JP2007513520A - 発光ダイオードに基づく照明組立体 - Google Patents

発光ダイオードに基づく照明組立体 Download PDF

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Publication number
JP2007513520A
JP2007513520A JP2006542591A JP2006542591A JP2007513520A JP 2007513520 A JP2007513520 A JP 2007513520A JP 2006542591 A JP2006542591 A JP 2006542591A JP 2006542591 A JP2006542591 A JP 2006542591A JP 2007513520 A JP2007513520 A JP 2007513520A
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JP
Japan
Prior art keywords
layer
substrate
lighting device
conductive
assembly
Prior art date
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Application number
JP2006542591A
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English (en)
Japanese (ja)
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JP2007513520A5 (enExample
Inventor
シー． シュルツ，ジョン
ケー． ラーソン，ドナルド
エヌ． ミラー，マイケル
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2007513520A publication Critical patent/JP2007513520A/ja
Publication of JP2007513520A5 publication Critical patent/JP2007513520A5/ja
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Structure Of Printed Boards (AREA)
JP2006542591A 2003-12-02 2004-11-09 発光ダイオードに基づく照明組立体 Withdrawn JP2007513520A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/727,220 US20050116235A1 (en) 2003-12-02 2003-12-02 Illumination assembly
PCT/US2004/037522 WO2005062382A2 (en) 2003-12-02 2004-11-09 Light emitting diode based illumination assembly

Publications (2)

Publication Number Publication Date
JP2007513520A true JP2007513520A (ja) 2007-05-24
JP2007513520A5 JP2007513520A5 (enExample) 2007-12-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006542591A Withdrawn JP2007513520A (ja) 2003-12-02 2004-11-09 発光ダイオードに基づく照明組立体

Country Status (7)

Country Link
US (1) US20050116235A1 (enExample)
EP (1) EP1692722A2 (enExample)
JP (1) JP2007513520A (enExample)
KR (1) KR20060121261A (enExample)
CN (1) CN1902757A (enExample)
TW (1) TW200528665A (enExample)
WO (1) WO2005062382A2 (enExample)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009099715A (ja) * 2007-10-16 2009-05-07 Fujikura Ltd 発光装置
JP2011508941A (ja) * 2007-12-21 2011-03-17 スリーエム イノベイティブ プロパティズ カンパニー 低プロファイルの可撓性ケーブル照明アセンブリ及びその製造方法
JP2011142072A (ja) * 2009-12-09 2011-07-21 Tyco Electronics Corp 半導体照明組立体
JP2012039122A (ja) * 2010-08-09 2012-02-23 Lg Innotek Co Ltd 発光素子
JP2012039121A (ja) * 2010-08-09 2012-02-23 Lg Innotek Co Ltd 発光素子
JP2012109404A (ja) * 2010-11-17 2012-06-07 Panasonic Corp 発光装置および発光装置を備える照明装置
KR101259304B1 (ko) 2011-03-14 2013-05-06 샤프 가부시키가이샤 Ｌｅｄ 실장용 기판 및 ｌｅｄ 모듈의 제조 방법
JP2013157341A (ja) * 2012-01-05 2013-08-15 Canon Components Inc Ｌｅｄ照明装置
JP2014506386A (ja) * 2010-12-29 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー Ｌｅｄ色結合器
KR101418374B1 (ko) * 2008-01-29 2014-07-11 삼성디스플레이 주식회사 인쇄 회로 기판 및 이를 포함하는 백라이트 유니트, 액정표시 장치
US8872330B2 (en) 2006-08-04 2014-10-28 Osram Opto Semiconductors Gmbh Thin-film semiconductor component and component assembly
US8963012B2 (en) 2011-01-17 2015-02-24 Canon Components, Inc. Flexible circuit board
JP2015056428A (ja) * 2013-09-10 2015-03-23 ウシオ電機株式会社 発光モジュール装置
JP2015056654A (ja) * 2013-09-10 2015-03-23 菱生精密工業股▲分▼有限公司 半導体装置及びその製造方法
JP2015515101A (ja) * 2012-04-05 2015-05-21 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄ照明構造
JP2015153981A (ja) * 2014-02-18 2015-08-24 日亜化学工業株式会社 発光装置
US9232634B2 (en) 2011-01-17 2016-01-05 Canon Components, Inc. Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus
WO2016104609A1 (ja) * 2014-12-25 2016-06-30 大日本印刷株式会社 Ｌｅｄ素子用基板、ｌｅｄ実装モジュール、及び、それらを用いたｌｅｄ表示装置
JP2016122815A (ja) * 2014-12-25 2016-07-07 大日本印刷株式会社 Ｌｅｄ素子用基板
JP2017501592A (ja) * 2013-12-18 2017-01-12 フレックスブライト オサケ ユキチュアＦｌｅｘｂｒｉｇｈｔ Ｏｙ 発光膜構造体
JP2017518636A (ja) * 2014-05-15 2017-07-06 スリーエム イノベイティブ プロパティズ カンパニー 反射基材上のフレキシブル回路
US9812625B2 (en) 2014-02-18 2017-11-07 Nichia Corporation Light-emitting device having resin member with conductive particles

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EP1567894A2 (en) 2002-12-02 2005-08-31 3M Innovative Properties Company Illumination system using a plurality of light sources
EP1588434A2 (en) * 2003-01-27 2005-10-26 3M Innovative Properties Company Phosphor based light source component and method of making
US7622743B2 (en) * 2003-11-04 2009-11-24 Panasonic Corporation Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
KR100583252B1 (ko) * 2003-12-29 2006-05-24 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
WO2011143510A1 (en) 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
US7255469B2 (en) * 2004-06-30 2007-08-14 3M Innovative Properties Company Phosphor based illumination system having a light guide and an interference reflector
US7204630B2 (en) * 2004-06-30 2007-04-17 3M Innovative Properties Company Phosphor based illumination system having a plurality of light guides and an interference reflector
US7182498B2 (en) * 2004-06-30 2007-02-27 3M Innovative Properties Company Phosphor based illumination system having a plurality of light guides and an interference reflector
US7204631B2 (en) * 2004-06-30 2007-04-17 3M Innovative Properties Company Phosphor based illumination system having a plurality of light guides and an interference reflector
US7213958B2 (en) * 2004-06-30 2007-05-08 3M Innovative Properties Company Phosphor based illumination system having light guide and an interference reflector
JP4031784B2 (ja) * 2004-07-28 2008-01-09 シャープ株式会社 発光モジュールおよびその製造方法
US20060038485A1 (en) * 2004-08-18 2006-02-23 Harvatek Corporation Laminated light-emitting diode display device and manufacturing method thereof
US7390097B2 (en) * 2004-08-23 2008-06-24 3M Innovative Properties Company Multiple channel illumination system
US20060086945A1 (en) * 2004-10-27 2006-04-27 Harvatek Corporation Package structure for optical-electrical semiconductor
US7303315B2 (en) * 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
CA2617314A1 (en) * 2005-04-05 2006-10-12 Tir Technology Lp Mounting assembly for optoelectronic devices
US7293906B2 (en) * 2005-05-23 2007-11-13 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Light source adapted for LCD back-lit displays
JP4511446B2 (ja) * 2005-10-31 2010-07-28 ニチコン株式会社 光源装置
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly
US7505275B2 (en) * 2005-11-04 2009-03-17 Graftech International Holdings Inc. LED with integral via
KR101347486B1 (ko) * 2006-01-31 2014-01-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유연성 포일 구조를 구비한 ｌｅｄ 조명 조립체
SM200600005A (it) * 2006-02-15 2007-08-22 Idealed.It S R L Unita' luminosa led ad alta potenza, nonche' apparato di illuminazione comprendente tale unita'
KR100764388B1 (ko) * 2006-03-17 2007-10-05 삼성전기주식회사 양극산화 금속기판 모듈
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CN1902757A (zh) 2007-01-24
US20050116235A1 (en) 2005-06-02
EP1692722A2 (en) 2006-08-23
KR20060121261A (ko) 2006-11-28
WO2005062382A3 (en) 2005-12-08

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