooler can be down to ~15C.
The invention is not li.mited to the versions described above as examples, but can be subject to modifications within the framework of the following patent claims and invention concept. Values of temperature, cooling surface etc. can, for e~ample, vary from one ~mbodiment to another.
Claims (46)
1. Apparatus for cooling telecommunications equipment consisting of component-carrying printed circuit boards arranged in board magazines, comprising a rack having shelves arranged one above the other in said rack, at least one shelf having an individual heat exchanger incorporating cooling flanges and at least one tubular coil, a cooler having lines connected to the heat exchanger to cause a coolant to run in the tubular coil; the heat exchanger, viewed in the horizontal plane of its shelf, extending along a major portion of the area of the shelf; and at least one heat transfer member having extensive heat-conducting metallic contact surfaces arranged to contact the board magazine and mounted in heat transfer relation to the associated shelf as well as the heat exchanger;
and that the aforesaid heat exchangers and cooler are arranged in such a manner that they contribute towards removing the heat given off by the telecommunications equipment by means of heat conduction via the extensive contact surfaces, independent of packing density of the telecommunications equipment in the rack and a the rate of heat emission.
and that the aforesaid heat exchangers and cooler are arranged in such a manner that they contribute towards removing the heat given off by the telecommunications equipment by means of heat conduction via the extensive contact surfaces, independent of packing density of the telecommunications equipment in the rack and a the rate of heat emission.
2. Apparatus according to claim 1 wherein each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler.
3. Apparatus according to claim 2, wherein the cooler is common to all heat exchangers.
4. Apparatus according to claim 1 wherein heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C.
5. Apparatus according to patent claim 1, wherein each heat exchanger has an effective cooling surface of up to 1.5m2.
6. Apparatus according to claim 1, wherein each heat exchanger has a cooling capacity in excess of 150 Watts.
7. Apparatus according to claim 1, wherein each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack.
8. Apparatus according to claim 1, comprising a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves; each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers.
9. Apparatus according to claim 1, wherein each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device.
10. Apparatus according to claim 1, wherein each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device consisting of a grille, connected to the associated shelf at least along its two long sides.
11. Apparatus according to claim 9 or 10, wherein each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the opening; the cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the associated shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger.
12. Apparatus according to claim 1, wherein metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, coolant lines, the board magazines, the shelves and the racks.
13. Apparatus according to claim 1, wherein the coolant circulated in the cooling system has a temperature entering the cooler of up to about +30°C and a temperature leaving the cooler of about +15°C.
14. Apparatus according to claim 13, wherein the coolant consists of chlorofluorocarbon in liquid form.
15. Apparatus according to claim 8, wherein the source of air flow for generation of the upward air stream in the rack or racks and the air circulation on the premises is incorporated in a refrigeration module including a cooling coil, a compressor, a fan and a condenser or water recooler located outside the premises.
16. Apparatus as claimed in claim 15 wherein the refrigeration module is a direct expansion module.
17. Apparatus according to patent claim 15 or 16, wherein the refrigeration module is arranged to create forced upward air streams in each rack, bringing about a cooling capacity of 150 Watts or more at the heat exchanger of each shelf.
18. Apparatus according to claim 1, wherein the shelves in the racks are arranged to carry, in addition to various telecommunications units, the aforesaid magazines with boards with printed wiring and telecommunications components; the upward air streams pass upwards between the boards and are directed out into a chimney duct via a rear portion of the rack;
and the heat exchangers extend from the rear portion of the rack in the direction towards a front portion of the rack in such a manner that they occupy about 2/3 of the depth of the shelf thus further providing favourable cooling of the rear portions of the rack.
and the heat exchangers extend from the rear portion of the rack in the direction towards a front portion of the rack in such a manner that they occupy about 2/3 of the depth of the shelf thus further providing favourable cooling of the rear portions of the rack.
19. Apparatus according to claim 1, wherein the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C, said apparatus further comprising at least one of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers.
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers.
20. Apparatus according to claim 1, wherein each heat exchanger has an effective cooling surface of up to 1.5m2, said apparatus further comprising at least one of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C.
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C.
21. Apparatus according to claim l, wherein each heat exchanger has a cooling capacity in excess of 150 Watts, said apparatus further comprising at least one of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2.
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2.
22. Apparatus according to claim 1, wherein each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack, said apparatus further comprising at least one of the following features:
a) each of at least one half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts.
a) each of at least one half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts.
23. Apparatus according to claim 1, wherein incorporating a cooling system arranged on the premises the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the shelves; each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers, said apparatus further comprising at least one of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack.
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack.
24. Apparatus according to claim 1, wherein each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device, said apparatus further comprising at least one of the following features:
a) each of at least one half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus includes a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack's shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plance; the aforesaid upward air stream in each rack passing by cooling flanges on the heat exchangers.
a) each of at least one half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus includes a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack's shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plance; the aforesaid upward air stream in each rack passing by cooling flanges on the heat exchangers.
25. Apparatus according to claim 20, further comprising the feature of the holding device consisting of a grille connected to the associated shelf at least along its two long sides.
26. Apparatus according to claim 20 or 21, wherein each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the opening; that the cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger.
27. Apparatus according to claim 1, wherein metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks, said apparatus further comprising at least one of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus comprises a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers;
h) each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device;
i) the holding device consists of a grille connected to the associated shelf at least along its two long sides;
j) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the cavity; cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger.
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus comprises a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers;
h) each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device;
i) the holding device consists of a grille connected to the associated shelf at least along its two long sides;
j) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the cavity; cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger.
28. Apparatus according to claim 1, wherein the coolant circulated in the cooling system has a temperature entering the cooler of up to about +30°C and a temperature leaving the cooler of about +15°C, said apparatus further comprising at least one of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus comprises a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers;.
h) each shelf is provided with an opening, in which the heat exchanger belonging to that shelf is mounted by means of a holding device;
i) the holding device consists of a grille connected to the associated shelf at least along its two long sides;
j) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections extend across the cavity; the cantilever supports carry on their middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger;
k) metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks;
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus comprises a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers;.
h) each shelf is provided with an opening, in which the heat exchanger belonging to that shelf is mounted by means of a holding device;
i) the holding device consists of a grille connected to the associated shelf at least along its two long sides;
j) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections extend across the cavity; the cantilever supports carry on their middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger;
k) metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks;
29. Apparatus as claimed in claim 24, wherein the coolant consists of chlorofluorocarbon in liquid form.
30. Apparatus as claimed in claim 23, wherein the source of air flow for generation of the upward air stream in the rack or racks and the air circulation on the premises is incorporated in a refrigeration module including a cooling coil, a compressor, a fan and a condenser or water re-cooler located outside the premises, said apparatus further comprising one or more of the following features:
a) each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device:
b) the holding device consists of a grille connected to the associated shelf at least along its two long sides, c) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the cavity; cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger;
d) metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks;
e) the coolant circulated in the cooling system has a temperature entering the cooler of up to about +30°C and a temperature leaving the cooler of down to about +15°C;
f) the coolant consists of chlorofluorocarbon in liquid form.
a) each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device:
b) the holding device consists of a grille connected to the associated shelf at least along its two long sides, c) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the cavity; cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger;
d) metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks;
e) the coolant circulated in the cooling system has a temperature entering the cooler of up to about +30°C and a temperature leaving the cooler of down to about +15°C;
f) the coolant consists of chlorofluorocarbon in liquid form.
31. A device as claimed in claim 30, wherein the refrigeration module wherein the refrigeration module is a direct expansion module.
32. Apparatus according to claim 30 or 31, wherein the refrigeration module is arranged to create forced upward air streams in each rack, bringing about a cooling capacity of 150 Watts or more at the heat exchanger of each shelf.
33. Apparatus as claimed in claim 1, wherein the shelves in the racks are arranged to carry, in addition to various telecommunications units, the aforesaid magazines with boards with printed wiring and telecommunications components; the upward air streams pass upwards between the boards and are directed out into a chimney duct via a rear portion of the rack;
and the heat exchangers extend from the rear portion of the rack in the direction towards the front portion of the rack in such a manner that they occupy about 2/3 of the depth of the shelf, thus further providing favourable cooling of the rear portions of the rack, said apparatus further comprising one or more of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus comprises a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers;
h) each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device;
i) the holding device consists of a grille connected to the associated shelf at least along its two long sides;
j) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the cavity; cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger;
k) metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks:
l) the coolant circulated in the cooling system has a temperature entering the cooler of up to about +30°C and a temperature leaving the cooler of down to about +15°C;
m) the coolant consists of chlorofluorocarbon in liquid form;
n) the source of air flow for generation of the upward air stream in the rack or racks and the air circulation on the premises is incorporated in a refrigeration module including a cooling coil, a compressor, a fan and a condenser or water re-cooler located outside the premises;
o) the refrigeration module includes a filter, p) the refrigeration module is arranged to create forced upward air streams in each rack, bringing about a cooling capacity of 150 Watts or more at the heat exchanger of each shelf.
and the heat exchangers extend from the rear portion of the rack in the direction towards the front portion of the rack in such a manner that they occupy about 2/3 of the depth of the shelf, thus further providing favourable cooling of the rear portions of the rack, said apparatus further comprising one or more of the following features:
a) each of at least one-half of the rack shelves is provided with its own heat exchanger, the tubular coils of the heat exchanger being interconnected with the coils of the other heat exchangers and being connected to the cooler;
b) the cooler is common to all heat exchangers;
c) the heat exchangers and the cooler are arranged to ensure that the component temperatures for each board will not exceed about 75°C;
d) each heat exchanger has an effective cooling surface of up to 1.5m2;
e) each heat exchanger has a cooling capacity in excess of 150 Watts;
f) each rack, with its shelf-integrated heat exchangers, functions as a cooling buffer on the premises where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack;
g) the apparatus comprises a cooling system arranged on the premises, the cooling system including a source of forced air flow, and conduit means for conducting the air flow, said conduit means comprising one or more air ducts underneath the respective rack or racks so that an upward air stream is created within each rack passing by the shelves and by the telecommunications equipment disposed thereon, to emerge at a top part of the rack into the ambient atmosphere; a heat exchanger with corresponding cooling fins and coolant-conducting tubular coil being mounted on each or at least on most of the rack shelves;
each heat exchanger extending over a major part of the area of the shelf as measured in a generally horizontal plane; the aforesaid upward air stream in each rack passing by the cooling flanges on the heat exchangers;
h) each shelf is provided with an opening in which the heat exchanger belonging to that shelf is mounted by means of a holding device;
i) the holding device consists of a grille connected to the associated shelf at least along its two long sides;
j) each shelf includes two essentially parallel load-bearing parts between which the opening extends; cantilever supports are arranged at the load-bearing parts so that middle sections of the supports extend across the cavity; cantilever supports carry on the middle sections one or more board magazines; the extensive metallic contact surfaces include attachment surfaces between the holding device and the shelf, between the cantilever supports and the body of the shelf and between the middle sections and board magazines, providing for effective heat conduction between the interiors of the board magazines and the heat exchanger;
k) metallic heat-conducting devices are connected between all units of the heat exchangers, the tubular coil or coils, the board magazines, the shelves and the racks:
l) the coolant circulated in the cooling system has a temperature entering the cooler of up to about +30°C and a temperature leaving the cooler of down to about +15°C;
m) the coolant consists of chlorofluorocarbon in liquid form;
n) the source of air flow for generation of the upward air stream in the rack or racks and the air circulation on the premises is incorporated in a refrigeration module including a cooling coil, a compressor, a fan and a condenser or water re-cooler located outside the premises;
o) the refrigeration module includes a filter, p) the refrigeration module is arranged to create forced upward air streams in each rack, bringing about a cooling capacity of 150 Watts or more at the heat exchanger of each shelf.
34. Apparatus in a work space cooling telecommunications equipment consisting of component-carrying printed circuit boards arranged in board magazines, comprising a rack having shelves arranged on top of one another in said rack at least one shelf having an individual heat exchanger which comprises cooling flanges and at least one tubular coil, a cooler having lines connected to the heat exchanger to cause a coolant to run in the tubular coil; the heat exchanger, viewed in the horizontal plane of its shelf extending along at least one half the length of the shelf; and at least one heat transfer member having extensive heat-conducting metallic contact surfaces arranged to contact the board magazine and mounted in heat-transfer relation to the associated shelf as well as the heat exchanger; at least a part of said heat-transfer member supporting said magazine to assure heat transfer from said magazine to said member, so that said heat exchanger and cooler contribute towards removing the heat given off by the telecommunications equipment by means of heat conduction through said extensive contact surfaces, independent of packing density of the aforesaid telecommunications equipment in the rack and the rate of heat emission.
35. Apparatus according to claim 34, wherein at least half of the rack's shelves have an individual heat exchanger integrated with the shelf, each of the heat exchangers having tubular coils interconnected with the coils of the other heat exchangers and connected to said cooler.
36. Apparatus according to claim 34, wherein said heat transfer member comprises a metallic heat conducting device connected between the cooler lines, the shelves, and the rack, and positioned to contact the board magazine.
37. Apparatus according to claim 36, wherein said device is disposed vertically at the back of the shelf, and has fins projecting forwardly therefrom.
38. Apparatus according to claim 34, wherein said shelf has a central opening therethrough, said heat exchanger being mounted in said opening, said heat-transfer member comprising a perforate grille contacting said cooling flanges and spanning across said opening so as to afford airflow upwardly through said opening and over said cooling flanges and coil and through said grille.
39. Apparatus according to claim 38, wherein said rack is set up in the work space to afford flow of air from the work space through the rack, the rack with its shelf integrated heat exchanger functioning as a cooling device for the work space where the rack is set up, while simultaneously bringing about cooling of the telecommunications equipment in the rack.
40. Apparatus according to claim 39, wherein the work space comprises a cooling system having an air source and an air duct open underneath the rack arranged so that an upward air stream is created within the rack, where it passes through the openings of different shelves and emerges at the top part of the rack into the atmosphere of the work space; at least half of the rack's shelves having a heat exchanger extending over at least half of the area of the shelf that is perpendicular to the vertical direction of the rack, the aforesaid upward air stream in the rack passing over the cooling flanges on the heat exchangers in the shelves provided with heat exchangers.
41. Apparatus according to claim 38, wherein said opening extends in the horizontal plane, said shelf including a holding device mounting the heat exchanger in the shelf, said device consisting of a screen connected to the associated shelf along its two long sides to comprise said heat transfer member.
42. Apparatus according to claim 41, characterized in that the shelf comprises two essentially parallel load-bearing parts between which said opening extends, cantilever supports arranged on the load-bearing parts so that their middle sections extend across the opening adapted to carry on their middle sections one or more board magazines; said heat transfer member including the holding device and the cantilever supports providing effective heat conduction between the interiors of the board magazines where the boards are placed on end and the heat exchanger.
43. Apparatus according to claim 42, wherein said load bearing parts extend downwardly and outwardly from the back of the rack, said heat exchanger being mounted between said parts with its holding device surface horizontal, such that the rearward part of said holding device is situated within said opening below the load-bearing part and the forward part of the holding device is situated above said opening and the load-bearing part.
44. Apparatus according to claim 38, wherein said rack is set up in the work space, said apparatus including an air source for generation of an upward air stream through the rack and a refrigeration module having a cooling coil for said air stream, a compressor and a fan in the work space and a condenser or water recooler outside the work space.
45. Apparatus according to claim 44, wherein the refrigeration module in the work space is connected to the heat exchanger on said shelf, and comprises said cooler for supplying coolant to the coils thereof.
46. Apparatus according to claim 38, wherein said shelves on the rack are arranged to cause upward air flow to pass upwards between the boards in the magazines and out, said apparatus including a chimney duct at the rear of the rack to receive said out flow, the heat exchangers extending from the rear of the rack in the direction towards the front of the rack so as to occupy about 2/3 of the shelf's depth, providing favourable cooling at the rear portions of the rack.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE8107178-9 | 1981-12-02 | ||
| SE8107178A SE444102C (en) | 1981-12-02 | 1981-12-02 | DEVICE FOR COOLING TELETECHNICAL EQUIPMENT IN STAND |
| SE8206618A SE451229B (en) | 1982-11-19 | 1982-11-19 | Cooling unit for telecommunications equipment stack |
| SE8206618-4 | 1982-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1204950A true CA1204950A (en) | 1986-05-27 |
Family
ID=26658029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000416737A Expired CA1204950A (en) | 1981-12-02 | 1982-12-01 | Apparatus for cooling telecommunications equipment in a rack |
Country Status (10)
| Country | Link |
|---|---|
| AU (1) | AU555796B2 (en) |
| BE (1) | BE895231A (en) |
| CA (1) | CA1204950A (en) |
| DE (1) | DE3244654A1 (en) |
| DK (1) | DK533982A (en) |
| FI (1) | FI78593C (en) |
| GB (1) | GB2113012B (en) |
| LU (1) | LU84498A1 (en) |
| NL (1) | NL8204683A (en) |
| NO (1) | NO163590C (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2568712B1 (en) * | 1984-07-31 | 1987-01-09 | Bull Sems | AIR COOLING SYSTEM FOR CABINET CONTAINING ELECTRONIC CIRCUITS |
| CH670541A5 (en) * | 1985-12-13 | 1989-06-15 | Hasler Ag Ascom | Lost heat removal method for module of electrical elements |
| ES2024412B3 (en) * | 1985-12-13 | 1992-03-01 | Hasler Ag Ascom | PROCEDURE AND DEVICE FOR THE EVACUATION OF LOST HEAT FROM AT LEAST ONE GROUP OF CONSTRUCTION OF ELECTRICAL ELEMENTS |
| EP0361196B1 (en) * | 1988-09-29 | 1992-12-02 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Cooling liquid distribution system |
| US5054296A (en) * | 1989-05-16 | 1991-10-08 | Furukawa Electric Co., Ltd. | Pipe for cooling unit, cooling unit and individual cooling system |
| US5253613A (en) * | 1992-04-30 | 1993-10-19 | General Electric Company | High power AC traction inverter cooling |
| US5289694A (en) * | 1993-02-26 | 1994-03-01 | At&T Bell Laboratories | Circuit card mounting assembly |
| US5823005A (en) * | 1997-01-03 | 1998-10-20 | Ncr Corporation | Focused air cooling employing a dedicated chiller |
| DE19815645C1 (en) * | 1998-04-07 | 1999-08-19 | Siemens Ag | Electronic converter arrangement with cooling system |
| US5940270A (en) * | 1998-07-08 | 1999-08-17 | Puckett; John Christopher | Two-phase constant-pressure closed-loop water cooling system for a heat producing device |
| GB2354062A (en) | 1999-09-13 | 2001-03-14 | British Broadcasting Corp | Cooling system for use in cooling electronic equipment |
| WO2001072099A2 (en) † | 2000-03-21 | 2001-09-27 | Liebert Corporation | Method and apparatus for cooling electronic enclosures |
| US6854659B2 (en) * | 2001-09-21 | 2005-02-15 | Kliebert Corporation | Interactive sensors for environmental control |
| US8261565B2 (en) | 2003-12-05 | 2012-09-11 | Liebert Corporation | Cooling system for high density heat load |
| WO2007018994A2 (en) | 2005-08-04 | 2007-02-15 | Liebert Corporation | Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation system |
| US7856528B1 (en) | 2009-08-11 | 2010-12-21 | Texas Memory Systems, Inc. | Method and apparatus for protecting data using variable size page stripes in a FLASH-based storage system |
| RU174020U1 (en) * | 2016-08-03 | 2017-09-26 | Закрытое акционерное общество "Группа компаний "Электрощит"-ТМ Самара" | COOLED COMPARTMENT OF HIGH-VOLTAGE CABINETS OF COMPLETE DISTRIBUTION DEVICE WITH PHASE-SOLID INSULATION |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1284506B (en) * | 1964-10-24 | 1968-12-05 | Linde Ag | Support plate for temperature-sensitive electrical circuit parts |
| US3550681A (en) * | 1968-12-30 | 1970-12-29 | Gen Motors Corp | Self-adjusting thermal connector |
| US3717798A (en) * | 1971-01-21 | 1973-02-20 | Sprague Electric Co | Overlay for ohmic contact electrodes |
| GB1336076A (en) * | 1971-06-10 | 1973-11-07 | Int Computers Ltd | Apparatus for cooling electrical circuit components |
| DE2138376C3 (en) * | 1971-07-31 | 1978-05-24 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Cooling system for electronic devices housed in cabinets |
| GB1521464A (en) * | 1975-10-15 | 1978-08-16 | Thorn Automation Ltd | Mounting of electrical equipment for cooling |
| DE2613366A1 (en) * | 1976-03-29 | 1977-10-13 | Siemens Ag | Heat removal system for printed circuit boards - has vertical rectangular channels with holes to which horizontal channels are connected |
| GB1563091A (en) * | 1976-08-12 | 1980-03-19 | Redpoint Ass Ltd | Heat dissipation arrangemnts |
| DE2930777A1 (en) * | 1979-07-28 | 1981-02-12 | Licentia Gmbh | Releasable clamp for printed circuit boards - has grooves for sleeves featuring leaf springs projecting through openings of adjustable slide |
-
1982
- 1982-12-01 FI FI824136A patent/FI78593C/en not_active IP Right Cessation
- 1982-12-01 DK DK533982A patent/DK533982A/en not_active Application Discontinuation
- 1982-12-01 AU AU91043/82A patent/AU555796B2/en not_active Ceased
- 1982-12-01 NO NO824025A patent/NO163590C/en unknown
- 1982-12-01 CA CA000416737A patent/CA1204950A/en not_active Expired
- 1982-12-01 GB GB08234285A patent/GB2113012B/en not_active Expired
- 1982-12-02 NL NL8204683A patent/NL8204683A/en not_active Application Discontinuation
- 1982-12-02 LU LU84498A patent/LU84498A1/en unknown
- 1982-12-02 DE DE19823244654 patent/DE3244654A1/en active Granted
- 1982-12-02 BE BE0/209637A patent/BE895231A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| AU555796B2 (en) | 1986-10-09 |
| BE895231A (en) | 1983-03-31 |
| NO824025L (en) | 1983-06-03 |
| GB2113012B (en) | 1986-01-02 |
| DE3244654A1 (en) | 1983-06-09 |
| FI824136A0 (en) | 1982-12-01 |
| LU84498A1 (en) | 1984-10-22 |
| AU9104382A (en) | 1983-06-09 |
| GB2113012A (en) | 1983-07-27 |
| NO163590C (en) | 1990-06-20 |
| FI824136L (en) | 1983-06-03 |
| DK533982A (en) | 1983-06-03 |
| NL8204683A (en) | 1983-07-01 |
| FI78593B (en) | 1989-04-28 |
| DE3244654C2 (en) | 1993-01-28 |
| FI78593C (en) | 1989-08-10 |
| NO163590B (en) | 1990-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |