JP2016525792A - 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ - Google Patents
印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ Download PDFInfo
- Publication number
- JP2016525792A JP2016525792A JP2016524732A JP2016524732A JP2016525792A JP 2016525792 A JP2016525792 A JP 2016525792A JP 2016524732 A JP2016524732 A JP 2016524732A JP 2016524732 A JP2016524732 A JP 2016524732A JP 2016525792 A JP2016525792 A JP 2016525792A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic component
- conductive material
- printed circuit
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
- Electroluminescent Light Sources (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (15)
- 印刷回路基板アセンブリを製造する方法であって、
基板を準備するステップと、
前記基板上に回路パターンを印刷し、これにより未硬化導電材料の底部層及び絶縁材料の上部層を形成するステップと、
少なくとも1つの電気接続部を備える少なくとも1つの電子部品を前記回路パターンの前記上部層上に配置するステップであって、前記少なくとも1つの電子部品の前記少なくとも1つの電気接続部が前記未硬化導電材料を有する前記底部層との少なくとも1つの電気的接続を形成するステップと、
前記少なくとも1つの電子部品を前記上部層上に配置した後に、前記導電材料及び前記絶縁材料を硬化させ、これにより前記導電材料が前記少なくとも1つの電子部品を前記基板に機械的に固定するステップと、
を有する、方法。 - 前記導電材料及び前記絶縁材料が、印刷後に前記底部層及び前記上部層を形成する化合物の一部である、請求項1に記載の方法。
- 前記化合物が懸濁物である、請求項2に記載の方法。
- 前記化合物が前記絶縁材料にコロイドを形成する添加物を有する、請求項2又は請求項3に記載の方法。
- 前記少なくとも1つの電子部品の前記少なくとも1つの電気接続部が、前記底部層の前記導電材料に電気的に接触する金属ピンである、請求項1ないし4の何れか一項に記載の方法。
- 前記化合物が光反射性粒子及び透明な光屈折性粒子の一方を有する、請求項2ないし5の何れか一項に記載の方法。
- 前記底部層と前記上部層との間に反発力が発生され、これにより前記底部層が前記基板に向かって引っ張られる一方、前記上部層が前記基板から押し離される、請求項1ないし6の何れか一項に記載の方法。
- 前記基板が、絶縁膜により被覆された金属板を有する、請求項1ないし7の何れか一項に記載の方法。
- 前記絶縁材料が、アクリレート、ポリウレタン、ポリイミド、メラミン樹脂及びメラミン・ホルムアルデヒドからなる群から選択される、請求項1ないし8の何れか一項に記載の方法。
- 前記未硬化導電材料及び絶縁材料が前記基板上にスクリーン印刷技術を用いて印刷される、請求項1ないし9の何れか一項に記載の方法。
- 前記未硬化導電材料及び絶縁材料が前記基板上にインクジェット印刷技術を用いて印刷される、請求項1ないし8の何れか一項に記載の方法。
- 前記少なくとも1つの電子部品が前記印刷された回路パターン上にピックアンドプレースマシンを用いて配置される、請求項1ないし11の何れか一項に記載の方法。
- 基板と、
印刷された導電材料の底部層及び絶縁材料の上部層と、
前記上部層上に配置された少なくとも1つの電気接続部を備える少なくとも1つの電子部品と、
を有する印刷回路基板アセンブリであって、
前記少なくとも1つの電子部品の前記少なくとも1つの電気接続部が前記導電材料の前記底部層との少なくとも1つの電気的接続を形成し、前記印刷された導電材料が前記少なくとも1つの電子部品を前記基板に機械的に固定している、
印刷回路基板アセンブリ。 - 前記少なくとも1つの電子部品の前記少なくとも1つの電気接続部が、前記底部層の前記導電材料に電気的に接触する金属ピンである、請求項13に記載の印刷回路基板アセンブリ。
- 請求項13又は請求項14に記載の印刷回路基板アセンブリを有する固体照明装置であって、前記少なくとも1つの電子部品が固体発光ダイを有する、固体照明装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13175646.2 | 2013-07-09 | ||
EP13175646 | 2013-07-09 | ||
PCT/EP2014/063708 WO2015003929A1 (en) | 2013-07-09 | 2014-06-27 | Method for manufacturing a printed circuit board assembly based on printed electronics and printed circuit board assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016525792A true JP2016525792A (ja) | 2016-08-25 |
JP2016525792A5 JP2016525792A5 (ja) | 2017-08-03 |
Family
ID=48746378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016524732A Pending JP2016525792A (ja) | 2013-07-09 | 2014-06-27 | 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10257935B2 (ja) |
EP (1) | EP3020258A1 (ja) |
JP (1) | JP2016525792A (ja) |
CN (1) | CN105379432B (ja) |
WO (1) | WO2015003929A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3090609B1 (en) | 2014-01-02 | 2017-06-28 | Philips Lighting Holding B.V. | Method for manufacturing a non-planar printed circuit board assembly |
US11237103B2 (en) | 2018-05-31 | 2022-02-01 | Socovar Sec | Electronic device testing system, electronic device production system including same and method of testing an electronic device |
CN212390187U (zh) * | 2020-05-25 | 2021-01-22 | 漳州立达信光电子科技有限公司 | 一种智能灯 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0927516A (ja) * | 1995-07-12 | 1997-01-28 | Nippondenso Co Ltd | 電子部品の接続構造 |
JPH1197610A (ja) * | 1997-09-25 | 1999-04-09 | Hitachi Ltd | 電子部品の実装方法および電子部品 |
WO2001086716A1 (en) * | 2000-05-12 | 2001-11-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
JP2009129801A (ja) * | 2007-11-27 | 2009-06-11 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1243746B (de) | 1965-05-15 | 1967-07-06 | Telefunken Patent | Verfahren zur Herstellung einer gedruckten Schaltung auf einer Traegerplatte, deren Oberflaeche von einer Ebene abweicht |
US4710419A (en) * | 1984-07-16 | 1987-12-01 | Gregory Vernon C | In-mold process for fabrication of molded plastic printed circuit boards |
JPH0712111B2 (ja) | 1985-09-04 | 1995-02-08 | ユーエフイー・インコーポレイテッド | 電気回路埋設方法及びプラスチック製品 |
JP2747096B2 (ja) | 1990-07-24 | 1998-05-06 | 北川工業株式会社 | 3次元回路基板の製造方法 |
EP0477981A3 (en) | 1990-09-27 | 1992-05-06 | Toshiba Lighting & Technology Corporation | Multi-layer circuit substrate having a non-planar shape, and a method for the manufacture thereof |
US6482289B1 (en) | 1995-10-06 | 2002-11-19 | Motorola, Inc. | Nonconductive laminate for coupling substrates and method therefor |
DE19807202A1 (de) | 1998-02-20 | 1999-08-26 | Zeiss Carl Jena Gmbh | Verfahren und Anordnung zum Kontaktieren von elektronischen Bauelementen |
JP3351410B2 (ja) * | 1999-12-20 | 2002-11-25 | 株式会社村田製作所 | インバータ用コンデンサモジュール、インバータ及びコンデンサモジュール |
TW200821694A (en) * | 2006-11-01 | 2008-05-16 | Au Optronics Corp | Reflective light source device and manufacture method thereof |
JPWO2008136419A1 (ja) * | 2007-04-27 | 2010-07-29 | 日本電気株式会社 | 半導体装置及び製造方法並びにリペア方法 |
US7874065B2 (en) * | 2007-10-31 | 2011-01-25 | Nguyen Vinh T | Process for making a multilayer circuit board |
KR101642521B1 (ko) * | 2007-12-18 | 2016-07-25 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전도성 접착제 전구체, 그 사용 방법, 및 용품 |
TWM339879U (en) | 2008-02-12 | 2008-09-01 | Hsien-Ching Chang | LED solderless promptly assmble and connected structure |
WO2010002156A2 (ko) | 2008-06-30 | 2010-01-07 | Park Chang Soo | 다면다각형상 구현이 용이한 엘이디조명용 인쇄회로기판 |
DE102008042810A1 (de) | 2008-10-14 | 2010-04-15 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mit elektrischen Elementen versehenen Substrats |
KR101608745B1 (ko) | 2009-12-30 | 2016-04-05 | 삼성전자 주식회사 | 인쇄회로기판조립체의 제조방법 |
KR101138542B1 (ko) | 2010-08-09 | 2012-04-25 | 삼성전기주식회사 | 다층 인쇄회로기판의 제조방법 |
US20120175667A1 (en) | 2011-10-03 | 2012-07-12 | Golle Aaron J | Led light disposed on a flexible substrate and connected with a printed 3d conductor |
EP3090609B1 (en) * | 2014-01-02 | 2017-06-28 | Philips Lighting Holding B.V. | Method for manufacturing a non-planar printed circuit board assembly |
-
2014
- 2014-06-27 JP JP2016524732A patent/JP2016525792A/ja active Pending
- 2014-06-27 CN CN201480039279.2A patent/CN105379432B/zh not_active Expired - Fee Related
- 2014-06-27 EP EP14733206.8A patent/EP3020258A1/en not_active Withdrawn
- 2014-06-27 US US14/903,295 patent/US10257935B2/en not_active Expired - Fee Related
- 2014-06-27 WO PCT/EP2014/063708 patent/WO2015003929A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0927516A (ja) * | 1995-07-12 | 1997-01-28 | Nippondenso Co Ltd | 電子部品の接続構造 |
JPH1197610A (ja) * | 1997-09-25 | 1999-04-09 | Hitachi Ltd | 電子部品の実装方法および電子部品 |
WO2001086716A1 (en) * | 2000-05-12 | 2001-11-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
JP2009129801A (ja) * | 2007-11-27 | 2009-06-11 | Denki Kagaku Kogyo Kk | 金属ベース回路基板 |
Also Published As
Publication number | Publication date |
---|---|
EP3020258A1 (en) | 2016-05-18 |
CN105379432B (zh) | 2019-06-07 |
US10257935B2 (en) | 2019-04-09 |
WO2015003929A1 (en) | 2015-01-15 |
US20160150648A1 (en) | 2016-05-26 |
CN105379432A (zh) | 2016-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5857767A (en) | Thermal management system for L.E.D. arrays | |
KR101044200B1 (ko) | 리지드-플렉서블 회로기판 및 그 제조방법 | |
US9648755B2 (en) | Method for manufacturing a non-planar printed circuit board assembly | |
KR100764388B1 (ko) | 양극산화 금속기판 모듈 | |
KR100955451B1 (ko) | 방열 fpcb 및 이의 제조 방법 | |
JP2007220925A (ja) | モジュール基板と液晶表示装置、及び照明装置 | |
JP6604648B1 (ja) | 車両用バスバーケーブル | |
KR20160100359A (ko) | 발광 필름 구조 | |
CN106576433B (zh) | 印刷电路板 | |
JP2016525792A (ja) | 印刷電子装置作製技術に基づいて印刷回路基板アセンブリを製造する方法及び印刷回路基板アセンブリ | |
JP6830583B2 (ja) | 配線部品の製造方法 | |
US20190078740A1 (en) | Led light manufacturing method of dpm style and apparatus thereof | |
WO2018070192A1 (ja) | 電子装置およびその製造方法 | |
TW201820558A (zh) | 用於uv led陣列的包括厚膜層之散熱片及形成uv led陣列之方法 | |
TW201635600A (zh) | Led元件用基板、led構裝模組、及使用該等而得之led顯示裝置 | |
US10797214B2 (en) | Method of manufacturing wiring board, method of manufacturing light emitting device using the wiring board, wiring board, and light emitting device using the wiring board | |
KR101101776B1 (ko) | 발광 장치 및 이의 제조방법 | |
KR101216936B1 (ko) | 발광 다이오드 | |
KR101211719B1 (ko) | 필름 타입의 광소자 패키지 및 그 제조 방법 | |
TW201410083A (zh) | 電路板結構及使用該電路板結構的背光模組 | |
KR101469014B1 (ko) | 방열용 열가소성 플라스틱 기판을 갖는 조명 장치 | |
CN209964358U (zh) | 复合散热型电路板及紫外光固化模组 | |
KR20140115750A (ko) | 회로 기판 및 이의 제조 방법 | |
GB2510865A (en) | Method for manufacturing a lighting unit and lighting unit | |
US20160336499A1 (en) | Electronic device and method of making the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20160912 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170626 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170626 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180614 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180704 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190219 |