JPS6444918A - Production of liquid crystal display device - Google Patents
Production of liquid crystal display deviceInfo
- Publication number
- JPS6444918A JPS6444918A JP20272087A JP20272087A JPS6444918A JP S6444918 A JPS6444918 A JP S6444918A JP 20272087 A JP20272087 A JP 20272087A JP 20272087 A JP20272087 A JP 20272087A JP S6444918 A JPS6444918 A JP S6444918A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- liquid crystal
- production
- substrate
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To prevent the breaking of a semiconductor element during the process of production by die-bonding the semiconductor element onto a substrate having wiring patterns after injection of a liquid crystal and connecting the same by wire bonding. CONSTITUTION:The liquid crystal 21 is injected between at least two sheets of the substrates 3 and 11 and thereafter, the semiconductor element 8 is die- bonded onto at least a sheet of the substrate 3 of the substrates 3, 11 having the wiring patterns 5 under local heating. The semiconductor element 8 and the wiring patterns 5 of the substrate 3 are then connected by the wire bonding. Since the semiconductor element 8 is packaged on the substrate 3 in the final stage of the production process in such a manner, the possibility of the breaking of the semiconductor element 8 during the process of the production is eliminated and since the semiconductor element 8 is packaged by the local heating, no adverse influences are exerted to the liquid crystal 12.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20272087A JPS6444918A (en) | 1987-08-13 | 1987-08-13 | Production of liquid crystal display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20272087A JPS6444918A (en) | 1987-08-13 | 1987-08-13 | Production of liquid crystal display device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6444918A true JPS6444918A (en) | 1989-02-17 |
Family
ID=16462044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20272087A Pending JPS6444918A (en) | 1987-08-13 | 1987-08-13 | Production of liquid crystal display device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6444918A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05210105A (en) * | 1992-01-20 | 1993-08-20 | Nec Corp | Active matrix substrate and production of liquid crystal display device by using the same |
US6876422B2 (en) * | 2000-12-22 | 2005-04-05 | Fujitsu Display Technologies Corporation | Liquid-crystal display unit having a third board having at least one of a signal-line drive circuit and a scanning-line drive circuit |
CN100426479C (en) * | 2003-11-07 | 2008-10-15 | 日本Cmo株式会社 | Bonding method and apparatus |
-
1987
- 1987-08-13 JP JP20272087A patent/JPS6444918A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05210105A (en) * | 1992-01-20 | 1993-08-20 | Nec Corp | Active matrix substrate and production of liquid crystal display device by using the same |
US6876422B2 (en) * | 2000-12-22 | 2005-04-05 | Fujitsu Display Technologies Corporation | Liquid-crystal display unit having a third board having at least one of a signal-line drive circuit and a scanning-line drive circuit |
CN100426479C (en) * | 2003-11-07 | 2008-10-15 | 日本Cmo株式会社 | Bonding method and apparatus |
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