JP2007512714A - 低いループ高さのボールボンディング方法およびその装置 - Google Patents

低いループ高さのボールボンディング方法およびその装置 Download PDF

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Publication number
JP2007512714A
JP2007512714A JP2006541443A JP2006541443A JP2007512714A JP 2007512714 A JP2007512714 A JP 2007512714A JP 2006541443 A JP2006541443 A JP 2006541443A JP 2006541443 A JP2006541443 A JP 2006541443A JP 2007512714 A JP2007512714 A JP 2007512714A
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wire
bond
capillary
ball
site
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JP2007512714A5 (https=
Inventor
キン，アイヴィー，ダブリュー．
ワイズ，ロバート
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キューリック アンド ソファ インダストリーズ， インコーポレイテッド
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Publication of JP2007512714A publication Critical patent/JP2007512714A/ja
Publication of JP2007512714A5 publication Critical patent/JP2007512714A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2006541443A 2003-11-26 2004-11-24 低いループ高さのボールボンディング方法およびその装置 Pending JP2007512714A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52530503P 2003-11-26 2003-11-26
US10/988,053 US7347352B2 (en) 2003-11-26 2004-11-12 Low loop height ball bonding method and apparatus
PCT/US2004/039676 WO2005055282A2 (en) 2003-11-26 2004-11-24 Low loop height ball bonding method and apparatus

Publications (2)

Publication Number Publication Date
JP2007512714A true JP2007512714A (ja) 2007-05-17
JP2007512714A5 JP2007512714A5 (https=) 2008-01-24

Family

ID=34595261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006541443A Pending JP2007512714A (ja) 2003-11-26 2004-11-24 低いループ高さのボールボンディング方法およびその装置

Country Status (5)

Country Link
US (2) US7347352B2 (https=)
JP (1) JP2007512714A (https=)
SG (1) SG123792A1 (https=)
TW (1) TWI367533B (https=)
WO (1) WO2005055282A2 (https=)

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US10221396B2 (en) 2009-06-05 2019-03-05 FUJIFILM Cellular Dynamics, Inc. Reprogramming T cells and hematopoietic cells

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US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
DE102006011352A1 (de) * 2005-03-23 2006-10-05 Unaxis International Trading Ltd. Verfahren zur Herstellung einer Drahtverbindung
US8016182B2 (en) * 2005-05-10 2011-09-13 Kaijo Corporation Wire loop, semiconductor device having same and wire bonding method
WO2007012187A1 (en) * 2005-07-26 2007-02-01 Microbonds Inc. System and method for assembling packaged integrated circuits using insulated wire bond
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
WO2007134317A1 (en) * 2006-05-15 2007-11-22 Texas Instruments Incorporated Downhill wire bonding for semiconductor device
US20080286959A1 (en) * 2007-05-14 2008-11-20 Texas Instruments Incorporated Downhill Wire Bonding for QFN L - Lead
US20100186991A1 (en) * 2006-10-18 2010-07-29 Kulicke And Soffa Industries, Inc. conductive bumps, wire loops including the improved conductive bumps, and methods of forming the same
JP5481769B2 (ja) * 2006-11-22 2014-04-23 日亜化学工業株式会社 半導体装置及びその製造方法
US8637394B2 (en) * 2007-07-05 2014-01-28 Stats Chippac Ltd. Integrated circuit package system with flex bump
CN101971313B (zh) * 2008-01-30 2013-07-24 库力索法工业公司 导线环以及形成导线环的方法
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4344002B1 (ja) 2008-10-27 2009-10-14 株式会社新川 ワイヤボンディング方法
JP5062283B2 (ja) * 2009-04-30 2012-10-31 日亜化学工業株式会社 半導体装置及びその製造方法
DE102009029040A1 (de) * 2009-08-31 2011-03-03 Robert Bosch Gmbh Vorrichtung und Verfahren zur Herstellung einer Vorrichtung
JP2012004464A (ja) * 2010-06-18 2012-01-05 Toshiba Corp 半導体装置、半導体装置の製造方法及び半導体装置の製造装置
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US20120032354A1 (en) * 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
CN102412167B (zh) 2010-09-25 2016-02-03 飞思卡尔半导体公司 用于线接合的固定
CN102487025B (zh) 2010-12-08 2016-07-06 飞思卡尔半导体公司 用于长结合导线的支撑体
US8609525B2 (en) * 2011-03-21 2013-12-17 Stats Chippac Ltd. Integrated circuit packaging system with interconnects and method of manufacture thereof
MY181180A (en) * 2011-09-09 2020-12-21 Carsem M Sdn Bhd Low loop wire bonding
TWI543284B (zh) * 2014-02-10 2016-07-21 新川股份有限公司 半導體裝置的製造方法以及打線裝置
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
JP7679289B2 (ja) * 2020-12-23 2025-05-19 スカイワークス ソリューションズ，インコーポレイテッド ツールマークなしのステッチボンディングのための装置および方法

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JPH0951011A (ja) * 1995-08-10 1997-02-18 Tanaka Denshi Kogyo Kk 半導体チップのワイヤボンディング方法
JP2004172477A (ja) * 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP2004289153A (ja) * 2003-03-24 2004-10-14 Texas Instr Inc <Ti> 半導体パッケージ用のワイヤボンディング
JP2005019778A (ja) * 2003-06-27 2005-01-20 Shinkawa Ltd ワイヤボンディング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10221396B2 (en) 2009-06-05 2019-03-05 FUJIFILM Cellular Dynamics, Inc. Reprogramming T cells and hematopoietic cells

Also Published As

Publication number Publication date
TWI367533B (en) 2012-07-01
US7347352B2 (en) 2008-03-25
WO2005055282A2 (en) 2005-06-16
US20050109819A1 (en) 2005-05-26
US20080111252A1 (en) 2008-05-15
SG123792A1 (en) 2006-07-26
TW200524068A (en) 2005-07-16
US7584881B2 (en) 2009-09-08
WO2005055282A3 (en) 2006-02-09

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