AU2003235633A8 - Bonding device and method for production thereof - Google Patents
Bonding device and method for production thereofInfo
- Publication number
- AU2003235633A8 AU2003235633A8 AU2003235633A AU2003235633A AU2003235633A8 AU 2003235633 A8 AU2003235633 A8 AU 2003235633A8 AU 2003235633 A AU2003235633 A AU 2003235633A AU 2003235633 A AU2003235633 A AU 2003235633A AU 2003235633 A8 AU2003235633 A8 AU 2003235633A8
- Authority
- AU
- Australia
- Prior art keywords
- production
- bonding device
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/701—Organic molecular electronic devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/761—Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/95053—Bonding environment
- H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
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- H—ELECTRICITY
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95121—Active alignment, i.e. by apparatus steering
- H01L2224/95122—Active alignment, i.e. by apparatus steering by applying vibration
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- H—ELECTRICITY
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95147—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium by molecular lock-key, e.g. by DNA
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/211—Fullerenes, e.g. C60
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10201881.2 | 2002-01-18 | ||
DE10201881 | 2002-01-18 | ||
DE10238587.4 | 2002-08-22 | ||
DE10238587A DE10238587B4 (en) | 2002-01-18 | 2002-08-22 | Method for producing a composite device |
PCT/EP2003/000359 WO2003060995A2 (en) | 2002-01-18 | 2003-01-15 | Bonding device and method for production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003235633A1 AU2003235633A1 (en) | 2003-07-30 |
AU2003235633A8 true AU2003235633A8 (en) | 2003-07-30 |
Family
ID=26010940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003235633A Abandoned AU2003235633A1 (en) | 2002-01-18 | 2003-01-15 | Bonding device and method for production thereof |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1464080B1 (en) |
AU (1) | AU2003235633A1 (en) |
DE (1) | DE50308112D1 (en) |
WO (1) | WO2003060995A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7504331B2 (en) | 2005-07-27 | 2009-03-17 | Palo Alto Research Center Incorporated | Method of fabricating self-assembled electrical interconnections |
US7525194B2 (en) | 2005-07-27 | 2009-04-28 | Palo Alto Research Center Incorporated | System including self-assembled interconnections |
US7662708B2 (en) * | 2005-07-27 | 2010-02-16 | Palo Alto Research Center Incorporated | Self-assembled interconnection particles |
TWI500126B (en) * | 2013-01-02 | 2015-09-11 | Au Optronics Corp | Method of packaging driving device of display device and package structure of driving device of display device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5075253A (en) * | 1989-04-12 | 1991-12-24 | Advanced Micro Devices, Inc. | Method of coplanar integration of semiconductor IC devices |
DE3924454A1 (en) * | 1989-07-24 | 1991-02-07 | Cornelis P Prof Dr Hollenberg | THE APPLICATION OF DNA AND DNA TECHNOLOGY FOR THE CONSTRUCTION OF NETWORKS FOR USE IN CHIP CONSTRUCTION AND CHIP PRODUCTION (DNA CHIPS) |
US6652808B1 (en) * | 1991-11-07 | 2003-11-25 | Nanotronics, Inc. | Methods for the electronic assembly and fabrication of devices |
US5545291A (en) * | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
US5997861A (en) * | 1994-10-31 | 1999-12-07 | Burstein Laboratories, Inc. | Antiviral supramolecules containing target-binding molecules and therapeutic molecules bound to spectrin |
US6265021B1 (en) * | 1998-07-31 | 2001-07-24 | International Business Machines Corporation | Nanoparticle structures utilizing synthetic DNA lattices |
WO2001095375A1 (en) * | 2000-06-06 | 2001-12-13 | The Penn State Research Foundation | An electro-fluidic assembly process for integration of electronic devices onto a substrate |
US6291266B1 (en) * | 2000-11-29 | 2001-09-18 | Hrl Laboratories, Llc | Method for fabricating large area flexible electronics |
US6974604B2 (en) * | 2001-09-28 | 2005-12-13 | Hrl Laboratories, Llc | Method of self-latching for adhesion during self-assembly of electronic or optical components |
-
2003
- 2003-01-15 DE DE50308112T patent/DE50308112D1/en not_active Expired - Lifetime
- 2003-01-15 WO PCT/EP2003/000359 patent/WO2003060995A2/en active IP Right Grant
- 2003-01-15 EP EP03729462A patent/EP1464080B1/en not_active Expired - Fee Related
- 2003-01-15 AU AU2003235633A patent/AU2003235633A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1464080B1 (en) | 2007-09-05 |
DE50308112D1 (en) | 2007-10-18 |
AU2003235633A1 (en) | 2003-07-30 |
WO2003060995A2 (en) | 2003-07-24 |
WO2003060995A3 (en) | 2004-03-04 |
EP1464080A2 (en) | 2004-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |