KR20060053871A - 와이어본딩 방법 - Google Patents
와이어본딩 방법 Download PDFInfo
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- KR20060053871A KR20060053871A KR20050065072A KR20050065072A KR20060053871A KR 20060053871 A KR20060053871 A KR 20060053871A KR 20050065072 A KR20050065072 A KR 20050065072A KR 20050065072 A KR20050065072 A KR 20050065072A KR 20060053871 A KR20060053871 A KR 20060053871A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- Wire Bonding (AREA)
Abstract
Description
Claims (5)
- 제 1 본드점인 다이의 패드에 제 1 본딩을 행한 후, 제 2 본드점인 배선상에 제 2 본딩을 행하고, 상기 패드와 상기 배선 사이를 와이어로 접속하는 와이어본딩 방법에 있어서, 상기 제 1 본딩 공정전에 이 제 1 본딩 공정 직전의 제 2 본딩 공정에서의 와이어 절단 공정에 의해, 캐필러리의 선단부로부터 돌출한 와이어를 횡방향으로 구부려서 굽힘부를 형성하고, 상기 제 1 본딩 공정은, 상기 굽힘부를 패드에 본딩하고 하부 제 1 본딩부를 형성하는 공정과, 캐필러리를 상승 및 상기 배선측으로 이동시키고, 그 후 캐필러리를 하강시켜 와이어를 상기 하부 제 1 본딩부상에 겹쳐서 접속하고 상부 제 1 본딩부를 형성하는 공정으로 이루어지는 것을 특징으로 하는 와이어본딩 방법.
- 제 1 항에 있어서, 제 1 본드점인 다이의 패드에 제 1 본딩을 행한 후, 제 2 본드점인 배선상에 제 2 본딩을 행하고, 상기 패드와 상기 배선 사이를 와이어로 접속하는 와이어본딩 방법에 있어서, 상기 배선상에 미리 범프를 형성하고, 이 범프형성 공정에서의 와이어 절단 공정에 의해, 캐필러리의 선단부로부터 돌출한 와이어를 횡방향으로 구부려서 굽힘부를 형성하고, 그 후 상기 굽힘부를 상기 패드에 본딩하여 상기 제 1 본딩 공정을 행하는 것을 특징으로 하는 와이어본딩 방법.
- 제 2 항에 있어서, 상기 제 1 본딩 공정은, 상기 굽힘부를 패드에 본딩하여 하부 제 1 본딩부를 형성하는 공정과, 캐필러리를 상승 및 상기 배선측으로 이동시키고, 그 후 캐필러리를 하강시키고 와이어를 상기 하부 제 1 본딩부상에 겹쳐 접속하여 상부 제 1 본딩부를 형성하는 공정으로 이루어지는 것을 특징으로 하는 와이어본딩 방법.
- 제 1 항에 있어서, 상기 제 2 본딩 공정에서의 와이어 절단 공정은, 클램퍼로 와이어를 클램핑 하고, 다음에 본딩할 패드와 배선을 연결하는 방향에 평행하고, 또한 패드측 또는 배선측으로 캐필러리를 이동시켜서 와이어를 절단하여 상기 굽힘부를 형성하는 것을 특징으로 하는 와이어본딩 방법.
- 제 2 항에 있어서, 상기 범프형성 공정에서의 와이어 절단 공정은, 클램퍼로 와이어를 클램핑 하고, 다음에 본딩할 패드와 배선을 연결하는 방향에 평행하고, 또한 패드측 또는 배선측으로 캐필러리를 이동시켜서 와이어를 절단하여 상기 굽힘부를 형성하는 것을 특징으로 하는 와이어본딩 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004236405A JP4215693B2 (ja) | 2004-08-16 | 2004-08-16 | ワイヤボンディング方法 |
JPJP-P-2004-00236405 | 2004-08-16 |
Publications (2)
Publication Number | Publication Date |
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KR20060053871A true KR20060053871A (ko) | 2006-05-22 |
KR100660821B1 KR100660821B1 (ko) | 2006-12-26 |
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Application Number | Title | Priority Date | Filing Date |
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KR20050065072A KR100660821B1 (ko) | 2004-08-16 | 2005-07-19 | 와이어본딩 방법 |
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Country | Link |
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JP (1) | JP4215693B2 (ko) |
KR (1) | KR100660821B1 (ko) |
TW (1) | TW200608501A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CH697970B1 (de) * | 2006-03-30 | 2009-04-15 | Oerlikon Assembly Equipment Ag | Verfahren zur Herstellung einer Wedge Wedge Drahtbrücke. |
TWI543284B (zh) * | 2014-02-10 | 2016-07-21 | 新川股份有限公司 | 半導體裝置的製造方法以及打線裝置 |
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2004
- 2004-08-16 JP JP2004236405A patent/JP4215693B2/ja not_active Expired - Fee Related
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2005
- 2005-06-30 TW TW094122130A patent/TW200608501A/zh not_active IP Right Cessation
- 2005-07-19 KR KR20050065072A patent/KR100660821B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP4215693B2 (ja) | 2009-01-28 |
KR100660821B1 (ko) | 2006-12-26 |
TW200608501A (en) | 2006-03-01 |
TWI366240B (ko) | 2012-06-11 |
JP2006054383A (ja) | 2006-02-23 |
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