TWI367533B - Low loop height ball bonding method and apparatus - Google Patents

Low loop height ball bonding method and apparatus

Info

Publication number
TWI367533B
TWI367533B TW093136568A TW93136568A TWI367533B TW I367533 B TWI367533 B TW I367533B TW 093136568 A TW093136568 A TW 093136568A TW 93136568 A TW93136568 A TW 93136568A TW I367533 B TWI367533 B TW I367533B
Authority
TW
Taiwan
Prior art keywords
bonding method
ball bonding
loop height
low loop
height ball
Prior art date
Application number
TW093136568A
Other languages
English (en)
Chinese (zh)
Other versions
TW200524068A (en
Inventor
Ivy W Qin
Robert Wise
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of TW200524068A publication Critical patent/TW200524068A/zh
Application granted granted Critical
Publication of TWI367533B publication Critical patent/TWI367533B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW093136568A 2003-11-26 2004-11-26 Low loop height ball bonding method and apparatus TWI367533B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52530503P 2003-11-26 2003-11-26
US10/988,053 US7347352B2 (en) 2003-11-26 2004-11-12 Low loop height ball bonding method and apparatus

Publications (2)

Publication Number Publication Date
TW200524068A TW200524068A (en) 2005-07-16
TWI367533B true TWI367533B (en) 2012-07-01

Family

ID=34595261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136568A TWI367533B (en) 2003-11-26 2004-11-26 Low loop height ball bonding method and apparatus

Country Status (5)

Country Link
US (2) US7347352B2 (https=)
JP (1) JP2007512714A (https=)
SG (1) SG123792A1 (https=)
TW (1) TWI367533B (https=)
WO (1) WO2005055282A2 (https=)

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US7229906B2 (en) 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
DE102006011352A1 (de) * 2005-03-23 2006-10-05 Unaxis International Trading Ltd. Verfahren zur Herstellung einer Drahtverbindung
US8016182B2 (en) * 2005-05-10 2011-09-13 Kaijo Corporation Wire loop, semiconductor device having same and wire bonding method
WO2007012187A1 (en) * 2005-07-26 2007-02-01 Microbonds Inc. System and method for assembling packaged integrated circuits using insulated wire bond
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
WO2007134317A1 (en) * 2006-05-15 2007-11-22 Texas Instruments Incorporated Downhill wire bonding for semiconductor device
US20080286959A1 (en) * 2007-05-14 2008-11-20 Texas Instruments Incorporated Downhill Wire Bonding for QFN L - Lead
US20100186991A1 (en) * 2006-10-18 2010-07-29 Kulicke And Soffa Industries, Inc. conductive bumps, wire loops including the improved conductive bumps, and methods of forming the same
JP5481769B2 (ja) * 2006-11-22 2014-04-23 日亜化学工業株式会社 半導体装置及びその製造方法
US8637394B2 (en) * 2007-07-05 2014-01-28 Stats Chippac Ltd. Integrated circuit package system with flex bump
CN101971313B (zh) * 2008-01-30 2013-07-24 库力索法工业公司 导线环以及形成导线环的方法
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4344002B1 (ja) 2008-10-27 2009-10-14 株式会社新川 ワイヤボンディング方法
JP5062283B2 (ja) * 2009-04-30 2012-10-31 日亜化学工業株式会社 半導体装置及びその製造方法
DK2438160T3 (en) 2009-06-05 2016-01-11 Cellular Dynamics Int Inc Reprogramming of T cells and hematopoietic cells
DE102009029040A1 (de) * 2009-08-31 2011-03-03 Robert Bosch Gmbh Vorrichtung und Verfahren zur Herstellung einer Vorrichtung
JP2012004464A (ja) * 2010-06-18 2012-01-05 Toshiba Corp 半導体装置、半導体装置の製造方法及び半導体装置の製造装置
US7918378B1 (en) 2010-08-06 2011-04-05 National Semiconductor Corporation Wire bonding deflector for a wire bonder
US20120032354A1 (en) * 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
CN102412167B (zh) 2010-09-25 2016-02-03 飞思卡尔半导体公司 用于线接合的固定
CN102487025B (zh) 2010-12-08 2016-07-06 飞思卡尔半导体公司 用于长结合导线的支撑体
US8609525B2 (en) * 2011-03-21 2013-12-17 Stats Chippac Ltd. Integrated circuit packaging system with interconnects and method of manufacture thereof
MY181180A (en) * 2011-09-09 2020-12-21 Carsem M Sdn Bhd Low loop wire bonding
TWI543284B (zh) * 2014-02-10 2016-07-21 新川股份有限公司 半導體裝置的製造方法以及打線裝置
US12057431B2 (en) * 2020-12-18 2024-08-06 Kulicke And Soffa Industries, Inc. Methods of forming wire interconnect structures and related wire bonding tools
JP7679289B2 (ja) * 2020-12-23 2025-05-19 スカイワークス ソリューションズ，インコーポレイテッド ツールマークなしのステッチボンディングのための装置および方法

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US4437604A (en) 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
US4824005A (en) 1986-08-13 1989-04-25 Orthodyne Electronics Corporation Dual mode ultrasonic generator in a wire bonding apparatus
JPH04273135A (ja) 1991-02-27 1992-09-29 Shinkawa Ltd ワイヤボンデイング方法
US5111989A (en) * 1991-09-26 1992-05-12 Kulicke And Soffa Investments, Inc. Method of making low profile fine wire interconnections
JP3152764B2 (ja) 1992-10-21 2001-04-03 株式会社東芝 ワイヤボンダ−
US5421503A (en) * 1994-08-24 1995-06-06 Kulicke And Soffa Investments, Inc. Fine pitch capillary bonding tool
US5842628A (en) * 1995-04-10 1998-12-01 Fujitsu Limited Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
JPH0951011A (ja) 1995-08-10 1997-02-18 Tanaka Denshi Kogyo Kk 半導体チップのワイヤボンディング方法
JP3370539B2 (ja) 1997-01-13 2003-01-27 株式会社新川 ワイヤボンディング方法
JP3413340B2 (ja) 1997-03-17 2003-06-03 株式会社新川 ワイヤボンディング方法
JP3455092B2 (ja) * 1997-10-27 2003-10-06 株式会社新川 半導体装置及びワイヤボンディング方法
JP2000082717A (ja) * 1998-09-07 2000-03-21 Shinkawa Ltd ワイヤボンディング方法
JP3522123B2 (ja) * 1998-09-30 2004-04-26 株式会社新川 ワイヤボンディング方法
JP2000114304A (ja) * 1998-10-08 2000-04-21 Shinkawa Ltd ワイヤボンディング方法
JP2000174054A (ja) 1998-12-04 2000-06-23 Kaijo Corp ワイヤボンダ用ボール形成装置
JP3457196B2 (ja) 1998-12-22 2003-10-14 株式会社カイジョー ボールボンディング方法
JP3932235B2 (ja) 1999-02-25 2007-06-20 株式会社カイジョー ワイヤボンダ用ボール形成装置及びその方法
JP3913134B2 (ja) 2002-08-08 2007-05-09 株式会社カイジョー バンプの形成方法及びバンプ
JP2003100793A (ja) 2001-09-25 2003-04-04 Kaijo Corp ワイヤボンディング方法
JP3765778B2 (ja) 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
US7229906B2 (en) 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
JP2004172477A (ja) 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
JP4021378B2 (ja) * 2003-06-27 2007-12-12 株式会社新川 ワイヤボンディング方法
US7494042B2 (en) * 2003-10-02 2009-02-24 Asm Technology Singapore Pte. Ltd. Method of forming low wire loops and wire loops formed using the method
US20060011710A1 (en) * 2004-07-13 2006-01-19 Asm Technology Singapore Pte Ltd Formation of a wire bond with enhanced pull
US7188759B2 (en) * 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
JP4298665B2 (ja) * 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法

Also Published As

Publication number Publication date
US7347352B2 (en) 2008-03-25
WO2005055282A2 (en) 2005-06-16
US20050109819A1 (en) 2005-05-26
US20080111252A1 (en) 2008-05-15
SG123792A1 (en) 2006-07-26
JP2007512714A (ja) 2007-05-17
TW200524068A (en) 2005-07-16
US7584881B2 (en) 2009-09-08
WO2005055282A3 (en) 2006-02-09

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