JPS6448027A - Structure for packing liquid crystal panel - Google Patents

Structure for packing liquid crystal panel

Info

Publication number
JPS6448027A
JPS6448027A JP20559887A JP20559887A JPS6448027A JP S6448027 A JPS6448027 A JP S6448027A JP 20559887 A JP20559887 A JP 20559887A JP 20559887 A JP20559887 A JP 20559887A JP S6448027 A JPS6448027 A JP S6448027A
Authority
JP
Japan
Prior art keywords
panel
liquid crystal
substrate
fixing
gold wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20559887A
Other languages
Japanese (ja)
Inventor
Mikio Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP20559887A priority Critical patent/JPS6448027A/en
Publication of JPS6448027A publication Critical patent/JPS6448027A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

PURPOSE:To ensure fixing and to improve the reliability of connected parts by adopting the constitution consisting in adhering and fixing a liquid crystal to the spot faced part in the central part of a panel substrate and subjecting the respective signal input/output terminals of the substrate and the panel to wire bonding. CONSTITUTION:The liquid crystal panel 9 consisting of glass substrates 2, 3 is fitted to the spot facing 8 formed in the central part of the panel circuit board 1. The signal input/output terminals 10 of the panel 9 and the terminals 11 of the substrate 1 are connected at nearly the same height by gold wires 4. Since the gold wires 4 and the circumference of the circuit on the panel 9 are covered by a resin mold 5, the fixing of the panel is ensured and since excess force are not exerted to the connected parts, the stresses of the gold wires are minimized. The reliability of the connected parts is thus improved.
JP20559887A 1987-08-19 1987-08-19 Structure for packing liquid crystal panel Pending JPS6448027A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20559887A JPS6448027A (en) 1987-08-19 1987-08-19 Structure for packing liquid crystal panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20559887A JPS6448027A (en) 1987-08-19 1987-08-19 Structure for packing liquid crystal panel

Publications (1)

Publication Number Publication Date
JPS6448027A true JPS6448027A (en) 1989-02-22

Family

ID=16509527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20559887A Pending JPS6448027A (en) 1987-08-19 1987-08-19 Structure for packing liquid crystal panel

Country Status (1)

Country Link
JP (1) JPS6448027A (en)

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