TWI373078B - Bonding method and apparatus - Google Patents

Bonding method and apparatus

Info

Publication number
TWI373078B
TWI373078B TW093133160A TW93133160A TWI373078B TW I373078 B TWI373078 B TW I373078B TW 093133160 A TW093133160 A TW 093133160A TW 93133160 A TW93133160 A TW 93133160A TW I373078 B TWI373078 B TW I373078B
Authority
TW
Taiwan
Prior art keywords
bonding method
bonding
Prior art date
Application number
TW093133160A
Other languages
Chinese (zh)
Other versions
TW200522238A (en
Inventor
Shigetaka Kobayashi
Hiroshi Otsuka
Akira Yamauchi
Shigeto Koike
Kenji Hamakawa
Original Assignee
Cmo Japan Co Ltd
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cmo Japan Co Ltd, Toray Eng Co Ltd filed Critical Cmo Japan Co Ltd
Publication of TW200522238A publication Critical patent/TW200522238A/en
Application granted granted Critical
Publication of TWI373078B publication Critical patent/TWI373078B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
TW093133160A 2003-11-07 2004-11-01 Bonding method and apparatus TWI373078B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003378048A JP4001341B2 (en) 2003-11-07 2003-11-07 Bonding method and apparatus

Publications (2)

Publication Number Publication Date
TW200522238A TW200522238A (en) 2005-07-01
TWI373078B true TWI373078B (en) 2012-09-21

Family

ID=34688561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133160A TWI373078B (en) 2003-11-07 2004-11-01 Bonding method and apparatus

Country Status (4)

Country Link
JP (1) JP4001341B2 (en)
KR (1) KR101189290B1 (en)
CN (1) CN100426479C (en)
TW (1) TWI373078B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4687273B2 (en) * 2005-06-23 2011-05-25 住友電気工業株式会社 Electronic component mounting method
JP4872291B2 (en) * 2005-09-27 2012-02-08 住友電気工業株式会社 Electrode connection method, electrode connection device, and method for manufacturing wiring board assembly
KR100691810B1 (en) 2006-02-17 2007-03-12 주식회사 나래나노텍 Improved bonding apparatus of pattern electrodes
KR100734422B1 (en) * 2006-03-08 2007-07-03 삼성전자주식회사 Bdnding apparatus for lcd
WO2009147828A1 (en) * 2008-06-05 2009-12-10 住友ベークライト株式会社 Manufacturing method for semiconductor device and semiconductor device
KR20110076876A (en) * 2008-10-31 2011-07-06 도레이 카부시키가이샤 Method and apparatus for bonding electronic component and flexible film substrate
KR101119541B1 (en) * 2009-11-30 2012-02-22 (주)멜파스 Apparatus of compressing for acf bonding and method of the same
JP2011199184A (en) * 2010-03-23 2011-10-06 Fujifilm Corp Substrate mounting device and substrate mounting method
JP6202088B2 (en) * 2013-03-15 2017-09-27 株式会社ニコン Biochip fixing device and biochip fixing method
TWI692044B (en) 2017-05-29 2020-04-21 日商新川股份有限公司 Packaging device and method for manufacturing semiconductor device
WO2018232711A1 (en) * 2017-06-22 2018-12-27 深圳市柔宇科技有限公司 Bearing apparatus and lamination device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444918A (en) * 1987-08-13 1989-02-17 Konishiroku Photo Ind Production of liquid crystal display device
JPH07130795A (en) * 1993-11-04 1995-05-19 Matsushita Electric Ind Co Ltd Semiconductor element connecting method and apparatus therefor
JPH09297318A (en) * 1996-03-06 1997-11-18 Seiko Epson Corp Liquid crystal device, production of liquid crystal device and electronic apparatus
JP3815149B2 (en) * 1999-11-04 2006-08-30 セイコーエプソン株式会社 Component mounting method and electro-optical device manufacturing method
JP2003303851A (en) * 2002-02-05 2003-10-24 Toray Eng Co Ltd Chip mounting method and apparatus using the same
JP3949031B2 (en) * 2002-02-05 2007-07-25 東レエンジニアリング株式会社 Chip mounting method

Also Published As

Publication number Publication date
CN100426479C (en) 2008-10-15
TW200522238A (en) 2005-07-01
KR101189290B1 (en) 2012-10-15
JP2005142397A (en) 2005-06-02
CN1614760A (en) 2005-05-11
KR20050044257A (en) 2005-05-12
JP4001341B2 (en) 2007-10-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees