JP2017501592A - 発光膜構造体 - Google Patents
発光膜構造体 Download PDFInfo
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- JP2017501592A JP2017501592A JP2016560046A JP2016560046A JP2017501592A JP 2017501592 A JP2017501592 A JP 2017501592A JP 2016560046 A JP2016560046 A JP 2016560046A JP 2016560046 A JP2016560046 A JP 2016560046A JP 2017501592 A JP2017501592 A JP 2017501592A
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- 239000011888 foil Substances 0.000 claims abstract description 73
- 229920000642 polymer Polymers 0.000 claims abstract description 37
- 229920005570 flexible polymer Polymers 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 39
- 239000000758 substrate Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000013013 elastic material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Abstract
Description
- 基板膜100はポリマベースであり、
- 基板膜は薄く(100 mmを下回り)、
- 基板膜は広い表面を有してもよく、
- 導体は、印刷技術を使用して基板膜10上に印刷してもよく、または金属を用いた箔のエッチングを使用してもよく、
- LEDは、パッケージ実装されていない無機LEDチップであり、
- LEDの導体への接続は、接合技術に基づくものであり、
- 製造工程はロールツーロール法を使用し、
- 輝度は、1000 cd/m2を超え、または5000 cd/m2を超えることさえある。
Claims (10)
- 単一の可撓性ポリマ箔(100)と、
素子用電極領域(104)を有し、前記ポリマ箔(100)の第1の側(106)にある層としての可撓性導電パターン層(102)と、
前記ポリマ箔(100)を通って第1の側(106)において第2の側(110)から前記導電パターン層(102)の電極領域(104)まで延伸し、それぞれが少なくとも1つの電極領域(104)に重なっている少なくとも1つの空洞(108)と、
該少なくとも1つの空洞(108)内にあって前記電極領域(104)と電気的に接続された少なくとも1つの非有機発光ダイオードフリップチップ(112)と、
前記ポリマ箔(100)の第2の側(110)に層形成された第1の可撓性遮蔽箔(114)とを含むことを特徴とする可撓性発光膜構造体(10)。 - 請求項1に記載の膜構造体において、前記導電パターン層(102)は、金属化されたポリマ構造体、および少なくとも1つの印刷可能な導電性インクに基づく導体のうちの少なくとも一方を含むことを特徴とする膜構造体。
- 請求項1に記載の膜構造体において、前記膜構造体は、前記少なくとも1つの発光ダイオードチップ(112)と前記電極領域(104)の間に導電性接着剤(116)を含むことを特徴とする膜構造体。
- 請求項1に記載の膜構造体において、前記膜構造体は、前記導電パターン層(102)上に第2の可撓性遮蔽箔(118)を含み、該導電パターン層(102)が前記ポリマ箔(100)と前記第2の遮蔽箔(118)の間にあることを特徴とする膜構造体。
- 請求項1に記載の膜構造体において、第1の遮蔽箔()は、前記少なくとも1つの発光ダイオードチップ(112)上に配置された発光箔(120)を含むことを特徴とする膜構造体。
- 素子用電極領域(104)を有する可撓性導電パターン層(102)をポリマ箔(100)の第1の側(106)に用意(1100)し、
前記ポリマ箔(100)を通って第1の側(106)において第2の側(110)から前記導電パターン層(102)の電極領域(104)まで延伸する少なくとも1つの空洞(108)を形成(1102)し、該空洞は、前記電極領域(104)を露出させて、前記少なくとも1つの空洞(108)を通って第2の側(110)から素子の装着を行なうためのものであり、
少なくとも1つの非有機発光ダイオードフリップチップ(112)のそれぞれを前記少なくとも1つの空洞(108)の空洞に配置(1104)し、
前記少なくとも1つの非有機発光ダイオードフリップチップ(112)を前記露出した電極領域(104)へ電気的に接続(1106)し、
前記ポリマ箔(100)の第2の側(110)に第1の可撓性遮蔽箔(114)を設ける(1108)ことを含むことを特徴とする可撓性発光膜構造体の製造方法。 - 請求項6に記載の方法において、前記導電パターン層(102)は、(1)金属化ポリマ構造体を前記ポリマ箔(100)の第1の側(106)に積層し、該金属化ポリマ構造体をパターン形成することと、(2)前記ポリマ箔(100)の第1の側(106)に少なくとも1つの導電性インクで導体を印刷することのうちの少なくとも一方を備えることを特徴とする方法。
- 請求項6に記載の方法において、前記少なくとも1つの非有機発光ダイオードフリップチップ(112)を前記電極領域(104)に電気的に接続することは、導電性接着剤(116)を前記電極領域(104)に施し、前記少なくとも1つの発光ダイオードチップ(112)を該電極領域(104)に接合することによることを特徴とする方法。
- 請求項6に記載の方法において、第2の可撓性遮蔽箔(118)を前記導電パターン層(102)に積層して、該導電パターン層(102)が前記ポリマ箔(100)と第2の遮蔽箔(118)の間になるようにすることを特徴とする方法。
- 請求項6に記載の方法において、発光箔(120)を前記少なくとも1つの発光ダイオードチップ(112)の上に積層することを特徴とする方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20136284 | 2013-12-18 | ||
FI20136284 | 2013-12-18 | ||
PCT/FI2014/051016 WO2015092140A1 (en) | 2013-12-18 | 2014-12-17 | Illuminating film structure |
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US (1) | US20160315236A1 (ja) |
EP (1) | EP3084290A4 (ja) |
JP (1) | JP2017501592A (ja) |
KR (1) | KR20160100359A (ja) |
CN (1) | CN105980768A (ja) |
CA (1) | CA2934465A1 (ja) |
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DE102016109054A1 (de) * | 2016-05-17 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung und optoelektronische Leuchtvorrichtung |
RU2721447C1 (ru) | 2016-06-21 | 2020-05-19 | Ледфоил Финлэнд Ой | Светодиодные экранные или осветительные средства с гибкой пленочной конструкцией |
EP3264241A1 (en) * | 2016-06-29 | 2018-01-03 | Saint-Gobain Glass France | Lighting laminated glazing with a capacitive touch sensitive device and a light emitting diode and the manufacturing |
DE102017113375A1 (de) | 2017-06-19 | 2018-12-20 | Schreiner Group Gmbh & Co. Kg | Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie |
DE102017113380A1 (de) | 2017-06-19 | 2018-12-20 | Schreiner Group Gmbh & Co. Kg | Folienaufbau mit Erzeugen von sichtbarem Licht mittels LED-Technologie |
FI130299B (en) | 2017-12-28 | 2023-06-09 | Ledfoil Finland Oy | DISPLAY STRUCTURE SUITABLE FOR ICE AND OUTDOOR USE |
CN108354394B (zh) * | 2018-03-29 | 2024-06-04 | 江苏集萃有机光电技术研究所有限公司 | 一种oled照明屏风 |
KR102486207B1 (ko) * | 2021-02-10 | 2023-01-10 | 주식회사 파이헬스케어 | 광원용 기판 및 그 제조방법 |
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- 2014-12-17 CN CN201480075212.4A patent/CN105980768A/zh active Pending
- 2014-12-17 EP EP14872927.0A patent/EP3084290A4/en not_active Withdrawn
- 2014-12-17 WO PCT/FI2014/051016 patent/WO2015092140A1/en active Application Filing
- 2014-12-17 KR KR1020167019308A patent/KR20160100359A/ko not_active Application Discontinuation
- 2014-12-17 US US15/105,462 patent/US20160315236A1/en not_active Abandoned
- 2014-12-17 CA CA2934465A patent/CA2934465A1/en not_active Abandoned
- 2014-12-17 JP JP2016560046A patent/JP2017501592A/ja active Pending
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Also Published As
Publication number | Publication date |
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WO2015092140A1 (en) | 2015-06-25 |
KR20160100359A (ko) | 2016-08-23 |
US20160315236A1 (en) | 2016-10-27 |
CN105980768A (zh) | 2016-09-28 |
EP3084290A4 (en) | 2018-05-02 |
EP3084290A1 (en) | 2016-10-26 |
CA2934465A1 (en) | 2015-06-25 |
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